10M40DAF256I7G
Intel
- Lifecycle
- Active
- Stock
- 5032 Stückzahl
- Package
- LBGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Dieser detaillierte Vergleich von 10M40DAF256I7G und 10M40DCF256A7G bietet wertvolle Einblicke in deren Spezifikationen und Hauptmerkmale. Wir gehen ausführlich auf wichtige Faktoren ein, darunter RoHS-Konformität, REACH-Status, Serie, Montageart, Gehäusetyp und weitere relevante Eigenschaften. Die übersichtliche Darstellung der Unterschiede vereinfacht die Komponentenauswahl und erleichtert Ihnen die Wahl der optimalen Lösung für Ihre Anwendung.
Replacement verdict
The 10M40DCF256A7G and 10M40DAF256I7G are both Intel MAX 10 field-programmable gate arrays sharing the same 40,000 logic element density, 256-ball FineLine BGA package, and core architecture, making them functionally interchangeable in designs that can accommodate the temperature grade and speed grade differences. The commercial-grade 10M40DCF256A7G and industrial-grade 10M40DAF256I7G differ primarily in operating temperature range and speed grade, so the industrial variant can serve as a higher-tolerance substitute for the commercial part in most applications, provided timing closure is revalidated for the slower speed grade.
Intel
Intel
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DCF256A7G | 10M40DAF256I7G | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Both devices belong to the same FPGA family, ensuring similar architecture and toolchain support. |
| Logic Elements (LEs) | 40,000 | 40,000 | Matching logic density allows equivalent design capacity and resource utilization. |
| Embedded Memory | 1,260 Kbit | 1,260 Kbit | Identical memory resources support the same data buffering and storage requirements. |
| Package | 256-FBGA | 256-FBGA | Same package ensures footprint compatibility and identical PCB layout requirements. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Temperature grade determines suitability for harsh or industrial environments versus commercial applications. |
| Speed Grade | 7 | 7 | Same speed grade indicates comparable maximum operating frequency and timing performance. |
| Supply Voltage | 1.2 V Core | 1.2 V Core | Identical core voltage simplifies power supply design and ensures electrical compatibility. |
| Configuration Memory Type | Flash (Instant-On) | Flash (Instant-On) | Non-volatile flash configuration provides instant-on operation and eliminates external configuration memory. |
| RoHS Compliance | Yes | Yes | Both meet environmental regulations, ensuring compliance for global product distribution. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M40DAF256I7G | 10M40DCF256A7G |
|---|---|---|
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 125°C (TJ) |
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the 256-ball FineLine BGA (FBGA) package. The 10M40DCF256A7G is specified for commercial temperature operation with a speed grade of 7, while the 10M40DAF256I7G is specified for industrial temperature operation with a speed grade of 7. Both feature 40,000 logic elements (LEs) and belong to the MAX 10 family with integrated analog-to-digital converter (ADC) blocks and flash configuration memory.
The primary differences are the operating temperature range and the ordering code suffix. The 10M40DCF256A7G is rated for commercial temperature range (typically 0°C to 85°C junction temperature), while the 10M40DAF256I7G is rated for industrial temperature range (typically -40°C to 100°C junction temperature). Both use the same 256-ball FBGA package, have 40,000 logic elements, and share speed grade 7. The "C" in the commercial part number and the "I" in the industrial part number indicate the temperature grade.
Yes, both devices are offered in the same 256-ball FineLine BGA (FBGA) package with the same pinout. The package designator "F256" is identical for both part numbers, indicating the same physical footprint and ball assignments. However, designers should always verify the specific device pinout in the respective Intel MAX 10 device pin-out files, as configuration and I/O assignments may differ based on design requirements.
Not directly in all applications. While both devices share the same package and logic density, the 10M40DCF256A7G is rated only for commercial temperature ranges (0°C to 85°C), whereas the 10M40DAF256I7G is rated for industrial temperature ranges (-40°C to 100°C). If the target application requires industrial temperature operation, the commercial-grade device cannot be substituted. Additionally, timing characteristics may vary between temperature grades, so timing closure must be re-validated.
Both devices feature 40,000 logic elements (LEs), which is indicated by the "40" in the part number (10M40). They also include 1,260 Kbits of M9K embedded memory, 126 embedded 18x18 multipliers, and four phase-locked loops (PLLs). These parameters are consistent across both temperature grades within the MAX 10 10M40 device family.
Yes, both devices are MAX 10 FPGAs featuring integrated flash configuration memory, which enables instant-on operation. The configuration bitstream is stored internally, eliminating the need for an external configuration device. This is a family-wide feature of Intel MAX 10 devices and applies to both the commercial and industrial temperature grade versions.
Both devices are speed grade 7, as indicated by the "7" before the "G" in the ordering code. Speed grade 7 is the fastest available speed grade for the MAX 10 10M40 family. The "G" suffix indicates RoHS-compliant lead-free packaging. Speed grade affects timing parameters such as maximum operating frequency and propagation delays, and both devices share the same speed grade rating.
Both devices use the 256-ball FineLine BGA (FBGA) package, designated by "F256" in the part number. The FBGA package offers a compact footprint suitable for space-constrained designs. The package is RoHS-compliant, as indicated by the "G" suffix. Thermal management requirements may differ between commercial and industrial temperature grades, so designers should consult the Intel MAX 10 device datasheet for thermal resistance and power dissipation specifications.