ADG732BSUZ vs ADG732BSU

Dieser detaillierte Vergleich von ADG732BSUZ und ADG732BSU bietet wertvolle Einblicke in deren Spezifikationen und Hauptmerkmale. Wir gehen ausführlich auf wichtige Faktoren ein, darunter RoHS-Konformität, REACH-Status, Serie, Montageart, Gehäusetyp und weitere relevante Eigenschaften. Die übersichtliche Darstellung der Unterschiede vereinfacht die Komponentenauswahl und erleichtert Ihnen die Wahl der optimalen Lösung für Ihre Anwendung.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The ADG732BSUZ and ADG732BSU are functionally equivalent CMOS analog multiplexers sharing identical channel count, switch architecture, and package footprint, with the BSUZ suffix denoting a RoHS-compliant lead-free variant of the same device. Designers can treat the ADG732BSUZ as a direct functional substitute for the ADG732BSU in new and existing designs, provided the lead-free (Pb-free) termination finish and its associated reflow profile are acceptable for the target assembly process.

Channel Count and Configuration High match
Package Type and Pinout High match
On-Resistance and Switch Characteristics High match
Termination Finish and RoHS Compliance Validation required

Parts at a glance

Part A

ADG732BSUZ

Analog Devices Inc.

Lifecycle
Active
Stock
2381 Stückzahl
Package
TQFP-48
Series
Schnittstelle für analoge Schalter, Multiplexer, Demultiplexer
Part B

ADG732BSU

Analog Devices Inc.

Lifecycle
Active
Stock
9102 Stückzahl
Package
TQFP-48
Series
Schnittstelle für analoge Schalter, Multiplexer, Demultiplexer

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter ADG732BSUZ ADG732BSU Why it matters
Number of Channels 32 32 Determines how many signal lines the multiplexer can switch; must match the system's channel count.
Switch Configuration 32:1 Multiplexer 32:1 Multiplexer Defines the mux topology; both must be 32-to-1 for direct functional substitution.
On-State Resistance (RON) 4 Ω (typical) 4 Ω (typical) Lower RON reduces signal attenuation and voltage drop across the switch; matching values preserve signal integrity.
Supply Voltage Range ±2.5 V to ±5.5 V dual, or 2.5 V to 5.5 V single ±2.5 V to ±5.5 V dual, or 2.5 V to 5.5 V single Must be compatible with the system power rails for correct operation and level compatibility.
Package / Mounting 48-TQFP (7x7), Surface Mount 48-TQFP (7x7), Surface Mount Footprint and mounting must match the PCB layout for drop-in replacement.
RoHS / Lead-Free Status RoHS Compliant, Lead-Free Non-RoHS, Contains Lead Affects regulatory compliance and solder process; the "Z" suffix denotes the lead-free/RoHS variant.
Operating Temperature Range -40 °C to +85 °C -40 °C to +85 °C Must cover the application's ambient conditions for reliable operation.
Channel-to-Channel Matching 0.5 Ω (typical) 0.5 Ω (typical) Tight matching minimizes gain/offset errors between channels in precision signal routing.
Switching Time (tON/tOFF) 23 ns / 16 ns (typical) 23 ns / 16 ns (typical) Determines maximum switching speed and settling behavior in multiplexed acquisition systems.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification ADG732BSUZ ADG732BSU
Supplier - Rochester Electronics, LLC
Part Status Active Obsolete
Mounting Type Surface Mount Surface Mount
Multiplexer / Demultiplexer Circuit 32:1 -
Number of Circuits 1 -
On - State Resistance(Max) 5.5Ohm -
Voltage - Supply, Single (V+) 1.8V ~ 5.5V -
Voltage - Supply, Dual (V±) ±2.5V -
-3 dB Bandwidth 18MHz -
Charge Injection 1pC -
Channel Capacitance(CS(off)CD(off)) 13pF, 275pF -
Current - Leakage(IS(off))(Max) 250pA -
Crosstalk -72dB @ 1MHz -
Operating Temperature -40°C ~ 125°C (TA) -

Frequently asked questions

What is the difference between ADG732BSUZ and ADG732BSU?

The ADG732BSUZ and ADG732BSU refer to the same Analog Devices 32-channel CMOS analog multiplexer; the "Z" suffix denotes RoHS-compliant lead-free packaging (per Analog Devices ordering guide), while the non-Z version is the older non-RoHS leaded package variant. Functionally and electrically they are the same device.

Are ADG732BSUZ and ADG732BSU electrically and functionally identical?

Yes. Both are the ADG732 32-to-1 CMOS analog multiplexer with the same channel count, on-resistance, supply range, and control interface. The only documented difference is the package/lead finish (RoHS-compliant vs non-RoHS), not the electrical specification.

Can ADG732BSUZ be used as a drop-in replacement for ADG732BSU?

Yes, provided the PCB assembly process accepts the RoHS lead-free finish. Both are offered in the same 48-lead TQFP (SU) package with identical pinout, so the footprint and pin functions are compatible; the substitution is a lead-finish/ordering-code change, not a functional change.

What package do ADG732BSUZ and ADG732BSU use?

Both devices are supplied in the 48-lead TQFP package, indicated by the "SU" suffix in the part number. The "Z" in ADG732BSUZ designates the RoHS-compliant version of that same TQFP package.

Does the "Z" suffix affect the electrical specifications of the ADG732?

No. Per Analog Devices, the "Z" suffix indicates RoHS compliance (lead-free) and does not change the device's electrical parameters. On-resistance, leakage, switching times, and supply requirements remain as specified in the ADG732 datasheet for both variants.

Which variant should be selected for a new RoHS-compliant design?

ADG732BSUZ should be selected for new designs requiring RoHS compliance, since it is the lead-free, RoHS-compliant ordering variant. ADG732BSU is the legacy non-RoHS version and is generally not appropriate for new RoHS-restricted products.

Are ADG732BSUZ and ADG732BSU interchangeable in existing assemblies?

They are pin-compatible in the same 48-lead TQFP package, so ADG732BSUZ can generally replace ADG732BSU where RoHS lead-free assembly is acceptable. Any change should still be validated against the manufacturer datasheet and the specific assembly/qualification requirements of the design.