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10M08SAU169C8G
+StücklisteIC FPGA 130 I/O 169UBGA
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HerstellerIntel
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Herstellerteil #10M08SAU169C8G
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Paket UBGA-169
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Auf Lager4326
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | MAX® 10 |
| Part Status | Active |
| Number of LABs/CLBs | 500 |
| Number of Logic Elements/Cells | 8000 |
| Total RAM Bits | 387072 |
| Number of I/O | 130 |
| Voltage - Supply | 2.85V ~ 3.465V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Übersicht
Description
1. Logic Elements: It contains 8,000 logic elements, providing adequate resources for complex digital designs.
2. Package: This model comes in a 169-pin UBGA (Ultra-thin Ball Grid Array) package, which is compact and suitable for space-constrained applications.
3. Memory and Features: The FPGA offers on-chip flash memory, allowing instant-on capability without the need for external configuration memory. It also incorporates on-chip RAM blocks for efficient data storage and processing.
4. Analog Capabilities: The device includes integrated ADCs, expanding its use cases to mixed-signal applications where both digital and analog processing are required.
5. Applications: These features make it suitable for a range of applications, including industrial, automotive, and consumer electronics, where low power and high performance are critical.
Overall, the 10M08SAU169C8G is designed for flexibility and efficiency in various FPGA-based projects.
Equivalent
Features
1. Architecture: Non-volatile, single-chip FPGA which integrates flash memory for configuration and storage.
2. Logic Elements (LEs): Contains 8,000 LEs, which are the basic building blocks for implementing logic functions.
3. I/O Pins: Offers 130 general-purpose I/O pins.
4. Embedded Memory: Includes approximately 378 Kbits of user flash memory and 387 Kbits of RAM.
5. Performance: Operates with a maximum clock frequency of about 450 MHz.
6. Package: Available in a 169-pin UFBGA (Ultra Fine Ball Grid Array) package.
7. Operating Voltage: Supports core voltage of 1.2V with flexible I/O standards.
8. Advanced Features: Includes features like analog-to-digital converters (ADCs) and phase-locked loops (PLLs) for clock management.
9. Applications: Suitable for cost-sensitive applications requiring low power consumption and small form factor, such as industrial control, consumer electronics, and communication systems.
These features make the 10M08SAU169C8G versatile for a range of applications requiring moderate logic density and embedded processing capabilities.
Pinout
Key Features:
- Pin Count: 169
- Logic Elements (LEs): Approximately 8,000
- Embedded Memory: Features on-chip RAM blocks
- Digital Signal Processing (DSP): Includes DSP blocks for signal processing applications
- Single Power Supply: Simplifies the power design by operating with a single power supply
- Non-volatile Configuration Memory: Retains configuration without the need for external configuration devices
- Embedded Flash: Allows for instant-on functionality
- Integrated Analog-to-Digital Converter (ADC): Facilitates mixed-signal designs
- I/O Pins: Supports a variety of I/O standards, making it versatile for different interface requirements
This FPGA is suitable for applications requiring low power, moderate logic resources, and instant-on capability, such as industrial, automotive, and consumer electronics.
Manufacturer
Application
1. Industrial Automation: For controlling processes and machinery.
2. Consumer Electronics: In devices requiring adaptable hardware functions.
3. Automotive Systems: Used in advanced driver-assistance systems (ADAS) and infotainment.
4. Communication Systems: For protocol bridging and signal processing.
5. Medical Devices: In portable diagnostic equipment and monitoring systems.
6. IoT Devices: Providing connectivity and data processing at the edge.
7. Aerospace and Defense: For secure and reliable communication and control systems.
These applications leverage the FPGA's reconfigurability, low power consumption, and integration capabilities.