ATSAMA5D21C-CUR

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ATSAMA5D21C-CUR

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IC MCU 32BIT EXT MEM 196TFBGA

  • HerstellerMikrochip-Technologie

  • Herstellerteil #ATSAMA5D21C-CUR

  • Paket TFBGA-196

  • Auf Lager4377

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Spezifikationen

Attribut Wert
Supplier Microchip Technology
Package / Case Tape & Reel (TR),Cut Tape (CT)
Series SAMA5D2
Part Status Active
Core Processor ARM® Cortex®-A5
Number of Cores / Bus Width 1 Core, 32-Bit
Speed 500MHz
Co - Processors / DSP Multimedia; NEON™ MPE
RAM Controllers LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration Yes
Display&Interface Controllers Keyboard, LCD, Touchscreen
Ethernet 10/100Mbps (1)
USB USB 2.0 + HSIC
Voltage - I / O 3.3V
Operating Temperature -40°C ~ 85°C (TA)
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC

Übersicht

Description

ATSAMA5D21C-CUR is Microchip/ATMEL’s member of the ATSAMA5D family: a 32‑bit ARM Cortex‑A5 based MCU/MPU designed for embedded systems that may run RTOS or Linux given sufficient memory and I/O.
Key points
- Core: ARM Cortex‑A5 with a memory management unit (MMU) for Linux/RTOS; suitable for applications requiring a capable embedded CPU.
- Integration: On‑chip boot ROM/flash and an external memory interface (DDR2/LPDDR2) for expandable RAM; rich set of peripherals.
- Peripherals: USB 2.0 (OTG), Ethernet MAC, multiple serial interfaces (USART/SPI/I2C), I2S, PWM, timers, ADC, LCD controller, DMA, and a crypto engine with security features (secure boot, cryptography acceleration).
- Package/variant: CUR denotes a specific package/pinout variant of the device.
- Tooling: Supported by Microchip development tools and software frameworks (Atmel Start, Studio, ASF/SDK).
Typical uses: industrial control, networking/storage appliances, HMI, and other embedded systems needing a Cortex‑A5 MCU with rich peripherals. For exact specs (clock, memory, pinout), consult the datasheet.

Equivalent

There isn’t an exact one-to-one equivalent. ATSAMA5D21C-CUR is a CUR module in Microchip’s SAMA5D2 family (Cortex-A5). The closest equivalents are other CUR modules in the SAMA5D2 line with similar CPU and peripherals. For a precise cross-reference, use Microchip’s Product Selector/Cross-Reference tool to find the closest pin-compatible or feature-compatible alternative.

Features

Here are the core features of ATSAMA5D21C-CUR (SAMA5D2 family):
- CPU: ARM Cortex-A5, 32-bit, ARMv7-A, up to ~533–536 MHz
- Memory: on-chip SRAM; external memory interfaces (SDRAM/NAND/NOR); flash options vary by part
- USB: USB OTG with host/device support
- Networking: Ethernet MAC (10/100 Mbps)
- Peripherals: CAN 2.0B, multiple UARTs/USARTs, SPI, I2C, PWM, timers
- Storage interfaces: SD/MMC/SDIO interfaces
- Analog: multi-channel 12-bit ADC (and related analog peripherals)
- Security: crypto engine (AES/DES/3DES, SHA-2) and hardware RNG
- Power: multiple low-power modes and power-management features
- Debug/Trace: JTAG/ETM with trace support
- Software/OS: support for Linux and RTOS environments; development tools (GCC, Microchip Studio)
Note: exact memory sizes, package options, and some peripherals may vary by specific CUR variant.

Pinout

- Pin count: 208 pins (CUR package)
- Function: 32‑bit ARM Cortex‑A5 based SoC/microcontroller (SAMA5D2 family) with on‑chip memory and integrated peripherals (USB, Ethernet, UART/SPI/I2C, etc.) for embedded applications.

Manufacturer

- Manufacturer: Microchip Technology Inc.
- What kind of company: A US-based multinational semiconductor company that designs, manufactures, and sells microcontrollers, microprocessors (including the SAM SAMA5D family), memory, and analog ICs, along with development tools and software.

Application

Applications include:
- Industrial automation and control (HMI, PLCs, motor control)
- Embedded networking/gateway devices (Ethernet, USB, CAN)
- Smart metering, energy management and power equipment
- Point-of-sale terminals, kiosks and digital signage
- Medical devices requiring reliable processing
- Embedded HMI and consumer/enterprise appliances
- Building/home automation and smart devices
- Data acquisition and instrumentation systems

Package

It uses a BGA package, specifically an LFBGA package with 208 balls (LFBGA208).

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