10AX048H3F34E2SG vs 10AX032H2F35E2SG

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Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 10AX048H3F34E2SG and 10AX032H2F35E2SG are both Intel Arria 10 GX FPGA devices sharing the same transceiver count, I/O standard support, and operating temperature grade, making them functionally compatible candidates. However, they differ in logic density and package footprint, so validation is required before substituting in an existing design.

Logic Density Validation required
Package Type Validation required
Transceiver Count High match
Operating Temperature High match

Review the critical differences →

Parts at a glance

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 10AX048H3F34E2SG 10AX032H2F35E2SG Why it matters
Logic Elements (LE) 480,000 320,000 Logic capacity determines the maximum complexity of designs the FPGA can implement; a lower LE count may not fit a design built for the larger device.
Adaptive Logic Modules (ALM) 183,590 122,400 ALMs are the fundamental logic building blocks; differing counts directly affect available combinational and sequential logic resources.
Total Embedded Memory 18,620 Kbit 12,540 Kbit On-chip memory capacity affects buffering, FIFO depth, and data storage capability within the FPGA fabric.
DSP Blocks (Variable Precision) 1,368 912 DSP blocks accelerate multiplication and accumulation operations; fewer blocks limit signal processing throughput.
Maximum User I/O Pins 492 396 I/O count determines how many external interfaces and peripherals can be connected to the device.
Package FBGA-1152 FBGA-1152 Package type and ball count must match the PCB footprint for physical compatibility.
Speed Grade 3 (High Performance) 2 (High Performance) Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet timing requirements.
Operating Temperature Range 0°C to 100°C (Commercial) 0°C to 100°C (Commercial) Temperature range must match the application environment for reliable operation.
Transceiver Count 36 24 High-speed transceivers enable serial protocols like PCIe and Ethernet; fewer transceivers limit high-speed interface options.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 10AX048H3F34E2SG 10AX032H2F35E2SG
Supplier - Intel
Series Arria 10 GX Arria 10 GX
Part Status Active Active
Number of LABs/CLBs 183590 119900
Number of Logic Elements/Cells 480000 320000
Total RAM Bits 5664768 21040128
Number of I/O 492 384
Voltage - Supply 0.87V ~ 0.93V 0.87V ~ 0.98V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)

Frequently asked questions

What are the key differences between the Intel (Altera) 10AX048H3F34E2SG and 10AX032H2F35E2SG FPGA devices?

The primary differences are logic density, package, and speed grade. The 10AX048H3F34E2SG is an Arria 10 GX device with 480,000 logic elements (LEs) in a 1152-pin FBGA package (F34) with speed grade 3. The 10AX032H2F35E2SG is an Arria 10 GX device with 320,000 LEs in a 1152-pin FBGA package (F35) with speed grade 2. Both are in the same Arria 10 GX family and share the same 1152-ball package footprint but differ in LE count, speed grade, and specific package code.

Are the 10AX048H3F34E2SG and 10AX032H2F35E2SG pin-compatible?

No. Although both use a 1152-pin FBGA package, the package codes differ (F34 vs F35), which indicates different ball-out configurations and pin assignments. They are not pin-compatible and cannot be used as drop-in replacements without verifying the specific device pinout in the respective Intel Arria 10 device pin-out files.

Can the 10AX032H2F35E2SG be used as a substitute for the 10AX048H3F34E2SG in an existing design?

No, not directly. The 10AX032H2F35E2SG has fewer logic elements (320,000 vs 480,000), a different speed grade (2 vs 3), and a different package code (F35 vs F34). Substitution would require a complete design recompile, pinout reassignment, timing closure revalidation, and PCB layout review. Intel does not list these as direct substitutes.

What is the logic density of each device?

The 10AX048H3F34E2SG has 480,000 logic elements (LEs). The 10AX032H2F35E2SG has 320,000 logic elements (LEs). Both are members of the Intel Arria 10 GX family.

What speed grade does each device use, and how does it affect performance?

The 10AX048H3F34E2SG uses speed grade 3, while the 10AX032H2F35E2SG uses speed grade 2. In Intel FPGA nomenclature, a lower speed grade number generally indicates a faster device with shorter propagation delays and higher maximum operating frequencies. Therefore, the 10AX032H2F35E2SG (speed grade 2) may achieve higher clock frequencies than the 10AX048H3F34E2SG (speed grade 3), but actual performance depends on the specific design and timing closure.

Do both devices belong to the same Intel FPGA family and use the same development tools?

Yes. Both the 10AX048H3F34E2SG and 10AX032H2F35E2SG are Intel Arria 10 GX FPGAs. They are supported by the same Intel Quartus Prime development software (with appropriate device support installed) and share the same Arria 10 architecture, transceiver capabilities, and IP library.

What are the operating temperature ranges for these devices?

Both the 10AX048H3F34E2SG and 10AX032H2F35E2SG are specified for commercial temperature range operation, typically 0°C to 85°C junction temperature (TJ). The "E2" suffix in both part numbers indicates commercial temperature grade. Industrial and extended temperature variants exist in the Arria 10 family but are denoted by different suffixes.

Which device should be selected for a new design requiring higher logic capacity?

The 10AX048H3F34E2SG should be selected when higher logic capacity is required, as it provides 480,000 LEs compared to 320,000 LEs in the 10AX032H2F35E2SG. However, the designer must also consider speed grade requirements, package compatibility, power budget, and PCB layout constraints. Intel Quartus Prime should be used to verify resource utilization and timing for the target device.

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