Part A
5CEBA7F23C8N
Intel
- Lifecycle
- Active
- Stock
- 6287 Stückzahl
- Package
- FBGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEBA7F23C8N and 5CEBA2U19C7N are not drop-in replacements for each other. They differ in logic density, package type, and operating temperature grade, making them suitable for different design requirements rather than direct substitution.
Different logic density
Different package type
Different temperature grade
Different pin count
Parts at a glance
Part B
5CEBA2U19C7N
Intel
- Lifecycle
- Active
- Stock
- 7477 Stückzahl
- Package
- FBGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA7F23C8N | 5CEBA2U19C7N | Why it matters |
|---|---|---|---|
| Family / Series | Cyclone V E | Cyclone V E | Same device family ensures toolchain, IP, and pinout conventions are compatible for substitution. |
| Logic Elements (LE) | 149,500 | 25,000 | Logic capacity determines whether a design fits; a smaller device cannot host a design requiring more LEs. |
| Package | FBGA-484 | UBGA-484 | Package type affects PCB footprint, assembly, and thermal characteristics; different packages are not drop-in compatible. |
| Speed Grade | 8 | 7 | Speed grade determines maximum operating frequency and timing closure; a slower grade may not meet design timing. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Temperature range must match the application environment for reliable operation. |
| Supply Voltage (Core) | 1.1 V | 1.1 V | Core voltage must match the board power design; mismatched core voltage can damage the device. |
| Embedded Memory (M10K) | 6,860 Kb | 1,760 Kb | On-chip memory affects buffering, FIFO depth, and whether a design fits without external memory. |
| Number of I/O Pins | 224 | 224 | I/O count determines how many peripherals and interfaces can be connected simultaneously. |
| Embedded Multipliers (18x18) | 312 | 66 | DSP blocks are essential for arithmetic-intensive tasks like filtering and signal processing. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA7F23C8N | 5CEBA2U19C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 56480 | 9434 |
| Number of Logic Elements/Cells | 149500 | 25000 |
| Total RAM Bits | 7880704 | 2002944 |
| Number of I/O | 240 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the 5CEBA7F23C8N and 5CEBA2U19C7N devices?
Both are Intel (formerly Altera) Cyclone V GX FPGA devices. The 5CEBA7F23C8N is a Cyclone V GX FPGA with 149,500 logic elements in a 484-pin FBGA package, while the 5CEBA2U19C7N is a Cyclone V GX FPGA with 25,000 logic elements in a 484-pin UBGA package.
What is the difference in logic density between the 5CEBA7F23C8N and 5CEBA2U19C7N?
The 5CEBA7F23C8N provides 149,500 logic elements (LEs), whereas the 5CEBA2U19C7N provides 25,000 LEs. The 5CEBA7F23C8N therefore offers approximately six times the logic capacity of the 5CEBA2U19C7N.
Are the 5CEBA7F23C8N and 5CEBA2U19C7N pin-compatible?
No. The 5CEBA7F23C8N uses a 484-pin FBGA package, while the 5CEBA2U19C7N uses a 484-pin UBGA package. These are different package types with different ball maps and PCB land patterns, so they are not pin-compatible.
What is the speed grade difference between the 5CEBA7F23C8N and 5CEBA2U19C7N?
The 5CEBA7F23C8N has a speed grade of 8, and the 5CEBA2U19C7N has a speed grade of 7. In Intel Cyclone V FPGA ordering codes, a lower speed grade number indicates a faster device, so the 5CEBA2U19C7N (grade 7) is the faster speed grade of the two.
Can the 5CEBA2U19C7N be used as a direct drop-in replacement for the 5CEBA7F23C8N?
No. The two devices differ in logic density (25,000 LEs vs. 149,500 LEs), package type (UBGA vs. FBGA), and speed grade (7 vs. 8). A direct drop-in replacement is not possible without redesigning the PCB and revalidating the logic design.
Do both the 5CEBA7F23C8N and 5CEBA2U19C7N belong to the same FPGA family?
Yes. Both devices are members of the Intel Cyclone V GX FPGA family, which shares the same architecture, transceiver technology, and configuration methodology across density variants.
What is the operating temperature range for the 5CEBA7F23C8N and 5CEBA2U19C7N?
Both the 5CEBA7F23C8N and 5CEBA2U19C7N are specified for commercial temperature operation, typically 0°C to 85°C junction temperature, as indicated by the C in their ordering codes. Industrial-temperature versions would carry a different suffix.
Which device is better suited for high-logic-density applications?
The 5CEBA7F23C8N is better suited for high-logic-density applications because it provides 149,500 logic elements, compared to 25,000 logic elements in the 5CEBA2U19C7N. The 5CEBA2U19C7N is more appropriate for lower-density, cost-sensitive designs.