Part A
5CSEBA4U19C8SN
Intel
- Lifecycle
- Active
- Stock
- 2488 Stückzahl
- Package
- FBGA-484
- Series
- Embedded.System On Chip (SoC)
Replacement verdict
Compatible functional replacement candidate
The 5CSEBA4U23C8SN and 5CSEBA4U19C8SN are both Intel Cyclone V SE SoC FPGA devices sharing the same logic density, ARM Cortex-A9 dual-core subsystem, and C8 speed grade, making them functionally interchangeable at the device level. The primary distinction is the package footprint, which requires PCB layout validation before substitution.
Logic Density
High match
Package Type
Not compatible
Speed Grade
High match
Operating Temperature
High match
Parts at a glance
Part B
5CSEBA4U23C8SN
Intel
- Lifecycle
- Active
- Stock
- 3166 Stückzahl
- Package
- FBGA-672
- Series
- Embedded.System On Chip (SoC)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CSEBA4U23C8SN | 5CSEBA4U19C8SN | Why it matters |
|---|---|---|---|
| Package / Case | UBGA-672 | UBGA-484 | Different package footprint and ball count mean the two devices are not drop-in compatible on the same PCB; layout and routing must be redesigned. |
| Number of I/Os | 145 | 66 | The larger package exposes more user I/O, which affects how many peripherals and interfaces can be supported in a design. |
| Operating Temperature Range | 0°C to 85°C (commercial) | 0°C to 85°C (commercial) | Both parts share the same commercial temperature grade, so thermal environment requirements are equivalent. |
| Logic Elements / Cells | 40000 | 40000 | Identical FPGA fabric capacity means both devices offer the same logic density for implementing custom digital functions. |
| Embedded Memory | 270 kbit | 270 kbit | Equal on-chip memory allows the same buffering, FIFO, and data storage capabilities in either device. |
| ARM Hard Processor System | Dual-core ARM Cortex-A9 | Dual-core ARM Cortex-A9 | Both integrate the same HPS, so software and OS support are interchangeable between the two parts. |
| Supply Voltage | 1.1 V core | 1.1 V core | Matching core voltage means power supply design and decoupling requirements are the same for both devices. |
| Transceiver Count | 6 | 3 | Fewer high-speed transceivers on the smaller package limits the number of serial protocols (PCIe, Ethernet, etc.) that can be implemented. |
| Maximum User I/O Banks | 8 | 5 | Different I/O bank counts affect voltage domain flexibility and the number of independent interface standards supported. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CSEBA4U19C8SN | 5CSEBA4U23C8SN |
|---|---|---|
| Series | Cyclone® V SE | Cyclone® V SE |
| Part Status | Active | Active |
| Architecture | MCU, FPGA | MCU, FPGA |
| Core Processor | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| RAM Size | 64KB | 64KB |
| Peripherals | DMA, POR, WDT | DMA, POR, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz | 600MHz |
| Primary Attributes | FPGA - 40K Logic Elements | FPGA - 40K Logic Elements |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the 5CSEBA4U23C8SN and 5CSEBA4U19C8SN devices?
Both are Intel (formerly Altera) Cyclone V SE SoC FPGA devices in the 5CSEBA4 family, combining a dual-core ARM Cortex-A9 hard processor system with FPGA fabric. The 5CSEBA4U23C8SN uses a 672-pin UBGA package (23 mm body), while the 5CSEBA4U19C8SN uses a 484-pin UBGA package (19 mm body). Both are specified with a C8 speed grade and commercial temperature range.
What is the main difference between the 5CSEBA4U23C8SN and 5CSEBA4U19C8SN?
The primary difference is the package and pin count: the 5CSEBA4U23C8SN is a 672-pin UBGA (23 mm) device, and the 5CSEBA4U19C8SN is a 484-pin UBGA (19 mm) device. This affects available user I/O, PCB footprint, and routing resources, while the core logic density, HPS configuration, and speed grade remain in the same 5CSEBA4 C8 family class.
Are the 5CSEBA4U23C8SN and 5CSEBA4U19C8SN pin-to-pin compatible?
No. The 5CSEBA4U23C8SN has a 672-pin UBGA package and the 5CSEBA4U19C8SN has a 484-pin UBGA package. Different package sizes, ball counts, and ball maps prevent direct pin-to-pin compatibility, so a PCB redesign or package-specific layout is required when switching between them.
Do both devices offer the same FPGA logic density and HPS features?
Yes. Both are 5CSEBA4 Cyclone V SE SoC FPGA devices, so they share the same family-level logic density, dual-core ARM Cortex-A9 HPS, and C8 speed grade. The main variation between the two ordering codes is the UBGA package option (23 mm / 672-pin versus 19 mm / 484-pin), not the core FPGA or HPS architecture.
Can the 5CSEBA4U19C8SN be used as a drop-in replacement for the 5CSEBA4U23C8SN?
No. Because the 5CSEBA4U23C8SN is a 672-pin UBGA and the 5CSEBA4U19C8SN is a 484-pin UBGA, they are not drop-in replacements. A replacement requires verifying I/O count, power pin assignments, configuration scheme, and PCB land pattern against the respective Intel Cyclone V device pin-out files and datasheet before any design change.
Which device should be selected when board space is limited?
The 5CSEBA4U19C8SN is the smaller option, using a 19 mm, 484-pin UBGA package, while the 5CSEBA4U23C8SN uses a 23 mm, 672-pin UBGA package. If the design can meet its I/O and interface requirements within the 484-pin package, the 5CSEBA4U19C8SN offers a reduced footprint; otherwise the 672-pin 5CSEBA4U23C8SN provides more package pins for I/O and power/ground.
Are both devices available in the same speed grade and temperature grade?
Yes. Both the 5CSEBA4U23C8SN and 5CSEBA4U19C8SN carry the C8 speed grade suffix and the commercial temperature grade indicated by the ordering code. The difference between the two part numbers is the UBGA package and pin count, not the speed or temperature grade.
What documentation should be checked before comparing these two devices?
Use the Intel Cyclone V device datasheet, the Cyclone V SoC FPGA pin-out files, and the respective ordering information for the 5CSEBA4U23C8SN and 5CSEBA4U19C8SN. These sources provide verified package dimensions, ball counts, I/O availability, power requirements, and configuration details needed for an accurate comparison.