Part A
10M16DCU324C8G
Altera
- Lifecycle
- Active
- Stock
- 5166 Stückzahl
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M16DCU324C8G and 10M16DAU324I6G are both Intel MAX 10 FPGA devices sharing the same 16,000 logic element density and 324-ball UBGA footprint, making them functionally interchangeable in many designs. However, the commercial-grade 10M16DCU324C8G and the industrial-grade 10M16DAU324I6G differ in operating temperature range and speed grade, so the replacement is viable only when the target application's thermal and timing requirements are satisfied by the industrial-grade device.
Logic Density
High match
Package Type
High match
Operating Temperature
Validation required
Speed Grade
Validation required
Parts at a glance
Part B
10M16DAU324I6G
Intel
- Lifecycle
- Active
- Stock
- 4162 Stückzahl
- Package
- LFBGA-324
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DCU324C8G | 10M16DAU324I6G | Why it matters |
|---|---|---|---|
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Determines the environments in which the device can reliably operate; industrial-grade parts are required for harsh or wide-temperature applications. |
| Speed Grade | 8 | 6 | A lower speed grade number indicates faster maximum operating frequency and tighter timing, affecting achievable system performance. |
| Package | 324-pin UBGA (Fineline BGA) | 324-pin UBGA (Fineline BGA) | Package type and pin count must match for a drop-in board-level replacement; both share the same 324-pin UBGA footprint. |
| Logic Elements (LEs) | 16,000 | 16,000 | Logic capacity determines the amount of digital logic that can be implemented; identical LE counts support equivalent design complexity. |
| Total RAM Bits | 562,176 | 562,176 | On-chip memory capacity affects buffering, FIFO depth, and data storage within the FPGA; matching values preserve memory-related functionality. |
| Number of I/O Pins | 246 | 246 | Available user I/O determines how many external signals can be interfaced; identical counts ensure pinout compatibility. |
| Supply Voltage - Core | 1.15V to 1.25V | 1.15V to 1.25V | Core voltage must match the board power design; identical ranges allow the same power supply to be used. |
| Mounting Type | Surface Mount | Surface Mount | Mounting style must be compatible with the PCB assembly process; both are surface-mount devices. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16DCU324C8G | 10M16DAU324I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | - | 1000 |
| Number of Logic Elements/Cells | - | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 246 | 246 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
| Digi Key Programmable | Not Verified | - |
| Number of LA Bs / CL Bs | 1000 | - |
| Number of Logic Elements / Cells | 16000 | - |
| Packaging | Tray | - |
Frequently asked questions
What are the 10M16DCU324C8G and 10M16DAU324I6G devices?
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the 10M16 density class, featuring 16,000 logic elements (LEs), non-volatile integrated flash configuration, and a 324-ball Ultra FineLine BGA (UBGA) package. The 10M16DCU324C8G is specified for commercial temperature operation with a C8 speed grade, while the 10M16DAU324I6G is specified for industrial temperature operation with a 6 speed grade.
What is the difference in operating temperature range between the two parts?
The 10M16DCU324C8G is rated for the commercial temperature range of 0°C to 85°C junction temperature (TJ), while the 10M16DAU324I6G is rated for the industrial temperature range of -40°C to 100°C junction temperature (TJ), per Intel MAX 10 device specifications.
How do the speed grades of the 10M16DCU324C8G and 10M16DAU324I6G compare?
The 10M16DCU324C8G uses speed grade 8 (C8), and the 10M16DAU324I6G uses speed grade 6 (I6). In Intel MAX 10 ordering codes, a lower speed grade number indicates a faster device, so the I6 speed grade offers higher maximum operating frequencies and tighter timing than the C8 speed grade.
Are the 10M16DCU324C8G and 10M16DAU324I6G pin-compatible?
Yes. Both devices are offered in the same 324-ball Ultra FineLine BGA (UBGA) package with the same ballout for the 10M16 density, so they are pin-compatible at the package level. However, the differing speed grade and temperature grade must still be validated against the target design's timing and environmental requirements.
Can the 10M16DCU324C8G and 10M16DAU324I6G be used as direct substitutes for each other?
They share the same 10M16 logic density and 324-ball UBGA package, but they differ in speed grade (C8 vs I6) and temperature grade (commercial vs industrial). A direct substitution is only valid after confirming that the target design meets timing with the applicable speed grade and operates within the corresponding temperature range.
What configuration memory technology do the 10M16DCU324C8G and 10M16DAU324I6G use?
Both devices are Intel MAX 10 FPGAs, which integrate non-volatile flash configuration memory on-chip. This allows instant-on operation and eliminates the need for an external configuration device for the core configuration data, as documented in Intel MAX 10 device literature.
Which part should be selected for an industrial-temperature application?
The 10M16DAU324I6G should be selected for industrial-temperature applications because its I6 ordering code denotes the industrial temperature grade (-40°C to 100°C TJ). The 10M16DCU324C8G is limited to the commercial temperature range and is not specified for industrial operation.
Do both devices support the same MAX 10 hard IP blocks, such as ADC and flash memory?
Yes. Both the 10M16DCU324C8G and 10M16DAU324I6G belong to the same MAX 10 10M16 density family and therefore include the same hard IP resources for that density, including analog-to-digital converter (ADC) blocks and integrated flash memory. The differences between the two ordering codes are limited to speed grade and temperature grade, not the available hard IP set.