Part A
ADSP-21569KBCZ8
Analog Devices Inc.
- Lifecycle
- Active
- Stock
- 3374 Stückzahl
- Package
- LBGA-400
- Series
- Embedded (Digital Signal Processors)
Replacement verdict
Not a drop-in replacement
The ADSP-21569KBCZ8 and ADSP-21992YBC are not functionally interchangeable. They differ in processor architecture, core clock rate, on-chip memory architecture, and package footprint, so the ADSP-21992YBC cannot serve as a direct substitute for the ADSP-21569KBCZ8 without a full hardware and software redesign.
Different processor architecture
Different core clock rate
Different on-chip memory
Different package footprint
Parts at a glance
Part B
ADSP-21992YBC
Analog Devices Inc.
- Lifecycle
- Active
- Stock
- 8845 Stückzahl
- Series
- Embedded (Digital Signal Processors)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | ADSP-21569KBCZ8 | ADSP-21992YBC | Why it matters |
|---|---|---|---|
| Product Series / Family | ADSP-2156x SHARC+ | ADSP-2199x (ADSP-219x) | Different DSP generations and architectures; code, tools, and peripherals are not directly interchangeable. |
| Core Architecture | SHARC+ floating-point DSP core | ADSP-219x fixed-point DSP core | Floating-point vs fixed-point cores affect numeric precision, algorithm portability, and required software rework. |
| Maximum Core Clock | 800 MHz | 160 MHz | Clock speed determines processing headroom and real-time throughput for signal-processing workloads. |
| On-chip Program/Data Memory | Large on-chip SRAM (multi-MB class) | Smaller on-chip SRAM (hundreds of KB class) | Memory capacity constrains algorithm size and buffering; a large mismatch may require external memory or redesign. |
| Package | BGA (CSP_BGA) | BGA | Package footprint and pinout must match the PCB layout for a drop-in replacement. |
| Supply Voltage | Low-voltage core with separate I/O rails | 3.3 V I/O with lower core voltage | Power rail requirements affect board-level power design and level-shifting needs. |
| Temperature Grade | Industrial / extended temperature range | Industrial temperature range | Operating temperature range must satisfy the target application's environmental requirements. |
| Target Application Class | High-performance audio, industrial, and automotive signal processing | Embedded motor control and industrial signal processing | Different intended application domains imply different peripheral sets and ecosystem support. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | ADSP-21569KBCZ8 | ADSP-21992YBC |
|---|---|---|
| Series | SHARC® | ADSP-21xx |
| Part Status | Active | Obsolete |
| Type | Fixed/Floating Point | Fixed Point |
| Interface | CAN, I²C, SPI, SPORT, UART/USART | SPI, SSP |
| Clock Rate | 800MHz | 150MHz |
| Non - Volatile Memory | External | External |
| On - Chip RAM | 1.625MB | 128kB |
| Voltage - I / O | 3.30V | 3.30V |
| Voltage - Core | 1.00V | 2.50V |
| Operating Temperature | 0°C ~ 70°C (TA) | -40°C ~ 125°C (TA) |
| Mounting Type | Surface Mount | Surface Mount |
| Base Product Number | - | ADSP-2199 |
Frequently asked questions
What are the key architectural differences between the ADSP-21569KBCZ8 and the ADSP-21992YBC?
The ADSP-21569KBCZ8 is a SHARC+ single-core DSP with a 400 MHz core clock, 640 KB on-chip SRAM, and integrated FIR/IIR accelerators, while the ADSP-21992YBC is a mixed-signal DSP from the ADSP-2199x family featuring a 160 MHz core, 128 KB on-chip SRAM, and integrated analog peripherals including an ADC and PWM units. The two devices belong to different SHARC generations and target different signal-processing workloads.
Are the ADSP-21569KBCZ8 and ADSP-21992YBC pin-to-pin or package compatible?
No. The ADSP-21569KBCZ8 is supplied in a 176-lead BGA package (BCZ suffix), while the ADSP-21992YBC is supplied in a 196-ball BGA package (YBC suffix). The ball counts, ball maps, and package dimensions differ, so they are not drop-in replacements and require separate PCB footprints.
Can firmware or software developed for the ADSP-21992YBC run unchanged on the ADSP-21569KBCZ8?
No. The two devices use different SHARC core generations, different memory maps, different peripheral sets, and different toolchain targets. Source code would require recompilation with the appropriate CrossCore Embedded Studio target and adaptation of peripheral drivers, linker scripts, and startup code. Binary compatibility is not supported.
How do the on-chip memory and clock speeds compare between the two parts?
The ADSP-21569KBCZ8 operates at up to 400 MHz and provides 640 KB of on-chip SRAM. The ADSP-21992YBC operates at up to 160 MHz and provides 128 KB of on-chip SRAM. The ADSP-21569KBCZ8 therefore offers substantially higher core throughput and larger on-chip memory for demanding DSP algorithms.
Which device is better suited for motor control and mixed-signal applications?
The ADSP-21992YBC is specifically designed for mixed-signal control applications, integrating an analog-to-digital converter and PWM generation on-chip, which suits motor control and power conversion. The ADSP-21569KBCZ8 is a higher-performance general-purpose SHARC+ DSP without those integrated analog control peripherals, making it better suited to audio, industrial, and high-throughput signal-processing tasks.
Do both devices share the same development tools and evaluation ecosystem?
Both are supported within Analog Devices' CrossCore Embedded Studio environment, but they require different device-specific board support packages, emulator configurations, and evaluation hardware. Designers should confirm the specific silicon revision and toolchain support for each part before committing to a design.
What should be verified before considering either part for a new design?
Confirm the required core clock, on-chip memory, integrated analog peripherals, package footprint, power supply rails, and temperature grade against the official Analog Devices datasheet for each specific orderable part number. Because the two devices differ in architecture, package, and peripheral integration, substitution requires full schematic, layout, and firmware validation.