Part A
5CEFA4F23I7N
Intel
- Lifecycle
- Active
- Stock
- 6968 Stückzahl
- Package
- FBGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEFA4F23I7N and 5CEFA2M13C6N are not drop-in replacements for each other. They differ in logic density, package footprint, speed grade, and operating temperature range, so a direct substitution would require a full board redesign and timing re-qualification.
Different logic density
Different package footprint
Different speed grade
Different temperature grade
Parts at a glance
Part B
5CEFA2M13C6N
Intel
- Lifecycle
- Active
- Stock
- 4768 Stückzahl
- Package
- TFBGA-383
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA4F23I7N | 5CEFA2M13C6N | Why it matters |
|---|---|---|---|
| Family / Series | Cyclone V E | Cyclone V E | Same FPGA family ensures toolchain, IP, and pinout compatibility for substitution. |
| Logic Elements (LE) | 49,000 | 25,000 | Logic capacity determines whether a design fits; a smaller device may not accommodate the same logic. |
| Package | FBGA-484 | MBGA-383 | Different packages require different PCB footprints and cannot be drop-in replaced. |
| Operating Temperature Range | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | Temperature grade affects reliability in harsh environments and suitability for industrial vs commercial use. |
| Speed Grade | 7 (faster) | 6 (slower) | Speed grade impacts maximum operating frequency and timing closure for high-performance designs. |
| Number of I/O Pins | 224 | 175 | I/O count limits peripheral connectivity and interface options for a given design. |
| Embedded Memory (M10K blocks) | 308 | 140 | On-chip memory affects buffering, FIFO depth, and data storage capability within the FPGA. |
| Number of PLLs | 4 | 4 | PLLs provide clock synthesis and management; identical count supports similar clocking architectures. |
| Supply Voltage (Core) | 1.1 V | 1.1 V | Core voltage must match for power supply design and compatibility with existing power rails. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA4F23I7N | 5CEFA2M13C6N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 18480 | 9434 |
| Number of Logic Elements/Cells | 49000 | 25000 |
| Total RAM Bits | 3464192 | 2002944 |
| Number of I/O | 224 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA4F23I7N and the 5CEFA2M13C6N?
The 5CEFA4F23I7N is a Cyclone V FPGA with 49,000 logic elements, 2,910 Kbits of embedded memory, and 224 18x18 multipliers in a 484-pin FBGA package, rated for industrial temperature range (I7). The 5CEFA2M13C6N is a Cyclone V FPGA with 25,000 logic elements, 1,530 Kbits of embedded memory, and 112 18x18 multipliers in a 383-pin Micro FBGA package, rated for commercial temperature range (C6).
Are the 5CEFA4F23I7N and 5CEFA2M13C6N pin-to-pin compatible?
No. The 5CEFA4F23I7N uses a 484-pin FBGA package, while the 5CEFA2M13C6N uses a 383-pin Micro FBGA package. The different package sizes, pin counts, and ball maps prevent direct pin-to-pin compatibility.
Can the 5CEFA2M13C6N be used as a direct drop-in replacement for the 5CEFA4F23I7N?
No. The two devices differ in logic density, embedded memory, multiplier count, package footprint, and temperature grade. A direct drop-in replacement is not possible without redesigning the PCB and revalidating the design against the target device specifications.
What are the operating temperature ranges for these two FPGAs?
The 5CEFA4F23I7N is specified for the industrial temperature grade, typically -40°C to 100°C junction temperature. The 5CEFA2M13C6N is specified for the commercial temperature grade, typically 0°C to 85°C junction temperature. Refer to the Intel Cyclone V device datasheet for exact operating conditions.
Do both devices belong to the same FPGA family?
Yes. Both the 5CEFA4F23I7N and the 5CEFA2M13C6N are members of the Intel Cyclone V FPGA family, specifically the E variant with logic and memory features. They share the same architecture and IP ecosystem but differ in density, package, and speed grade.
What are the speed grade differences between the 5CEFA4F23I7N and the 5CEFA2M13C6N?
The 5CEFA4F23I7N has a speed grade of 7 (I7), while the 5CEFA2M13C6N has a speed grade of 6 (C6). A lower speed grade number generally indicates faster performance in Intel FPGA nomenclature, but the actual achievable frequency depends on the specific design, routing, and operating conditions.
Which device offers more embedded memory and multipliers?
The 5CEFA4F23I7N offers more resources, with 2,910 Kbits of embedded memory and 224 18x18 multipliers. The 5CEFA2M13C6N provides 1,530 Kbits of embedded memory and 112 18x18 multipliers. The 5CEFA4F23I7N is the larger device in both logic and memory resources.
Are the configuration and transceiver options the same for both devices?
No. The 5CEFA4F23I7N and 5CEFA2M13C6N differ in available transceiver channels, configuration schemes, and I/O bank counts due to their different package sizes and device densities. Designers must consult the respective device pin-out files and datasheets to confirm configuration and transceiver availability.