Part A
5CEBA7F23C7N
Intel
- Lifecycle
- Active
- Stock
- 4498 Stückzahl
- Package
- FBGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEBA7F23C7N and 5CEBA2U19C7N are not drop-in replacements for one another. They differ in logic density, package type, and I/O pin count, making them suitable for different design requirements rather than interchangeable use.
Different logic density
Different package type
Different I/O count
Different footprint
Parts at a glance
Part B
5CEBA2U19C7N
Intel
- Lifecycle
- Active
- Stock
- 7477 Stückzahl
- Package
- FBGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA7F23C7N | 5CEBA2U19C7N | Why it matters |
|---|---|---|---|
| Family | Cyclone V E FPGA | Cyclone V E FPGA | Same device family ensures toolchain and IP compatibility, but logic density differs. |
| Logic Elements (LE) | 149,500 | 25,000 | LE count determines the amount of digital logic that can be implemented; a large mismatch prevents direct substitution. |
| Adaptive Logic Modules (ALM) | 56,480 | 9,440 | ALMs are the fundamental logic building blocks; fewer ALMs limit design capacity. |
| Embedded Memory (M10K) | 6,860 Kb | 1,760 Kb | On-chip memory affects buffering, FIFO depth, and data storage capability. |
| 18x18 Multipliers | 312 | 72 | DSP blocks are critical for arithmetic-intensive applications like filtering and FFT. |
| Package | FBGA-484 | UBGA-484 | Different package types affect PCB footprint, thermal performance, and assembly. |
| User I/O Count | 224 | 224 | I/O count determines how many external signals can be interfaced. |
| Speed Grade | 7 | 7 | Speed grade affects maximum operating frequency and timing closure. |
| Operating Temperature | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Temperature range must match the target application environment. |
| Supply Voltage | 1.1 V Core | 1.1 V Core | Core voltage must be compatible with the board power design. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA7F23C7N | 5CEBA2U19C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 56480 | 9434 |
| Number of Logic Elements/Cells | 149500 | 25000 |
| Total RAM Bits | 7880704 | 2002944 |
| Number of I/O | 240 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the 5CEBA7F23C7N and 5CEBA2U19C7N devices?
Both are Intel (formerly Altera) Cyclone V E FPGA devices. The 5CEBA7F23C7N is a Cyclone V E FPGA with 150,000 logic elements in a 484-pin FBGA package, while the 5CEBA2U19C7N is a Cyclone V E FPGA with 25,000 logic elements in a 484-pin UBGA package. Both are specified with a C7 speed grade and are lead-free (N suffix).
How do the logic densities of the 5CEBA7F23C7N and 5CEBA2U19C7N compare?
The 5CEBA7F23C7N contains 150,000 logic elements (LEs), whereas the 5CEBA2U19C7N contains 25,000 LEs. This represents a 6:1 ratio in logic capacity, making the 5CEBA7F23C7N suitable for significantly larger designs.
Are the 5CEBA7F23C7N and 5CEBA2U19C7N pin-compatible?
No. The 5CEBA7F23C7N uses a 484-pin FBGA (FineLine BGA) package, while the 5CEBA2U19C7N uses a 484-pin UBGA (Ultra FineLine BGA) package. These are distinct package types with different ball pitches, dimensions, and PCB land patterns, so they are not drop-in replacements for each other.
Do the 5CEBA7F23C7N and 5CEBA2U19C7N have the same speed grade?
Yes. Both devices are specified with the C7 speed grade, which indicates the same core speed binning within the Cyclone V E family. However, actual achievable performance depends on the specific design, resource utilization, and I/O timing requirements.
Can the 5CEBA2U19C7N be used as a substitute for the 5CEBA7F23C7N in an existing design?
No, not directly. The 5CEBA2U19C7N has only 25,000 LEs versus 150,000 LEs in the 5CEBA7F23C7N, and the package type differs (UBGA vs FBGA). A design targeting the 5CEBA7F23C7N would likely exceed the logic capacity of the 5CEBA2U19C7N and would not fit the same PCB footprint without redesign.
What are the typical applications for the 5CEBA7F23C7N versus the 5CEBA2U19C7N?
The 5CEBA7F23C7N, with its higher logic density, is typically used in more complex applications such as industrial motor control, image processing, and high-speed communication interfaces. The 5CEBA2U19C7N, with lower density and a smaller UBGA package, is better suited for space-constrained, lower-complexity designs such as sensor fusion, simple protocol bridging, and portable embedded systems.
Are the 5CEBA7F23C7N and 5CEBA2U19C7N lead-free and RoHS compliant?
Yes. Both devices carry the "N" suffix in their part numbers, which indicates lead-free (Pb-free) construction and RoHS compliance according to Intel's Cyclone V device ordering information.
Do both devices support the same configuration and transceiver options?
Both are Cyclone V E devices and share the same family architecture, including support for configuration via active serial, passive serial, and JTAG. However, the 5CEBA7F23C7N and 5CEBA2U19C7N differ in available user I/O count, number of transceiver channels, and embedded memory blocks due to their different logic densities and package types. Designers must consult the respective device pin-out and datasheet for exact resource availability.