Part A
10CL016YU484C8G
Intel
- Lifecycle
- Active
- Stock
- 5743 Stückzahl
- Package
- FBGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10CL080YF780C6G is a higher-density alternative to the 10CL016YU484C8G within the Intel Cyclone 10 LP family, but it is not a drop-in replacement due to differences in logic capacity, package footprint, and speed grade. Designers must validate pinout, power integrity, and timing closure before substituting.
Logic Density
Validation required
Package Type
Not compatible
Speed Grade
Validation required
Supply Voltage
High match
Parts at a glance
Part B
10CL080YF780C6G
Intel
- Lifecycle
- Active
- Stock
- 8404 Stückzahl
- Package
- BGA-780
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10CL016YU484C8G | 10CL080YF780C6G | Why it matters |
|---|---|---|---|
| Logic Elements (LEs) | 16,000 | 80,000 | LE count determines the amount of programmable logic available; a design that fits in one device may not fit in the other, directly affecting functional substitutability. |
| Total RAM Bits | 562,176 | 2,810,880 | Embedded memory capacity limits the size of buffers, FIFOs, and data storage a design can implement on-chip. |
| Number of I/O Pins | 340 | 429 | Available user I/O determines how many external signals and peripherals the device can interface with. |
| Package / Case | 484-FBGA (UBGA) | 780-FBGA (FBGA) | Package footprint and ball pitch must match the PCB layout; different packages are not drop-in compatible. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Temperature grade affects reliability and suitability for the target operating environment. |
| Supply Voltage | 1.2 V core | 1.2 V core | Core supply voltage must match the board power design for correct operation. |
| Speed Grade | 8 (Fastest) | 6 (Faster) | Speed grade determines maximum achievable clock frequency and timing closure for a given design. |
| Number of PLLs | 4 | 4 | PLLs provide clock synthesis and management; the count limits the number of independent clock domains. |
| Embedded Multipliers (18x18) | 56 | 288 | Hard multiplier blocks accelerate DSP operations; insufficient count forces logic-based implementation, reducing performance. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10CL016YU484C8G | 10CL080YF780C6G |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® 10 LP | Cyclone® 10 LP |
| Part Status | Active | Active |
| Number of LABs/CLBs | 963 | 5079 |
| Number of Logic Elements/Cells | 15408 | 81264 |
| Total RAM Bits | 516096 | 2810880 |
| Number of I/O | 340 | 423 |
| Voltage - Supply | 1.2V | 1.2V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 10CL016YU484C8G and the 10CL080YF780C6G?
The 10CL016YU484C8G is a Cyclone 10 LP FPGA with 16,000 logic elements in a 484-pin UBGA package, while the 10CL080YF780C6G is a Cyclone 10 LP FPGA with 80,000 logic elements in a 780-pin FBGA package. The 10CL080YF780C6G offers significantly higher logic density and a larger package with more user I/O, whereas the 10CL016YU484C8G is a smaller, lower-density device.
Are the 10CL016YU484C8G and 10CL080YF780C6G pin-to-pin compatible?
No. The 10CL016YU484C8G uses a 484-pin UBGA package, and the 10CL080YF780C6G uses a 780-pin FBGA package. They have different pin counts, package dimensions, and pinouts, so they are not pin-to-pin compatible and cannot be interchanged on the same PCB footprint.
What are the operating temperature grades for these two devices?
Both the 10CL016YU484C8G and the 10CL080YF780C6G are specified with a commercial temperature grade, indicated by the "C" in the ordering code. The commercial grade typically supports an operating junction temperature range of 0°C to 85°C, as defined in the Intel Cyclone 10 LP device datasheet.
What speed grade do the 10CL016YU484C8G and 10CL080YF780C6G use?
The 10CL016YU484C8G has a speed grade of 8, as indicated by the "8" in its ordering code. The 10CL080YF780C6G has a speed grade of 6, as indicated by the "6" in its ordering code. A lower speed grade number generally indicates a faster device in the Intel FPGA ordering scheme.
Can the 10CL016YU484C8G be used as a direct substitute for the 10CL080YF780C6G?
No. The two devices differ in logic density (16,000 vs 80,000 logic elements), package type and pin count (484-pin UBGA vs 780-pin FBGA), and speed grade (8 vs 6). A direct substitution would require a complete redesign of the PCB, power delivery, and timing closure, and is not supported without full validation against the Intel Cyclone 10 LP datasheet and design requirements.
What configuration memory type do the 10CL016YU484C8G and 10CL080YF780C6G use?
Both devices are Cyclone 10 LP FPGAs, which use SRAM-based configuration memory. They require an external configuration device, such as a serial configuration flash or a host controller, to load the configuration bitstream at power-up, as described in the Intel Cyclone 10 LP documentation.
Do the 10CL016YU484C8G and 10CL080YF780C6G support the same I/O standards?
Both devices support a range of single-ended and differential I/O standards defined for the Cyclone 10 LP family, including LVCMOS, LVTTL, and LVDS, subject to the specific bank and package constraints. However, the actual number of available I/O pins and the supported standards per bank differ between the 484-pin UBGA and 780-pin FBGA packages, so designers must verify pin assignments against the respective device pin-out files.
Which device is better suited for high-logic-density applications?
The 10CL080YF780C6G is better suited for high-logic-density applications because it provides 80,000 logic elements, five times the logic capacity of the 10CL016YU484C8G, which has 16,000 logic elements. The larger 780-pin FBGA package also offers more user I/O, making it more appropriate for complex designs requiring extensive logic and interface resources.