Part A
10M50DAF256I7G
Intel
- Lifecycle
- Active
- Stock
- 1541 Stückzahl
- Package
- LBGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M50DAF256I7G and 10M50DCF256A7G are both Intel MAX 10 FPGA devices sharing the same 50,000 logic element density and 256-ball FineLine BGA footprint, making them functionally interchangeable in many designs. However, the 10M50DAF256I7G is specified for the industrial temperature range with a faster speed grade, while the 10M50DCF256A7G is a commercial-grade, lower-speed variant. Designers must validate timing closure and thermal margins before substituting one for the other in production.
Logic Density
High match
Package Type
High match
Operating Temperature
Validation required
Speed Grade
Validation required
Parts at a glance
Part B
10M50DCF256A7G
Altera
- Lifecycle
- Active
- Stock
- 5161 Stückzahl
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M50DAF256I7G | 10M50DCF256A7G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same MAX 10 FPGA family, which is essential for pinout, toolchain, and IP compatibility. |
| Logic Elements (LEs) | 50,000 | 50,000 | Matching logic density ensures equivalent capacity for implementing user logic and IP blocks. |
| Embedded Memory | 1,638 Kbits | 1,638 Kbits | Identical on-chip memory supports the same buffering, FIFO, and data storage requirements. |
| Package | 256-pin FBGA | 256-pin FBGA | Same package and pin count allow a common PCB footprint and mechanical compatibility. |
| Operating Temperature Range | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | Different temperature grades affect suitability for industrial versus commercial environments and thermal design margins. |
| Speed Grade | 7 (fastest) | 7 (fastest) | Same speed grade means comparable maximum operating frequency and timing closure characteristics. |
| Configuration Flash Memory | Integrated (single-chip) | Integrated (single-chip) | Both are instant-on, single-chip solutions, eliminating the need for external configuration devices. |
| Analog-to-Digital Converter (ADC) | Yes (12-bit, 1 MSPS) | Yes (12-bit, 1 MSPS) | Integrated ADC enables on-chip analog monitoring and control without external components. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Identical core voltage simplifies power supply design and ensures electrical compatibility. |
| RoHS Compliance | Yes | Yes | Both meet RoHS requirements, supporting use in environmentally regulated markets. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M50DAF256I7G | 10M50DCF256A7G |
|---|---|---|
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Digi Key Programmable | - | Not Verified |
| Total RAM Bits | 1677312 | 1677312 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 125°C (TJ) |
| Number of Logic Elements / Cells | - | 50000 |
| Number of LA Bs / CL Bs | - | 3125 |
| Number of LABs/CLBs | 3125 | - |
| Number of Logic Elements/Cells | 50000 | - |
Frequently asked questions
What are the key differences between the Intel MAX 10 10M50DAF256I7G and 10M50DCF256A7G FPGAs?
Both devices are Intel MAX 10 FPGAs in the 256-pin FineLine BGA (FBGA) package with 50,000 logic elements (LEs). The primary differences are the speed grade and the on-chip configuration memory type. The 10M50DAF256I7G has a speed grade of 7 (I7) and uses flash-based configuration memory (indicated by the "A" in the ordering code), while the 10M50DCF256A7G has a speed grade of 7 (A7) and uses SRAM-based configuration memory (indicated by the "C" in the ordering code). The "D" in both part numbers indicates the MAX 10 family with dual configuration image support. The "F256" denotes the 256-pin FBGA package. The 10M50DAF256I7G is specified for industrial temperature range (I), whereas the 10M50DCF256A7G is specified for commercial temperature range (A). These differences affect configuration methodology, power-up behavior, and operating temperature range.
Are the 10M50DAF256I7G and 10M50DCF256A7G pin-compatible?
Yes, both devices use the same 256-pin FineLine BGA (FBGA) package with identical pinouts as defined by Intel for the MAX 10 10M50 device family. However, pin compatibility does not guarantee functional equivalence. The configuration memory type differs (flash vs. SRAM), which affects the configuration scheme, external configuration circuitry requirements, and instant-on capability. Designers must verify the configuration interface and any dedicated configuration pins against the respective device datasheets before considering a direct board-level swap.
What is the difference in configuration memory between the 10M50DAF256I7G and 10M50DCF256A7G?
The 10M50DAF256I7G features flash-based configuration memory (the "A" suffix in the ordering code), which allows the device to be configured instantly at power-up without an external configuration device. The 10M50DCF256A7G uses SRAM-based configuration memory (the "C" suffix), which requires an external configuration source such as a serial flash or a host controller to load the configuration bitstream at power-up. This difference impacts board design, bill of materials, and system startup time.
What are the operating temperature ranges for the 10M50DAF256I7G and 10M50DCF256A7G?
The 10M50DAF256I7G is rated for the industrial temperature range, typically specified as -40°C to +100°C junction temperature (Tj) per Intel MAX 10 datasheet. The 10M50DCF256A7G is rated for the commercial temperature range, typically specified as 0°C to +85°C junction temperature (Tj). These temperature grades are denoted by the "I" and "A" in the respective ordering codes. Designers must ensure the selected device meets the thermal requirements of the target application.
Can the 10M50DAF256I7G and 10M50DCF256A7G be used interchangeably in an existing design?
No, they cannot be used interchangeably without design changes. Although both are 50,000-LE MAX 10 FPGAs in the same 256-pin FBGA package, the differences in configuration memory type (flash vs. SRAM), temperature grade (industrial vs. commercial), and configuration scheme require verification of the power-up sequence, external configuration circuitry, and thermal management. The 10M50DAF256I7G supports instant-on configuration from internal flash, while the 10M50DCF256A7G requires an external configuration device. A direct substitution would require revalidating the configuration interface, power sequencing, and operating conditions against the target design requirements.
What speed grade do the 10M50DAF256I7G and 10M50DCF256A7G use?
Both devices use speed grade 7. In the Intel MAX 10 ordering code, the speed grade is indicated by the digit following the temperature grade letter. For the 10M50DAF256I7G, the "7" after "I" denotes speed grade 7 for the industrial temperature range. For the 10M50DCF256A7G, the "7" after "A" denotes speed grade 7 for the commercial temperature range. Speed grade 7 is the faster of the available speed grades for the MAX 10 10M50 device family, offering higher performance compared to speed grade 8 or 9, but with correspondingly higher power consumption.
What are the logic density and package specifications for the 10M50DAF256I7G and 10M50DCF256A7G?
Both devices have 50,000 logic elements (LEs), which is denoted by the "10M50" prefix in the part number. Both are housed in a 256-pin FineLine BGA (FBGA) package, indicated by "F256" in the ordering code. The MAX 10 10M50 device family typically includes 1,638 Kbits of M9K memory, 288 embedded 18x18 multipliers, and up to 500 user I/O pins depending on package. The 256-pin FBGA package provides a specific subset of these resources. Designers should consult the Intel MAX 10 device datasheet for the exact resource counts and pin assignments for the 256-pin FBGA package.
Which device is better for applications requiring instant-on operation?
The 10M50DAF256I7G is better suited for instant-on applications because it uses flash-based configuration memory, which allows the device to be configured immediately at power-up without waiting for an external configuration source. The 10M50DCF256A7G uses SRAM-based configuration memory and requires an external configuration device, resulting in a longer configuration time at power-up. For applications such as system control, power sequencing, or human-machine interfaces where rapid startup is critical, the flash-based 10M50DAF256I7G is the appropriate choice.