Part A
5PB1102CMGI
Renesas Electronics Corporation
- Lifecycle
- Active
- Stock
- 7057 Stückzahl
- Series
- Clock-Timing, Clock Buffers, Drivers
Replacement verdict
Compatible functional replacement candidate
The 5PB1102CMGI and 5PB1102CMGK8 are functionally equivalent clock buffer ICs from the same manufacturer, sharing identical device architecture, performance characteristics, and electrical specifications. The primary distinction lies in their packaging and ordering format, making them suitable candidates for cross-referencing in designs where board layout and procurement logistics permit package substitution.
Function Type
High match
Package Type
Validation required
Operating Voltage
High match
Operating Temperature
High match
Parts at a glance
Part B
5PB1102CMGK8
Renesas Electronics America Inc.
- Lifecycle
- Active
- Stock
- 9700 Stückzahl
- Package
- UFDFN-8
- Series
- Clock-Timing, Clock Buffers, Drivers
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5PB1102CMGI | 5PB1102CMGK8 | Why it matters |
|---|---|---|---|
| Manufacturer | Renesas Electronics | Renesas Electronics | Same manufacturer ensures consistent design and support. |
| Function | Clock buffer / fanout buffer | Clock buffer / fanout buffer | Identical function is required for direct substitutability. |
| Number of Outputs | 2 | 2 | Output count must match the system's clock distribution needs. |
| Supply Voltage Range | 1.71 V to 3.465 V | 1.71 V to 3.465 V | Compatible supply voltage ensures operation in the same power rail design. |
| Maximum Output Frequency | 200 MHz | 200 MHz | Frequency capability must meet the clock signal requirements. |
| Output Type | LVCMOS | LVCMOS | Output logic type must match the receiving device's input requirements. |
| Package / Case | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-VFDFN Exposed Pad | Different package footprints affect PCB layout and assembly compatibility. |
| Mounting Type | Surface Mount | Surface Mount | Both are surface mount, but package differences still impact board design. |
| Operating Temperature Range | -40°C to 85°C | -40°C to 105°C | Wider temperature range in one variant may suit harsher environments. |
| Packaging / Ordering Suffix | Tube | Tape & Reel | Packaging affects manufacturing handling and inventory management. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5PB1102CMGI | 5PB1102CMGK8 |
|---|---|---|
| Supplier | - | Renesas Electronics America Inc |
| Part Status | Active | Active |
| Type | Fanout Buffer (Distribution) | Fanout Buffer (Distribution) |
| Number of Circuits | 1 | 1 |
| Ratio - Input: Output | 1:2 | 1:2 |
| Differential - Input: Output | No/No | No/No |
| Input | LVCMOS | LVCMOS |
| Output | LVCMOS | LVCMOS |
| Frequency - Max | 200 MHz | 200 MHz |
| Voltage - Supply | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) |
| Mounting Type | Surface Mount | Surface Mount |
| Base Product Number | 5PB1102 | - |
| Packaging | Strip | - |
Frequently asked questions
What are the 5PB1102CMGI and 5PB1102CMGK8 devices?
Both are Renesas 5PB1102 series 1-to-2 differential clock fanout buffers. The 5PB1102CMGI is supplied in an 8-pin SOIC package, while the 5PB1102CMGK8 is supplied in an 8-pin VFQFPN package. Both are specified for 1.8 V, 2.5 V, and 3.3 V operation and support clock frequencies up to 200 MHz.
Are the 5PB1102CMGI and 5PB1102CMGK8 electrically identical?
Yes. Both devices share the same 5PB1102 silicon die and the same electrical specifications, including input/output type, supply voltage range, output frequency, additive phase jitter, and propagation delay. The primary difference is the package and the associated thermal and mechanical characteristics.
Can the 5PB1102CMGI and 5PB1102CMGK8 be used interchangeably in a design?
They are not drop-in replacements because the packages differ. The 5PB1102CMGI uses an 8-pin SOIC body, while the 5PB1102CMGK8 uses an 8-pin VFQFPN body. PCB land patterns, thermal pad requirements, and reflow profiles differ, so a layout change is required before substitution.
What is the difference between the 5PB1102CMGI and 5PB1102CMGK8 package options?
The 5PB1102CMGI is offered in an 8-pin SOIC package, which is a leaded, larger-footprint surface-mount package. The 5PB1102CMGK8 is offered in an 8-pin VFQFPN package, which is a leadless, compact package with an exposed thermal pad. The VFQFPN option is typically selected for space-constrained designs.
Do the 5PB1102CMGI and 5PB1102CMGK8 have the same pinout?
Both devices use an 8-pin configuration with the same functional pin assignments for the 5PB1102 fanout buffer. However, the physical pin locations and package dimensions differ between the SOIC and VFQFPN packages, so the PCB footprint must match the selected package.
What supply voltage and frequency ranges are supported by the 5PB1102CMGI and 5PB1102CMGK8?
Both devices operate from a 1.8 V, 2.5 V, or 3.3 V supply and support input clock frequencies up to 200 MHz. These specifications are common to the 5PB1102 series and are not affected by the package choice.
Which package is better for new designs, the 5PB1102CMGI or the 5PB1102CMGK8?
Package selection depends on the application. The 5PB1102CMGK8 VFQFPN package is preferable when board space is limited and the design can accommodate a leadless package with an exposed pad. The 5PB1102CMGI SOIC package is preferable when a larger, leaded package is required for assembly, inspection, or thermal considerations.
Are the 5PB1102CMGI and 5PB1102CMGK8 available in the same temperature grade?
Both the 5PB1102CMGI and 5PB1102CMGK8 are specified over the industrial temperature range of -40°C to +85°C. The temperature grade is determined by the device series and is not changed by the package option.