Part A
5CEFA9F27I7N
Intel
- Lifecycle
- Active
- Stock
- 7586 Stückzahl
- Package
- BGA-672
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEFA9F27I7N and 5CEFA2M13I7N are not functionally interchangeable. The 5CEFA9F27I7N offers substantially higher logic density, a larger embedded memory footprint, and a greater number of high-speed transceivers, while the 5CEFA2M13I7N provides a much smaller, lower-power solution in a compact package. These differences in logic capacity, memory resources, transceiver count, and physical footprint make direct substitution impractical without a complete redesign of the target application.
Different logic density
Different memory resources
Different transceiver count
Different package footprint
Parts at a glance
Part B
5CEFA2M13I7N
Intel
- Lifecycle
- Active
- Stock
- 6649 Stückzahl
- Package
- TFBGA-383
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F27I7N | 5CEFA2M13I7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 301000 | 25000 | Logic element count determines the amount of programmable logic available, directly affecting the complexity of designs each device can implement. |
| Total RAM Bits | 14251008 | 1945600 | Embedded memory capacity affects the ability to store data, buffers, and large lookup structures on-chip without external memory. |
| Number of I/O | 336 | 224 | I/O count determines how many external signals and peripherals the device can interface with in a system. |
| Package / Case | 672-BGA (27x27) | 383-MBGA (13x13) | Package size and pin count affect PCB layout, board space, and mechanical compatibility for drop-in substitution. |
| Number of LABs/CLBs | 113560 | 9434 | Logic array blocks define the granularity of programmable logic resources and influence achievable design density. |
| Operating Temperature | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) | Temperature range determines suitability for industrial versus commercial environments and thermal design requirements. |
| Voltage - Supply | 1.07V to 1.13V | 1.07V to 1.13V | Core supply voltage must match the board power design for correct operation and electrical compatibility. |
| Mounting Type | Surface Mount | Surface Mount | Mounting type must match the assembly process and PCB footprint for physical compatibility. |
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Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA9F27I7N | 5CEFA2M13I7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 113560 | 9434 |
| Number of Logic Elements/Cells | 301000 | 25000 |
| Total RAM Bits | 14251008 | 2002944 |
| Number of I/O | 336 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA9F27I7N and the 5CEFA2M13I7N?
The 5CEFA9F27I7N and 5CEFA2M13I7N are both Intel (formerly Altera) Cyclone V F-series FPGAs, but they differ in logic density, package, and I/O count. The 5CEFA9F27I7N offers a larger logic array with 301,000 logic elements (LEs) in a 672-pin FBGA package (27 mm x 27 mm), while the 5CEFA2M13I7N provides 25,000 LEs in a 383-pin Micro FBGA package (13 mm x 13 mm). These differences affect available user I/O, memory resources, and suitable application complexity.
Are the 5CEFA9F27I7N and 5CEFA2M13I7N pin-to-pin compatible?
No. The 5CEFA9F27I7N uses a 672-pin FBGA package (F27) with a 27 mm x 27 mm body, while the 5CEFA2M13I7N uses a 383-pin Micro FBGA package (M13) with a 13 mm x 13 mm body. The package sizes, pin counts, and ball maps are different, so they are not pin-to-pin compatible and cannot be interchanged on the same PCB footprint without redesign.
Can the 5CEFA2M13I7N be used as a direct drop-in replacement for the 5CEFA9F27I7N?
No. A direct drop-in replacement is not possible because the two devices differ in package type, pin count, physical dimensions, logic capacity, and I/O resources. The 5CEFA9F27I7N has significantly more logic elements and user I/O than the 5CEFA2M13I7N. Any substitution would require a complete redesign of the PCB, power delivery, and configuration circuitry, followed by full design re-validation.
What are the logic element counts for the 5CEFA9F27I7N and 5CEFA2M13I7N?
According to Intel Cyclone V device documentation, the 5CEFA9F27I7N contains 301,000 logic elements (LEs), while the 5CEFA2M13I7N contains 25,000 LEs. This roughly twelve-fold difference in logic density means the 5CEFA9F27I7N can implement substantially larger and more complex digital designs than the 5CEFA2M13I7N.
What package types and sizes do the 5CEFA9F27I7N and 5CEFA2M13I7N use?
The 5CEFA9F27I7N is supplied in a 672-pin FBGA package with a 27 mm x 27 mm body (package code F27). The 5CEFA2M13I7N is supplied in a 383-pin Micro FBGA package with a 13 mm x 13 mm body (package code M13). The smaller Micro FBGA package of the 5CEFA2M13I7N makes it suitable for space-constrained designs, while the larger F27 package of the 5CEFA9F27I7N accommodates more I/O and power pins.
Do both devices support the same configuration and transceiver features?
Both the 5CEFA9F27I7N and 5CEFA2M13I7N belong to the Intel Cyclone V F-series family and share the same configuration scheme options, including active serial, passive serial, and JTAG configuration. However, the number of available transceiver channels and high-speed interfaces differs by device density and package. The 5CEFA9F27I7N, with its larger package and higher logic count, supports more transceiver channels and I/O banks than the 5CEFA2M13I7N. Designers must consult the specific device pin-out files and transceiver channel maps for each part number.
Which applications are better suited for the 5CEFA9F27I7N versus the 5CEFA2M13I7N?
The 5CEFA9F27I7N, with 301,000 LEs and a 672-pin package, is better suited for complex, high-bandwidth applications such as advanced image processing, high-performance computing acceleration, and multi-channel communication systems. The 5CEFA2M13I7N, with 25,000 LEs and a compact 13 mm x 13 mm package, is better suited for cost-sensitive, space-constrained designs such as portable devices, simple motor control, and basic interface bridging. Selection should be based on required logic capacity, I/O count, and board space.
Are the 5CEFA9F27I7N and 5CEFA2M13I7N both RoHS compliant?
Intel Cyclone V devices, including the 5CEFA9F27I7N and 5CEFA2M13I7N, are offered in lead-free, RoHS-compliant packages as standard. However, compliance status can vary by specific ordering code and date code. Designers should verify the RoHS and lead-free status for the exact part number and suffix on the manufacturer's product page or the distributor's environmental documentation before finalizing a design.