Part A
10CL080YU484I7G
Intel
- Lifecycle
- Active
- Stock
- 2806 Stückzahl
- Package
- FBGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10CL080YU484I7G and 10CL016YF484C8G are both Intel Cyclone 10 LP FPGAs in the same 484-pin FBGA package, sharing identical I/O bank architecture and core voltage requirements. However, the 10CL080YU484I7G offers five times the logic density and a faster speed grade, making it a viable higher-capacity substitute for the 10CL016YF484C8G in most designs, provided timing closure and power budget are revalidated. The reverse substitution is not recommended due to insufficient logic resources.
Logic Density
Validation required
Package Type
High match
Speed Grade
Validation required
Core Voltage
High match
Parts at a glance
Part B
10CL016YF484C8G
Altera
- Lifecycle
- Active
- Stock
- 9496 Stückzahl
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10CL080YU484I7G | 10CL016YF484C8G | Why it matters |
|---|---|---|---|
| Logic Elements (LEs) | 80,000 | 16,000 | LE count determines the amount of programmable logic available; a design that fits one density may not fit the other, directly affecting functional substitutability. |
| Total Embedded RAM | 2,810 kbit | 562 kbit | On-chip memory capacity limits buffering, FIFOs, and data storage; insufficient RAM prevents a design from being ported between devices. |
| Embedded 18x18 Multipliers | 244 | 56 | DSP blocks are required for arithmetic-intensive functions; fewer multipliers restrict signal-processing capability. |
| Maximum User I/O | 294 | 294 | I/O count determines how many external signals can be interfaced; matching counts supports pin-compatible board designs. |
| Package | 484-pin FBGA | 484-pin FBGA | Package and pinout must match for physical board compatibility and drop-in replacement. |
| Operating Temperature Range | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | Temperature grade determines suitability for harsh or industrial environments versus commercial applications. |
| Speed Grade | 7 (fastest) | 8 (slower) | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet design timing requirements. |
| Core Supply Voltage | 1.2 V | 1.2 V | Core voltage must match the board power design; identical values allow shared power rails. |
| Configuration Memory | SRAM-based (volatile) | SRAM-based (volatile) | Volatile configuration requires external boot memory; both devices share the same configuration scheme. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10CL080YU484I7G | 10CL016YF484C8G |
|---|---|---|
| Series | Cyclone® 10 LP | Cyclone® 10 LP |
| Part Status | Active | Active |
| Digi Key Programmable | - | Not Verified |
| Number of Logic Elements / Cells | - | 15408 |
| Total RAM Bits | 2810880 | 516096 |
| Number of I/O | 289 | 340 |
| Voltage - Supply | 1.2V | 1.2V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
| Number of LA Bs / CL Bs | - | 963 |
| Number of LABs/CLBs | 5079 | - |
| Number of Logic Elements/Cells | 81264 | - |
Frequently asked questions
What are the key differences between the 10CL080YU484I7G and the 10CL016YF484C8G?
The 10CL080YU484I7G is an Intel (Altera) Cyclone 10 LP FPGA with 80,000 logic elements, a 484-pin UBGA package, and an industrial temperature grade (I7, -40°C to 100°C junction). The 10CL016YF484C8G is a Cyclone 10 LP FPGA with 16,000 logic elements, a 484-pin FBGA package, and a commercial temperature grade (C8, 0°C to 85°C junction). They differ in logic density, package type, and temperature grade.
Are the 10CL080YU484I7G and 10CL016YF484C8G pin-to-pin compatible?
No. The 10CL080YU484I7G uses a 484-pin UBGA (U484) package, while the 10CL016YF484C8G uses a 484-pin FBGA (F484) package. These are different package types with different ball maps and PCB land patterns, so they are not pin-to-pin compatible.
Can the 10CL016YF484C8G be used as a direct substitute for the 10CL080YU484I7G?
No. The 10CL016YF484C8G has only 16,000 logic elements versus 80,000 in the 10CL080YU484I7G, and it has a commercial temperature grade versus the industrial grade of the 10CL080YU484I7G. The package type also differs (FBGA vs UBGA). A direct substitution is not possible without redesign and validation.
What are the operating temperature ranges for these two FPGAs?
The 10CL080YU484I7G is rated for industrial operation with a junction temperature range of -40°C to 100°C (I7 grade). The 10CL016YF484C8G is rated for commercial operation with a junction temperature range of 0°C to 85°C (C8 grade).
Do both devices belong to the same FPGA family?
Yes. Both the 10CL080YU484I7G and the 10CL016YF484C8G are members of the Intel (Altera) Cyclone 10 LP FPGA family, which is optimized for low-cost, low-power logic applications.
What are the logic element counts for the 10CL080YU484I7G and the 10CL016YF484C8G?
The 10CL080YU484I7G contains 80,000 logic elements. The 10CL016YF484C8G contains 16,000 logic elements. This five-fold difference in logic density significantly affects the available resources for user logic, memory, and DSP functions.
Which device is better suited for industrial temperature environments?
The 10CL080YU484I7G is better suited for industrial temperature environments because it is specified for a junction temperature range of -40°C to 100°C. The 10CL016YF484C8G is specified only for commercial temperatures (0°C to 85°C junction) and is not rated for industrial use.
Are the package dimensions and ball pitches identical between the two devices?
No. The 10CL080YU484I7G uses a 484-pin UBGA package, while the 10CL016YF484C8G uses a 484-pin FBGA package. These package types have different physical dimensions, ball pitches, and PCB footprint requirements, so they are not mechanically interchangeable.