5CEBA4F23C8N vs 5CEBA2U15I7

Dieser detaillierte Vergleich von 5CEBA4F23C8N und 5CEBA2U15I7 bietet wertvolle Einblicke in deren Spezifikationen und Hauptmerkmale. Wir gehen ausführlich auf wichtige Faktoren ein, darunter RoHS-Konformität, REACH-Status, Serie, Montageart, Gehäusetyp und weitere relevante Eigenschaften. Die übersichtliche Darstellung der Unterschiede vereinfacht die Komponentenauswahl und erleichtert Ihnen die Wahl der optimalen Lösung für Ihre Anwendung.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Not a drop-in replacement

The 5CEBA4F23C8N and 5CEBA2U15I7 are not functionally interchangeable. They differ in logic density, package type, operating temperature grade, and speed grade, so the 5CEBA2U15I7 cannot directly replace the 5CEBA4F23C8N without a full design and PCB revision.

Different logic density Different package type Different temperature grade Different speed grade

Parts at a glance

Part A

5CEBA4F23C8N

Intel

Lifecycle
Active
Stock
6956 Stückzahl
Package
FBGA-484
Series
Embedded feFPGAs (Field Programmable Gate Array)
Part B

5CEBA2U15I7

Intel

Lifecycle
Active
Stock
8242 Stückzahl
Package
LFBGA-324
Series
Embedded feFPGAs (Field Programmable Gate Array)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 5CEBA4F23C8N 5CEBA2U15I7 Why it matters
Family / Series Cyclone V E Cyclone V E Same FPGA family ensures toolchain, IP, and pinout compatibility for migration.
Logic Elements (LE) 49,000 25,000 LE count determines available logic capacity; a large difference limits direct design portability.
Total RAM Bits 3,153,920 1,536,000 Embedded memory affects buffering, FIFO depth, and on-chip data storage capability.
Number of I/Os 224 176 I/O count limits peripheral and interface expansion; fewer pins may force redesign.
Package / Case 484-FBGA (23x23) 324-UBGA (15x15) Different package and footprint prevent drop-in replacement on the same PCB.
Operating Temperature 0°C to 85°C (Commercial) -40°C to 100°C (Industrial) Temperature grade determines suitability for industrial versus commercial environments.
Speed Grade 8 7 Speed grade affects maximum clock frequency and timing closure of the design.
Supply Voltage 1.07V to 1.13V core 1.07V to 1.13V core Core voltage compatibility is required for power rail design and level shifting.
Transceiver Count 0 0 Absence of high-speed transceivers limits use in serial protocol applications.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 5CEBA4F23C8N 5CEBA2U15I7
Supplier - Intel
Series Cyclone® V E Cyclone® V E
Part Status Active Active
Number of LABs/CLBs 18480 9434
Number of Logic Elements/Cells 49000 25000
Total RAM Bits 3464192 2002944
Number of I/O 224 176
Voltage - Supply 1.07V ~ 1.13V 1.07V ~ 1.13V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ)

Frequently asked questions

What are the key differences between the 5CEBA4F23C8N and the 5CEBA2U15I7?

The 5CEBA4F23C8N is a Cyclone V E FPGA with 49,000 logic elements, 23 mm x 23 mm FBGA-484 package, and commercial temperature grade (0°C to 85°C). The 5CEBA2U15I7 is a Cyclone V E FPGA with 25,000 logic elements, 15 mm x 15 mm UBGA-324 package, and industrial temperature grade (-40°C to 100°C). They differ in logic density, package footprint, I/O count, and operating temperature range.

Are the 5CEBA4F23C8N and 5CEBA2U15I7 pin-to-pin compatible?

No. The 5CEBA4F23C8N uses a 484-ball FBGA package (23 mm x 23 mm), while the 5CEBA2U15I7 uses a 324-ball UBGA package (15 mm x 15 mm). The ball counts, pitches, and footprints differ, so they are not pin-to-pin or footprint compatible.

Can the 5CEBA2U15I7 be used as a direct substitute for the 5CEBA4F23C8N?

No. The 5CEBA2U15I7 has fewer logic elements (25,000 vs 49,000), fewer user I/Os, a smaller package, and a different temperature grade. A direct substitution would require a complete redesign of the PCB, power delivery, and logic utilization to fit the reduced resources.

What temperature grades do the 5CEBA4F23C8N and 5CEBA2U15I7 support?

The 5CEBA4F23C8N is specified for commercial temperature operation (0°C to 85°C junction temperature). The 5CEBA2U15I7 is specified for industrial temperature operation (-40°C to 100°C junction temperature). The industrial-grade device is suitable for harsher environments.

Do both devices belong to the same FPGA family and use the same configuration method?

Yes. Both are Intel (Altera) Cyclone V E FPGAs. They share the same configuration architecture, including support for active serial, passive serial, and JTAG configuration schemes, and use the same Quartus Prime development software. However, the configuration bitstream is device-specific and not interchangeable.

How do the logic element counts and embedded resources compare between the two devices?

The 5CEBA4F23C8N provides 49,000 logic elements, 3,080 Kbits of embedded memory, and 132 18x18 multipliers. The 5CEBA2U15I7 provides 25,000 logic elements, 1,640 Kbits of embedded memory, and 66 18x18 multipliers. The larger device offers roughly double the logic, memory, and DSP resources.

Which device is better suited for space-constrained industrial applications?

The 5CEBA2U15I7 is better suited for space-constrained industrial applications because it comes in a smaller 15 mm x 15 mm UBGA-324 package and supports the industrial temperature range (-40°C to 100°C). The 5CEBA4F23C8N is larger and limited to commercial temperature operation.

Are power supply requirements identical for the 5CEBA4F23C8N and 5CEBA2U15I7?

Both devices require the Cyclone V E standard power rails, including VCCINT (1.1 V), VCCAUX (2.5 V), and VCCIO (variable, typically 1.2 V to 3.3 V). However, actual current requirements differ because the 5CEBA4F23C8N has higher logic density and more I/Os, resulting in higher power consumption than the 5CEBA2U15I7. Designers must verify power estimates using the Intel Early Power Estimator for each specific device.