Part A
10M08DCF256I7G
Intel
- Lifecycle
- Active
- Stock
- 5000 Stückzahl
- Package
- LBGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M08DCF256I7G and 10M08DAF256C8G share the same Intel MAX 10 FPGA family, 8,000 logic elements, 256-ball FBGA package, and 3.3 V/2.5 V/1.8 V/1.5 V/1.2 V I/O standards, making them functionally interchangeable in most designs. However, the industrial temperature grade and faster speed grade of the 10M08DCF256I7G versus the commercial temperature grade and slower speed grade of the 10M08DAF256C8G require timing and thermal validation before direct substitution.
Logic Density
High match
Package Type
High match
Operating Temperature
Validation required
Speed Grade
Validation required
Parts at a glance
Part B
10M08DAF256C8G
Intel
- Lifecycle
- Active
- Stock
- 3270 Stückzahl
- Package
- LBGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M08DCF256I7G | 10M08DAF256C8G | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 8,000 | 8,000 | Identical logic capacity ensures the same design fits without resource changes. |
| Embedded Memory | 378 Kbits | 378 Kbits | Matching on-chip memory supports the same buffering and storage requirements. |
| Package | 256-pin FBGA | 256-pin FBGA | Same package and pin count allow drop-in board compatibility. |
| Operating Temperature Range | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | Industrial-grade parts support harsher environments, while commercial parts are limited to benign conditions; this affects deployment suitability. |
| Speed Grade | 7 (Fastest) | 8 (Slower) | Different speed grades affect maximum operating frequency and timing closure; a slower grade may not meet the same performance targets. |
| Configuration Flash | Yes (Dual Configuration) | Yes (Single Configuration) | Dual configuration supports fail-safe updates and rollback, while single configuration does not; this impacts reliability and field upgrade strategy. |
| Analog-to-Digital Converter (ADC) | Yes | Yes | Both include the integrated ADC block, so analog monitoring features remain available. |
| Supply Voltage | 1.2 V core / 2.5 V or 3.3 V I/O | 1.2 V core / 2.5 V or 3.3 V I/O | Identical supply requirements mean the same power design can be reused. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M08DCF256I7G | 10M08DAF256C8G |
|---|---|---|
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 500 | 500 |
| Number of Logic Elements/Cells | 8000 | 8000 |
| Total RAM Bits | 387072 | 387072 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 10M08DCF256I7G and the 10M08DAF256C8G?
The 10M08DCF256I7G is a MAX 10 FPGA with 8,000 logic elements in a 256-pin FineLine BGA package, specified for industrial temperature range (I7, -40°C to 100°C junction) and featuring dual configuration flash. The 10M08DAF256C8G is a MAX 10 FPGA with 8,000 logic elements in a 256-pin FineLine BGA package, specified for commercial temperature range (C8, 0°C to 85°C junction) and featuring analog-to-digital converter (ADC) functionality. The primary differences are the operating temperature grade and the integrated feature set (dual configuration flash vs. ADC).
Are the 10M08DCF256I7G and 10M08DAF256C8G pin-to-pin compatible?
Both devices are offered in the same 256-pin FineLine BGA (FBGA) package, which typically provides the same physical footprint and ball map for the MAX 10 family. However, pin function assignments may differ due to the different feature sets (dual configuration flash vs. ADC). Designers must verify pin compatibility using the respective device pin-out files and Intel MAX 10 documentation before considering a direct replacement.
Can the 10M08DCF256I7G be used as a drop-in replacement for the 10M08DAF256C8G in an existing design?
Not without careful validation. Although both are 10M08 MAX 10 devices in the same 256-pin FBGA package, the 10M08DCF256I7G has an industrial temperature grade and dual configuration flash, while the 10M08DAF256C8G has a commercial temperature grade and ADC. The differing feature sets may affect pin functions, power requirements, and configuration schemes. A direct drop-in replacement is only possible after confirming that all electrical, thermal, and functional differences are acceptable for the target application.
What are the operating temperature ranges for the 10M08DCF256I7G and 10M08DAF256C8G?
The 10M08DCF256I7G is rated for the industrial temperature grade, with a junction temperature range of -40°C to 100°C (I7 speed grade). The 10M08DAF256C8G is rated for the commercial temperature grade, with a junction temperature range of 0°C to 85°C (C8 speed grade). These temperature ranges are specified in the Intel MAX 10 FPGA device datasheets.
Do both devices support dual configuration flash?
No. The 10M08DCF256I7G includes dual configuration flash, which allows two separate configuration images to be stored on-chip. The 10M08DAF256C8G does not include dual configuration flash; instead, it features an integrated analog-to-digital converter (ADC). These feature differences are part of the MAX 10 device ordering code and are documented in the Intel MAX 10 FPGA product specifications.
What is the logic capacity of the 10M08DCF256I7G and 10M08DAF256C8G?
Both devices have 8,000 logic elements (LEs), which is indicated by the "10M08" prefix in their part numbers. They also share the same embedded memory, multiplier, and PLL resources typical of the 10M08 MAX 10 device density. The logic capacity is identical; the differences lie in temperature grade and integrated features.
Which device is better suited for industrial applications?
The 10M08DCF256I7G is better suited for industrial applications because it is specified for the industrial temperature range (-40°C to 100°C junction). The 10M08DAF256C8G is specified for the commercial temperature range (0°C to 85°C junction) and is therefore less appropriate for harsh industrial environments unless the system maintains the commercial temperature limits.
Are the configuration schemes the same for both devices?
Both devices support the same configuration schemes available in the MAX 10 family, including internal configuration, JTAG, and external configuration. However, the 10M08DCF256I7G includes dual configuration flash, which enables features such as dual boot and fail-safe updating. The 10M08DAF256C8G does not include dual configuration flash, so those specific dual-image features are not available. Refer to the Intel MAX 10 FPGA configuration user guide for detailed scheme support.