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10AX027H4F34E3SG
+StücklisteIC FPGA 384 I/O 1152FBGA
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HerstellerIntel
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Herstellerteil #10AX027H4F34E3SG
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Paket FBGA-1152
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Auf Lager5435
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Arria 10 GX |
| Part Status | Active |
| Number of LABs/CLBs | 101620 |
| Number of Logic Elements/Cells | 270000 |
| Total RAM Bits | 17870848 |
| Number of I/O | 384 |
| Voltage - Supply | 0.87V ~ 0.98V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
Übersicht
Description
Key features of the Arria 10 series include advanced 20 nm process technology, delivering higher speeds and lower power consumption compared to previous generations. The 10AX027H4F34E3SG model is likely equipped with a range of programmable logic elements, DSP blocks, and embedded memory, providing flexibility in implementing complex digital circuits.
Arria 10 FPGAs also support high-speed transceivers, offering fast data transfer rates, and include features for enhanced security and reliability. The specific package and configuration, indicated by the model number, determine its suitability for different applications, with trade-offs between size, power, and performance.
These FPGAs are commonly used in industries that require adaptable and scalable hardware solutions, benefiting from their reprogrammability and integration capabilities.
Equivalent
Features
1. Fabric and Logic: This device offers approximately 270K logic elements, providing substantial capacity for complex designs.
2. Embedded Memory: It includes significant on-chip memory, featuring multiple M20K and MLAB memory blocks for efficient data processing.
3. DSP Blocks: The device integrates numerous variable precision DSP (Digital Signal Processing) blocks, enhancing its capability for high-performance arithmetic functions.
4. Transceivers: Equipped with high-speed transceivers capable of data rates up to 17.4 Gbps, facilitating high-bandwidth communication.
5. Power Efficiency: Built on a 20 nm process technology, it delivers improved power efficiency compared to previous generations.
6. I/O Features: It supports a wide range of I/O standards and includes advanced I/O features for versatile interfacing options.
7. Configuration: The device supports fast and flexible configuration modes, allowing rapid deployment and updates.
These features make the 10AX027H4F34E3SG suitable for applications requiring high-speed data processing, flexible interfacing, and efficient power usage.
Pinout
The key functions of this FPGA include:
1. Logic Elements: Provides a significant number of adaptive logic modules for implementing custom logic functions.
2. Digital Signal Processing (DSP) Blocks: Equipped with DSP blocks for efficient processing of high-speed digital signals.
3. Memory: Includes embedded memory blocks for data storage and retrieval.
4. I/O Capabilities: Supports various I/O standards and protocols, facilitating communication with external devices.
5. Transceivers: High-speed transceivers for serial communication applications.
6. Power Efficiency: Designed for reduced power consumption without compromising performance.
This combination of features makes the 10AX027H4F34E3SG suitable for demanding tasks in fields like telecommunications and advanced computing. For detailed pin functions and configuration, refer to the specific datasheet and technical documentation provided by Intel.
Manufacturer
Intel Corporation, headquartered in Santa Clara, California, is a leader in the technology industry, particularly in developing microprocessors, chipsets, and other semiconductor-related products. The company plays a significant role in various fields, including computing, data centers, artificial intelligence, and the Internet of Things (IoT). Intel is known for its continuous innovation and development of advanced technology solutions.
By manufacturing FPGAs like the 10AX027H4F34E3SG, Intel serves industries requiring high-performance, adaptable, and scalable hardware solutions, such as telecommunications, automotive, and aerospace sectors. This reflects Intel's broader strategy of expanding its influence and capabilities beyond traditional CPU markets into new and emerging technology sectors.
Application
1. Communications: Used in wireless infrastructure, base stations, and optical transport networks.
2. Data Centers: Ideal for acceleration in data center applications, including networking and storage.
3. Broadcasting: Supports video processing and broadcasting equipment with high bandwidth and low latency needs.
4. Military and Aerospace: Suitable for radar systems, signal processing, and secure communications.
5. Industrial: Employed in automation, robotics, and machine vision systems for its processing capabilities.
6. Healthcare: Utilized in medical imaging and diagnostics.
Its adaptability and processing power make it suitable for complex, computation-heavy tasks.