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A3PE3000-2FGG896I
+StücklisteIC FPGA 620 I/O 896FBGA
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HerstellerMikrochip-Technologie
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Herstellerteil #A3PE3000-2FGG896I
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Auf Lager6964
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Spezifikationen
| Attribut | Wert |
| Series | ProASIC3E |
| PartStatus | Active |
| DigiKeyProgrammable | Not Verified |
| TotalRAMBits | 516096 |
| NumberofI/O | 620 |
| NumberofGates | 3000000 |
| Voltage-Supply | 1.425V ~ 1.575V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 896-BGA |
| SupplierDevicePackage | 896-FBGA (31x31) |
| BaseProductNumber | A3PE3000 |
Übersicht
Description
This FPGA operates on low power and provides robust performance for applications in communications, automotive, industrial control, and consumer electronics. It supports features such as advanced digital signal processing (DSP) capabilities, and its reliability is enhanced by built-in fault tolerance. The A3PE3000-2FGG896I is ideal for applications requiring reconfigurability and high processing speeds, making it a versatile choice for engineers and developers looking to implement custom digital logic solutions.
Equivalent
Features
1. Architecture: 3,000 logic gates and up to 896 flip-flops for moderate complexity designs.
2. I/O Configuration: Supports multiple I/O standards including LVTTL, LVCMOS, and others, with up to 84 I/O pins.
3. Flash Technology: Non-volatile flash memory allows for easy reprogramming and design updates.
4. Low Power Consumption: Ideal for battery-operated devices with its low dynamic and static power usage.
5. Integrated DSP Blocks: Offers built-in DSP slices for efficient signal processing.
6. Flexible Clock Management: Supports clock dividers and phase-locked loops (PLLs) for various applications.
7. Development Tools: Compatible with Actel's design software, which facilitates efficient design and simulation.
These features make the A3PE3000-2FGG896I suitable for various industrial, automotive, and consumer applications.
Pinout
The device supports various functions including configurable I/O, digital signal processing, and embedded memory. It is designed for low power, high performance applications and includes features such as non-volatile flash memory for configuration, built-in memory blocks, and multiple I/O standards. The "2" in the part number indicates the speed grade, while "FGG" denotes the package type, which is a fine pitch BGA (Ball Grid Array). The "I" indicates that it is an industrial-grade device, suitable for a wider temperature range.
Overall, the A3PE3000-2FGG896I is ideal for applications requiring flexibility, reliability, and robust performance in various environments.