Part A
10M16DAF256C8G
Intel
- Lifecycle
- Active
- Stock
- 4171 Stückzahl
- Package
- BGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M16DAF256C8G and 10M16DCF484A7G share the same Intel MAX 10 FPGA family, 16,000 logic elements, and core architecture, making them functionally comparable for logic-intensive designs. However, they differ in package type, operating temperature grade, and speed grade, so validation against the target application's thermal and timing requirements is required before substitution.
Logic Density
High match
Package Type
Validation required
Operating Temperature
Validation required
Speed Grade
Validation required
Parts at a glance
Part B
10M16DCF484A7G
Intel
- Lifecycle
- Active
- Stock
- 4360 Stückzahl
- Package
- BGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DAF256C8G | 10M16DCF484A7G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Same device family ensures similar architecture, toolchain support, and IP compatibility for substitution. |
| Logic Elements (LEs) | 16,000 | 16,000 | Matching logic capacity is essential for functional equivalence in a design migration. |
| Package | 256-pin FBGA | 484-pin FBGA | Different package footprints require PCB redesign and affect available I/O and thermal performance. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 125°C (Automotive/Industrial) | Temperature grade determines suitability for harsh environments and reliability in automotive or industrial applications. |
| Speed Grade | 8 (Fastest) | 7 (Slower) | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet original performance targets. |
| Embedded Memory (M9K blocks) | Up to 5,888 Kbits | Up to 5,888 Kbits | Identical embedded memory capacity supports equivalent data buffering and storage requirements. |
| User I/O Count | 178 | 360 | Different I/O counts affect interface capability and may require design changes for peripheral connections. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Matching core voltage ensures power supply compatibility and similar power consumption characteristics. |
| Configuration Memory Type | Flash (Instant-on) | Flash (Instant-on) | Both are non-volatile flash-based FPGAs, providing instant-on operation and single-chip configuration. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16DAF256C8G | 10M16DCF484A7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 178 | 320 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 125°C (TJ) |
Frequently asked questions
What are the key differences between the 10M16DAF256C8G and the 10M16DCF484A7G?
The 10M16DAF256C8G is a MAX 10 FPGA in a 256-pin FineLine BGA (FBGA) package with a commercial temperature grade (C8, 0°C to 85°C junction). The 10M16DCF484A7G is a MAX 10 FPGA in a 484-pin FineLine BGA (FBGA) package with an industrial temperature grade (A7, -40°C to 125°C junction). Both devices feature 16,000 logic elements (LEs) and belong to the Intel (Altera) MAX 10 family, but they differ in package, pin count, and temperature grade.
Do the 10M16DAF256C8G and 10M16DCF484A7G have the same logic density and memory resources?
Yes. Both devices are part of the MAX 10 10M16 density tier, offering 16,000 logic elements (LEs), 549 Kbits of M9K embedded memory, and 32 embedded 18x18 multipliers. They also share the same number of user I/O banks and analog-to-digital converter (ADC) blocks, as they are built on the same MAX 10 architecture.
Can the 10M16DAF256C8G be used as a drop-in replacement for the 10M16DCF484A7G?
No. The two devices have different package footprints (256-pin FBGA vs. 484-pin FBGA), different pin counts, and different temperature grades. A drop-in replacement is not possible without redesigning the PCB and verifying that the commercial temperature grade of the 10M16DAF256C8G meets the target application's thermal requirements.
What are the operating temperature ranges for these two devices?
The 10M16DAF256C8G is rated for commercial operation with a junction temperature range of 0°C to 85°C. The 10M16DCF484A7G is rated for industrial operation with a junction temperature range of -40°C to 125°C. The industrial-grade device is suitable for harsher environments, while the commercial-grade device is intended for controlled environments.
Are the configuration and programming methods the same for both devices?
Yes. Both the 10M16DAF256C8G and 10M16DCF484A7G support the same configuration schemes within the MAX 10 family, including internal configuration via on-chip flash, JTAG configuration, and external configuration from a host or configuration device. They also support dual configuration images and the same programming file formats (.pof, .sof, .jic).
Which device offers more user I/O pins?
The 10M16DCF484A7G, in the 484-pin FBGA package, provides more user I/O pins than the 10M16DAF256C8G, which is in the smaller 256-pin FBGA package. The exact number of user I/O pins depends on the specific package and is documented in the Intel MAX 10 device pin-out files. Designers should consult the official pin-out documentation for precise counts.
Do both devices support the same power supply requirements?
Yes. Both devices operate from the same core voltage (VCCINT) and I/O voltage (VCCIO) ranges as defined for the MAX 10 family. Typical VCCINT is 1.2 V, and VCCIO can be set to 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on the I/O standard used. However, the industrial-grade device may have slightly different power consumption characteristics over the extended temperature range.
Are these devices RoHS compliant and lead-free?
Yes. Both the 10M16DAF256C8G and 10M16DCF484A7G are offered in RoHS-compliant, lead-free packages as standard from Intel (Altera). Designers should verify the specific ordering code and packaging options with the manufacturer or authorized distributor to confirm compliance for their production requirements.