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ADSP-BF607BBCZ-5
+StücklisteIC DSP CTRLR 349CSBGA
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HerstellerAnalog Devices Inc.
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Herstellerteil #ADSP-BF607BBCZ-5
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Paket BGA-349
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Auf Lager1229
365 Tage Qualitätsgarantie
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Spezifikationen
| Attribut | Wert |
| Package / Case | Bulk,Tray |
| Series | Blackfin® |
| Part Status | Active |
| Type | Dual Core |
| Interface | CAN, EBI/EMI, Ethernet, I²C, SPI, SPORT, UART/USART, USB OTG |
| Clock Rate | 500MHz |
| Non - Volatile Memory | ROM (64kB) |
| On - Chip RAM | 808K x 8 |
| Voltage - I / O | 1.8V, 3.3V |
| Voltage - Core | 1.25V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
Übersicht
Equivalent
- ADSP-BF606BBCZ-5 (lower performance variant)
- ADSP-BF608BBCZ-5 (higher performance variant)
- ADSP-BF609BBCZ-5 (enhanced features)
- ADSP-BF592 (lower-cost, lower-performance option)
For exact replacements, check Analog Devices' cross-reference or consider newer Blackfin/Sharc processors like the ADSP-SC58x series. Verify pin compatibility and specs for your application.
Pinout
- Pin Count: 196-ball CSP_BGA (Chip-Scale Package Ball Grid Array).
- Key Functions:
- Dual 500 MHz cores (BF60x architecture).
- 320 KB L1 SRAM per core, 4 MB shared L2 SRAM.
- Supports DDR2/3, SPI, I²C, UART, CAN, USB 2.0, PCIe, and Ethernet.
- 16-channel DMA and 12-bit parallel peripheral interface (PPI).
- High-speed ADCs/DACs interfacing for signal processing.
Designed for real-time embedded applications like industrial control, automotive, and communications.
Manufacturer
Package
- Package dimensions: 24 mm x 24 mm.
- Pitch: 0.5 mm.
- RoHS-compliant.
This package is suitable for surface-mount applications, offering a balance of compact size and ease of assembly.