Part A
5CEFA2F23C7N
Altera
- Lifecycle
- Active
- Stock
- 9580 Stückzahl
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEFA7F27I7N and 5CEFA2F23C7N are not drop-in replacements for each other. The 5CEFA7F27I7N offers significantly higher logic density, more transceiver channels, and a larger package footprint, while the 5CEFA2F23C7N provides a lower-cost, lower-power alternative with fewer resources. Designers must verify logic capacity, I/O count, transceiver requirements, and PCB layout compatibility before considering substitution.
Different logic density
Different transceiver count
Different package footprint
Different I/O count
Parts at a glance
Part B
5CEFA7F27I7N
Intel
- Lifecycle
- Active
- Stock
- 6696 Stückzahl
- Package
- BGA-672
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA7F27I7N | 5CEFA2F23C7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 150000 | 25000 | Logic element count determines the maximum complexity of digital logic that can be implemented, directly affecting whether a design fits on the device. |
| Total RAM Bits | 7880704 | 1945600 | Embedded memory capacity limits on-chip buffering, FIFO depth, and data storage, which is critical for memory-intensive applications. |
| Number of I/Os | 336 | 224 | Available I/O pins determine how many external interfaces and peripherals can be connected to the FPGA. |
| Package / Case | 672-BGA (27x27) | 484-FBGA (23x23) | Package footprint and ball count affect PCB layout, routing density, and mechanical compatibility with the target board. |
| Operating Temperature Range | -40°C to 100°C (TJ) | 0°C to 85°C (TJ) | Temperature grade determines suitability for industrial versus commercial environments and affects reliability under thermal stress. |
| Speed Grade | 7 (Fastest) | 7 (Fastest) | Speed grade influences maximum achievable clock frequency and timing closure margins for high-performance designs. |
| Supply Voltage - Core | 1.07V to 1.13V | 1.07V to 1.13V | Core voltage must match the board power design; incorrect voltage can damage the device or cause unreliable operation. |
| Number of LABs / CLBs | 56480 | 9430 | Logic array blocks define the granularity of programmable logic resources and impact placement and routing efficiency. |
| Mounting Type | Surface Mount | Surface Mount | Mounting type must match the assembly process and PCB pad design for reliable soldering and mechanical attachment. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA2F23C7N | 5CEFA7F27I7N |
|---|---|---|
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Digi Key Programmable | Not Verified | - |
| Total RAM Bits | 2002944 | 7880704 |
| Number of I/O | 224 | 336 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
| Base Product Number | 5CEFA2 | - |
| Number of Logic Elements / Cells | 25000 | - |
| Number of LA Bs / CL Bs | 9434 | - |
| Number of LABs/CLBs | - | 56480 |
| Number of Logic Elements/Cells | - | 149500 |
Frequently asked questions
What are the key differences between the 5CEFA7F27I7N and the 5CEFA2F23C7N?
The 5CEFA7F27I7N and 5CEFA2F23C7N are both Intel (formerly Altera) Cyclone V F-series FPGAs, but they differ in logic density, package, and speed grade. The 5CEFA7F27I7N offers approximately 149,500 logic elements (LEs) in a 672-pin FBGA package with an industrial temperature grade and speed grade 7. The 5CEFA2F23C7N offers approximately 24,900 LEs in a 484-pin FBGA package with a commercial temperature grade and speed grade 7. These differences affect logic capacity, I/O count, power, and target applications.
Are the 5CEFA7F27I7N and 5CEFA2F23C7N pin-to-pin compatible?
No. The 5CEFA7F27I7N uses a 672-pin FBGA package, while the 5CEFA2F23C7N uses a 484-pin FBGA package. The different pin counts and ball maps mean they are not pin-to-pin compatible and cannot be interchanged on the same PCB footprint without a redesign.
Can the 5CEFA2F23C7N be used as a direct drop-in replacement for the 5CEFA7F27I7N?
No. A direct drop-in replacement is not possible because the two devices differ in package (484-pin FBGA vs. 672-pin FBGA), logic density (approximately 24,900 LEs vs. 149,500 LEs), and temperature grade (commercial vs. industrial). Any substitution requires a full design review, including pinout, resource utilization, power, and thermal validation against the target application.
What are the logic element (LE) counts for the 5CEFA7F27I7N and 5CEFA2F23C7N?
According to Intel Cyclone V device documentation, the 5CEFA7F27I7N contains approximately 149,500 logic elements (LEs), while the 5CEFA2F23C7N contains approximately 24,900 LEs. The higher LE count of the 5CEFA7F27I7N supports more complex logic designs, whereas the 5CEFA2F23C7N is suited to lower-density applications.
What temperature grades do the 5CEFA7F27I7N and 5CEFA2F23C7N support?
The 5CEFA7F27I7N is specified with an industrial temperature grade, denoted by the "I" in its part number, and is intended for operation over the industrial temperature range. The 5CEFA2F23C7N is specified with a commercial temperature grade, denoted by the "C" in its part number, and is intended for commercial temperature range operation. The exact operating temperature ranges should be confirmed in the respective Intel Cyclone V datasheets.
Do the 5CEFA7F27I7N and 5CEFA2F23C7N have the same speed grade?
Yes. Both the 5CEFA7F27I7N and the 5CEFA2F23C7N are specified with speed grade 7, indicated by the "7" in their part numbers. However, overall timing performance also depends on device density, package, and operating conditions, so timing closure must be verified for each specific design.
What package types are used by the 5CEFA7F27I7N and 5CEFA2F23C7N?
The 5CEFA7F27I7N is offered in a 672-pin FBGA package, while the 5CEFA2F23C7N is offered in a 484-pin FBGA package. The different package sizes and ball counts affect available user I/O, PCB layout, and thermal performance.
Which device is more suitable for high-density logic applications?
The 5CEFA7F27I7N is more suitable for high-density logic applications because it provides approximately 149,500 logic elements, significantly more than the approximately 24,900 logic elements of the 5CEFA2F23C7N. The larger device also offers more embedded memory and DSP resources, making it better suited to complex processing tasks.
Are the 5CEFA7F27I7N and 5CEFA2F23C7N part of the same FPGA family?
Yes. Both the 5CEFA7F27I7N and the 5CEFA2F23C7N belong to the Intel Cyclone V F-series FPGA family. They share the same architecture and feature set but differ in logic density, package, and temperature grade, which determines their appropriate use cases.