AM1802EZWTD3
Texas Instruments
- Lifecycle
- Active
- Stock
- 3390 Stückzahl
- Package
- NFBGA-361
- Series
- Eingebettete Mikroprozessoren
Dieser detaillierte Vergleich von AM1802EZWTD3 und AM1806BZCE3 bietet wertvolle Einblicke in deren Spezifikationen und Hauptmerkmale. Wir gehen ausführlich auf wichtige Faktoren ein, darunter RoHS-Konformität, REACH-Status, Serie, Montageart, Gehäusetyp und weitere relevante Eigenschaften. Die übersichtliche Darstellung der Unterschiede vereinfacht die Komponentenauswahl und erleichtert Ihnen die Wahl der optimalen Lösung für Ihre Anwendung.
Replacement verdict
The AM1806BZCE3 is a viable functional replacement candidate for the AM1802EZWTD3, sharing the same ARM926EJ-S core architecture and comparable peripheral set, though the differing package, speed grade, and operating temperature range require validation against the target application's mechanical and environmental requirements.
Texas Instruments
Texas Instruments
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | AM1802EZWTD3 | AM1806BZCE3 | Why it matters |
|---|---|---|---|
| Core Processor | ARM926EJ-S | ARM926EJ-S | Both use the same ARM9 core, so instruction set and software compatibility are preserved. |
| Maximum Clock Frequency | 300 MHz | 456 MHz | Higher clock speed in the AM1806 provides more processing headroom, affecting timing-critical applications. |
| Package / Case | 361-LFBGA (16x16) | 361-NFBGA (13x13) | Different package footprints require PCB layout changes, so they are not drop-in replacements. |
| Operating Temperature Range | -40°C to 90°C (TJ) | -40°C to 105°C (TJ) | The wider temperature range of the AM1806 suits harsher environments and industrial applications. |
| On-Chip RAM | 8 KB | 128 KB | Larger on-chip RAM reduces external memory needs and improves performance for buffering tasks. |
| Number of UART Channels | 3 | 3 | UART count affects serial connectivity options; identical count preserves interface capability. |
| Ethernet | 10/100 Mbps MAC | 10/100 Mbps MAC | Both integrate an Ethernet MAC, enabling networked applications without external controllers. |
| USB | USB 2.0 OTG (High-Speed) | USB 2.0 OTG (High-Speed) | USB OTG support enables both host and device roles, important for peripheral connectivity. |
| Supply Voltage | 1.2V core / 1.8V, 3.3V I/O | 1.2V core / 1.8V, 3.3V I/O | Matching supply rails allow reuse of the same power design and regulators. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | AM1802EZWTD3 | AM1806BZCE3 |
|---|---|---|
| Supplier | - | Rochester Electronics, LLC,Texas Instruments |
| Series | Sitara™ | Sitara™ |
| Part Status | Active | Obsolete |
| Core Processor | ARM926EJ-S | ARM926EJ-S |
| Number of Cores / Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 300MHz | 375MHz |
| Co - Processors / DSP | System Control; CP15 | System Control; CP15 |
| RAM Controllers | LPDDR, DDR2 | LPDDR, DDR2 |
| Graphics Acceleration | No | No |
| Display&Interface Controllers | LCD | LCD |
| USB | USB 2.0 + PHY (1) | USB 2.0 + PHY (1) |
| Voltage - I / O | 1.8V, 3.3V | 1.8V, 3.3V |
| Operating Temperature | -40°C ~ 90°C (TJ) | 0°C ~ 90°C (TJ) |
| Ethernet | 10/100Mbps (1) | - |
The AM1802EZWTD3 is an ARM926EJ-S based Sitara processor in a 361-ball NFBGA (ZWT) package, while the AM1806BZCE3 is an ARM926EJ-S based Sitara processor in a 361-ball NFBGA (ZCE) package. Both are members of the AM180x family, but they differ in operating temperature range, package ballout, and specific peripheral configurations as defined in their respective datasheets.
No. The AM1802EZWTD3 uses the ZWT package and the AM1806BZCE3 uses the ZCE package. Although both are 361-ball NFBGA packages, the ball assignments and package outlines differ between the ZWT and ZCE variants, so they are not drop-in replacements for each other.
The AM1802EZWTD3 is specified for the extended commercial temperature range (0°C to 90°C, indicated by the "3" suffix in the orderable part number). The AM1806BZCE3 is also specified for the extended commercial temperature range (0°C to 90°C). Both devices share the same temperature grade designation per the AM180x datasheet ordering information.
Yes. Both the AM1802EZWTD3 and AM1806BZCE3 integrate an ARM926EJ-S RISC core running at up to 375 MHz, with 16 KB instruction and 16 KB data caches, and both include the ARM ETB and ETM for debug. Core architecture and maximum operating frequency are identical across the two orderable part numbers.
Both devices support mDDR/DDR2 SDRAM, asynchronous EMIF (NAND/NOR), and a rich peripheral set including USB 2.0 OTG, EMAC, McASP, SPI, I2C, UART, and eHRPWM. The AM1806BZCE3 additionally exposes the LCD controller and uPP (universal parallel port) features associated with the AM1806 configuration, while the AM1802EZWTD3 is configured per its specific datasheet feature set. Designers should confirm the exact peripheral mix against the respective device datasheets.
Not without validation. Because the ZWT and ZCE packages have different ballouts, a direct PCB substitution is not possible. Any migration between the AM1802EZWTD3 and AM1806BZCE3 requires a board redesign or layout change, plus verification of peripheral differences and power sequencing against the target device datasheet.
Yes. Both the AM1802EZWTD3 and AM1806BZCE3 are offered in RoHS-compliant, lead-free (Pb-free) NFBGA packages, consistent with Texas Instruments' green packaging standards for the AM180x family. Designers should confirm the specific orderable part number's compliance status on the manufacturer's product page.