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10M50DCF256I7G
+StücklisteIC FPGA 178 I/O 256FBGA
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HerstellerIntel
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Herstellerteil #10M50DCF256I7G
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Paket FBGA-256
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Auf Lager5949
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | MAX® 10 |
| Part Status | Active |
| Number of LABs/CLBs | 3125 |
| Number of Logic Elements/Cells | 50000 |
| Total RAM Bits | 1677312 |
| Number of I/O | 178 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features include:
- Logic Elements: It comprises 50,000 logic elements, supporting complex designs.
- Embedded Memory: The chip includes up to 1,677 Kbits of embedded memory.
- DSP Blocks: It offers DSP blocks for efficient digital signal processing tasks.
- Embedded ADC: The inclusion of an analog-to-digital converter enhances mixed-signal processing.
- Non-volatile Configuration Memory: This allows instant-on configuration, making it versatile and reliable.
- Package: Housed in a 256-pin FCBGA package, it supports compact system designs.
The 10M50DCF256I7G is ideal for designers seeking cost-effective FPGAs with non-volatile configuration memory, real-time processing, and ease of use, while also providing robust performance for moderate to complex applications.
Equivalent
Features
1. Logic Elements (LEs): It contains 50,000 logic elements, suitable for diverse logic functions.
2. Embedded Memory: It offers significant embedded memory, including M9K memory blocks, for efficient data storage and retrieval.
3. DSP Blocks: The device includes DSP blocks, which are useful for signal processing tasks.
4. Non-volatile Configuration: It integrates on-chip flash for non-volatile configuration, eliminating the need for external configuration devices.
5. Package: Available in a 256-pin FineLine BGA package, which allows for compact design solutions.
6. Operating Temperature: It operates within the industrial temperature range, making it suitable for harsh environments.
7. I/O Pins: The device supports numerous I/O standards and features multiple I/O pins for versatile interfacing.
8. Integrated ADC: It includes an integrated analog-to-digital converter for mixed-signal applications.
9. Performance: The device provides a balance between performance and power efficiency.
These features make it a versatile choice for a wide range of applications, including industrial, automotive, and consumer electronics.
Pinout
1. Logic Elements: It has 50,000 logic elements, which can be used for a variety of digital logic applications.
2. Memory: The FPGA includes embedded memory blocks for implementing various memory functions.
3. DSP Blocks: It has digital signal processing blocks for high-performance arithmetic operations.
4. I/O Pins: The device supports numerous general-purpose I/O pins for interfacing with other components.
5. Configuration: MAX 10 FPGAs include on-chip flash for configuration, eliminating the need for external configuration devices.
6. Power Management: They offer advanced power management features suitable for power-sensitive applications.
7. Temperature Range: The “I” in the part number indicates it is rated for industrial temperature ranges.
The 10M50DCF256I7G is suitable for a wide range of applications requiring moderate logic density, integrated memory, and DSP capabilities, along with robust I/O and power management features.
Manufacturer
Application
1. Industrial Automation: For control systems, monitoring, and process automation.
2. Consumer Electronics: In devices requiring efficient signal processing and interfacing.
3. Communications: For protocol bridging, interfacing, and data processing tasks.
4. Automotive Systems: Used in infotainment systems and advanced driver-assistance systems (ADAS).
5. Medical Devices: For signal processing in diagnostic and monitoring equipment.
6. IoT Devices: Provides connectivity and data processing in smart devices.
These applications leverage its programmability, low power, and high-performance capabilities.