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10CL025ZU256I8G
+StücklisteIC FPGA 150 I/O 256UBGA
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HerstellerIntel
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Herstellerteil #10CL025ZU256I8G
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Paket LFBGA-256
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Auf Lager4376
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
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Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Cyclone® 10 LP |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1539 |
| NumberofLogicElements/Cells | 24624 |
| TotalRAMBits | 608256 |
| NumberofI/O | 150 |
| Voltage-Supply | 1.0V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 256-LFBGA |
Übersicht
Description
- 25K logic elements (LEs)
- Low-power FPGA (optimized for cost-sensitive applications)
- 256-pin UBGA package
- Industrial temperature range (-40°C to 100°C)
- On-chip memory (1.1 Mb RAM)
- Up to 153 user I/Os
- Supports PCIe Gen2, DDR3, and other interfaces
Ideal for embedded, industrial, and consumer applications requiring low power and moderate logic density.
Equivalent
- Lattice Semiconductor: iCE40UP5K (lower power, smaller capacity) or ECP5 (similar range).
- Xilinx (AMD): Spartan-7 (XC7S25, similar logic capacity).
- Microchip: PolarFire (MPF100T, higher performance but more complex).
For exact replacements, check Intel’s Cyclone 10 LP family (e.g., 10CL010, 10CL040) for varying logic densities. Always verify pin compatibility and features.
Features
- Logic Elements (LEs): 25K
- Memory: 1,134 Kbits embedded RAM
- DSP Blocks: 66 (18x18 multipliers)
- I/O Pins: 153 (supports LVDS, PCIe, DDR2/3)
- Package: 256-pin UBGA (Ultra FineLine BGA)
- Transceivers: None (low-power variant)
- Operating Voltage: 1.0V core, 1.2V/1.5V/1.8V/2.5V/3.3V I/O
- Max User I/O: 153
- Configuration: JTAG, Active Serial, Passive Parallel
Designed for low-power, cost-sensitive applications like industrial, consumer, and automotive systems. Offers moderate performance with efficient power consumption.
Pinout
- Pin Count: 256 pins (UBGA-256 package)
- Function: Low-power FPGA with 25K logic elements (LEs), 1.1Mbits embedded memory, and 56 18x18 multipliers.
- I/O: Supports up to 179 user I/O pins with LVCMOS, LVDS, and other standards.
- Features: Includes PLLs, DSP blocks, and on-chip memory for flexible digital design.
- Applications: Used in embedded systems, industrial control, and consumer electronics.
Package: Ultra FineLine BGA (UBGA-256).
Operating temperature: Industrial (-40°C to 100°C).
Application
- Embedded Systems: Control logic, sensor interfacing.
- Industrial Automation: Motor control, PLCs.
- Consumer Electronics: Display controllers, IoT devices.
- Communications: Protocol bridging, signal processing.
- Automotive: Infotainment, ADAS peripherals.
Its low power, small footprint, and moderate logic capacity (25K LEs) suit space-constrained designs.