Abbildungen dienen nur als Referenz
10M50DAF484C8G
+StücklisteIC FPGA 360 I/O 484FBGA
-
HerstellerIntel
-
Herstellerteil #10M50DAF484C8G
-
Paket TFBGA-484
-
Auf Lager3799
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | MAX® 10 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 3125 |
| NumberofLogicElements/Cells | 50000 |
| TotalRAMBits | 1677312 |
| NumberofI/O | 360 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 484-BGA |
Übersicht
Description
- 50K logic elements for flexible digital design.
- On-chip flash memory for configuration storage.
- 484-pin FineLine BGA package (FBGA).
- Dual-configuration support for fail-safe updates.
- Embedded analog-to-digital converters (ADCs).
- Low-power operation (1.2V core voltage).
Ideal for industrial control, communications, and embedded systems requiring reconfigurable logic with integrated features.
Pinout
- Pin Count: 484 pins (FineLine BGA package).
- Function: A low-cost, non-volatile FPGA with embedded flash, supporting up to 50K logic elements, 2,592 Kbits RAM, 144 multipliers, and 4 PLLs. It includes ADC blocks, GPIOs, and supports various I/O standards (LVCMOS, LVDS, etc.).
Designed for industrial, automotive, and consumer applications, it integrates configuration memory, reducing external component needs.
Manufacturer
Intel is a multinational semiconductor and technology company, known for processors, memory, and programmable logic devices. After acquiring Altera in 2015, Intel expanded its FPGA portfolio, targeting embedded, industrial, and communications applications.
The 10M50DAF484C8G is a mid-range FPGA with 50K logic elements, flash memory, and mixed-signal capabilities, often used in prototyping, automation, and IoT.
Application
1. Industrial Automation – Control systems, motor drives, and PLCs.
2. Consumer Electronics – Smart devices, displays, and wearables.
3. Communications – Networking equipment and signal processing.
4. Automotive – Infotainment, ADAS, and sensor interfaces.
5. Medical Devices – Portable diagnostics and imaging systems.
6. Aerospace & Defense – Avionics and secure communications.
7. IoT & Embedded Systems – Edge computing and sensor hubs.
Its low power, high integration, and reprogrammability make it versatile for compact, cost-sensitive designs.