AM1808EZWTD4

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AM1808EZWTD4

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IC MPU SITARA 456MHZ 361NFBGA

  • HerstellerTexas Instruments

  • Herstellerteil #AM1808EZWTD4

  • Paket NFBGA-361

  • Auf Lager4891

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Spezifikationen

Attribut Wert
Package / Case Tray
Series Sitara™
Part Status Active
Core Processor ARM926EJ-S
Number of Cores / Bus Width 1 Core, 32-Bit
Speed 456MHz
Co - Processors / DSP System Control; CP15
RAM Controllers LPDDR, DDR2
Graphics Acceleration No
Display&Interface Controllers LCD
Ethernet 10/100Mbps (1)
SATA SATA 3Gbps (1)
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I / O 1.8V, 3.3V
Operating Temperature -40°C ~ 90°C (TJ)

Übersicht

Equivalent

The AM1808EZWTD4 is a Texas Instruments (TI) ARM-based microprocessor. Equivalent or similar products include:
- TI AM1806, AM1802 (lower-spec variants)
- TI AM1707 (earlier generation)
- NXP LPC3250 (ARM9-based alternative)
- Atmel AT91SAM9G20 (ARM9 competitor)
For exact replacements, check TI's cross-reference tools or distributors like Digi-Key/Mouser for pin-compatible or functionally similar ARM9/ARM Cortex-M3/4 alternatives.

Pinout

The AM1808EZWTD4 is a 361-ball (16x16 grid) nFBGA (plastic fine-pitch ball grid array) package.
Key functions include:
- ARM926EJ-S core (up to 456 MHz).
- 128KB RAM, 64KB ROM, and external memory interfaces (EMIFA, DDR2).
- Peripherals: USB 2.0, UART, SPI, I²C, PWM, ADC, and more.
- Industrial/embedded applications (e.g., automation, medical devices).
Pin functions cover power, ground, I/O, and dedicated peripheral interfaces. For exact pinout details, refer to the TI datasheet.

Manufacturer

The AM1808EZWTD4 is a microprocessor manufactured by Texas Instruments (TI), a leading American semiconductor company. TI specializes in designing and producing analog and embedded processing chips for various industries, including automotive, industrial, and consumer electronics. The AM1808 is part of TI's Sitara™ ARM-based processor lineup, known for low-power, high-performance applications.
TI is a global tech giant headquartered in Dallas, Texas, with a strong focus on innovation in semiconductors and integrated circuits.

Package

The AM1808EZWTD4 is packaged in a 361-ball ZCE (also known as nFBGA) package. This 15 x 15 mm ball grid array (BGA) has a 0.65 mm ball pitch, making it suitable for compact, high-density PCB designs. The package is RoHS-compliant and designed for industrial applications.

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