Part A
10AX048H2F34E2SG
Altera
- Lifecycle
- Active
- Stock
- 4660 Stückzahl
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 10AX048H2F34E2SG and 10AX016C3U19E2SG are not functionally interchangeable. The 10AX048H2F34E2SG offers significantly higher logic density, a larger package with more I/O, and a faster speed grade, while the 10AX016C3U19E2SG provides lower density and a smaller footprint. These differences in logic capacity, package, I/O count, and speed grade prevent direct substitution without a complete redesign.
Different logic density
Different package type
Different I/O count
Different speed grade
Parts at a glance
Part B
10AX016C3U19E2SG
Intel
- Lifecycle
- Active
- Stock
- 2825 Stückzahl
- Package
- BFBGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10AX048H2F34E2SG | 10AX016C3U19E2SG | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 480,000 | 160,000 | Logic capacity determines the maximum complexity of designs the FPGA can implement; a large mismatch prevents direct substitution. |
| Total RAM (Mbits) | 28.0 | 9.8 | On-chip memory limits buffering, FIFO depth, and data storage; insufficient RAM can block a design from fitting. |
| DSP Blocks (18x19 MAC) | 1,368 | 312 | DSP resources determine signal-processing throughput; fewer blocks reduce arithmetic performance for DSP-heavy applications. |
| Package | FBGA-1152 (F34) | UBGA-484 (U19) | Package footprint and ball count must match the PCB layout; different packages are not drop-in compatible. |
| User I/O Count | 492 | 240 | I/O count limits the number of external interfaces and peripherals that can be connected. |
| Transceiver Count | 36 | 12 | High-speed serial transceivers enable protocols like PCIe and Ethernet; fewer channels restrict connectivity options. |
| Speed Grade | 2 (H2) | 3 (C3) | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet performance targets. |
| Operating Temperature Range | 0°C to 100°C (E2) | 0°C to 100°C (E2) | Temperature grade must match the application environment; industrial or extended ranges are required for harsh conditions. |
| Family / Series | Arria 10 GX | Arria 10 GX | Same family ensures toolchain and IP compatibility, but density and package differences still prevent direct substitution. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10AX048H2F34E2SG | 10AX016C3U19E2SG |
|---|---|---|
| Supplier | - | Intel |
| Series | Arria 10 GX | Arria 10 GX |
| Part Status | Active | Active |
| Number of LABs/CLBs | - | 61510 |
| Number of Logic Elements/Cells | - | 160000 |
| Total RAM Bits | 5664768 | 10086400 |
| Number of I/O | 492 | 240 |
| Voltage - Supply | 0.87V ~ 0.98V | 0.87V ~ 0.98V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
| Digi Key Programmable | Not Verified | - |
| Number of LA Bs / CL Bs | 183590 | - |
| Number of Logic Elements / Cells | 480000 | - |
| Packaging | Tray | - |
Frequently asked questions
What are the key differences between the 10AX048H2F34E2SG and the 10AX016C3U19E2SG?
The 10AX048H2F34E2SG is an Intel Arria 10 GX FPGA with 480,000 logic elements in a 1152-pin FBGA package, while the 10AX016C3U19E2SG is an Arria 10 GX FPGA with 160,000 logic elements in a 484-pin UBGA package. They differ in logic density, package size, pin count, and speed grade.
Are the 10AX048H2F34E2SG and 10AX016C3U19E2SG pin-compatible?
No. The 10AX048H2F34E2SG uses a 1152-pin FBGA package, and the 10AX016C3U19E2SG uses a 484-pin UBGA package. The different package types, pin counts, and ball maps make them physically and electrically incompatible for direct PCB replacement.
Can the 10AX016C3U19E2SG be used as a direct substitute for the 10AX048H2F34E2SG?
No. The 10AX016C3U19E2SG has significantly fewer logic elements (160,000 vs 480,000), fewer transceivers, and a different package footprint. A direct substitution is not possible without redesigning the PCB and verifying that the lower logic density meets the design requirements.
Do both devices belong to the same Intel FPGA family?
Yes. Both the 10AX048H2F34E2SG and the 10AX016C3U19E2SG are members of the Intel Arria 10 GX FPGA family, which shares the same architecture, IP support, and development tools such as Intel Quartus Prime.
What are the operating temperature ranges for these two FPGAs?
Both the 10AX048H2F34E2SG and the 10AX016C3U19E2SG are specified for the industrial temperature range of -40°C to 100°C junction temperature (TJ), as indicated by the "E2" speed grade and temperature suffix in their part numbers.
Which device offers more high-speed transceivers?
The 10AX048H2F34E2SG provides more high-speed transceiver channels than the 10AX016C3U19E2SG due to its larger die and higher pin-count package. The exact transceiver count depends on the specific device variant and package, and should be confirmed in the Intel Arria 10 GX device datasheet.
Are the configuration and power supply requirements the same for both devices?
Both devices use the same Arria 10 configuration schemes (e.g., active serial, passive serial, JTAG) and require the same core and I/O voltage rails as defined by the Arria 10 GX family specifications. However, actual power consumption differs because the 10AX048H2F34E2SG has more logic and transceiver resources than the 10AX016C3U19E2SG.