89HF32P08AG3ZBBLG

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89HF32P08AG3ZBBLG

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IC PCI SW 32CH 8PORT 1517-FCBGA

  • HerstellerRenesas Electronics America Inc.

  • Herstellerteil #89HF32P08AG3ZBBLG

  • Auf Lager7537

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Package / Case Tray
Part Status Obsolete

Übersicht

Description

The term "89HF32P08AG3ZBBLG" appears to resemble a product code or model number, likely for a specific electronic component, device, or piece of equipment. Without additional context or specific industry references, it's challenging to pinpoint its exact nature or application. In general, such alphanumeric codes are used by manufacturers to uniquely identify products for inventory, sales, and technical support purposes. These codes might be associated with consumer electronics, industrial components, or specialized technology.
To gain more detailed insights, it would be useful to identify the manufacturer or brand associated with this code. Typically, a search on the manufacturer's website or product catalog using the model number can provide detailed specifications, features, and potential applications. If you have a specific context or industry in mind, providing additional details could further refine the information. For accurate identification and information, consulting technical datasheets or customer support from the responsible manufacturer is recommended.

Equivalent

The 89HF32P08AG3ZBBLG chip is a NAND Flash memory IC from Micron. Equivalent products would include NAND Flash memory chips with similar specifications from other manufacturers like Samsung, Toshiba (Kioxia), SK Hynix, or Western Digital (SanDisk). When looking for an equivalent, consider compatibility in terms of capacity, interface, voltage, and package type. Always refer to datasheets for precise compatibility.

Features

The 89HF32P08AG3ZBBLG is a part from the HyperFlash family, designed by Cypress Semiconductor (now part of Infineon Technologies). Here are its key features:
1. Flash Memory Technology: HyperFlash memory is known for its high-speed read capabilities, making it suitable for demanding applications.
2. Capacity: Typically offers capacities ranging from 128 Mb to higher, suited for various data storage needs.
3. Interface: Utilizes a HyperBus interface, which enhances data throughput and reduces the number of pins compared to traditional parallel NOR flash memory.
4. Performance: Delivers fast read speeds, often around 333 MB/s, supporting rapid boot times and efficient data access.
5. Voltage Range: Operates on a single 3.0V supply, simplifying power requirements.
6. Package: Available in compact packages, suitable for space-constrained applications.
7. Applications: Ideal for automotive, industrial, and consumer electronics requiring reliable and quick access to data.
These features make it a robust choice for high-performance and resource-efficient applications.

Manufacturer

The 89HF32P08AG3ZBBLG is a part number for a semiconductor product manufactured by Renesas Electronics Corporation. Renesas is a Japanese semiconductor company that specializes in the design and manufacturing of a broad range of microcontrollers, analog, power, and SoC (System on Chip) products. The company is a key player in the global semiconductor industry and serves various markets including automotive, industrial, home electronics, office automation, and information communication technology.
Renesas is known for providing comprehensive solutions that integrate hardware and software products, enabling companies to develop innovative and efficient electronic products. Their expertise lies in delivering high-performance, energy-efficient, and reliable semiconductor solutions that enhance the functionality and capabilities of electronic devices.

Application

The 89HF32P08AG3ZBBLG is a NAND Flash memory chip. Its application areas include data storage in consumer electronics like smartphones, tablets, and digital cameras. It's also used in solid-state drives (SSDs) for personal computers and enterprise servers. Additionally, it serves in embedded systems for automotive applications, industrial devices, and IoT devices where reliable and high-capacity storage solutions are essential. The chip is valued for its high-density data retention, fast read/write speeds, and durability, making it suitable for applications requiring efficient and reliable data management.

Package

The package type for the part number 89HF32P08AG3ZBBLG is BGA (Ball Grid Array).

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