BCM43362KUBG

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BCM43362KUBG

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IC RF TXRX+MCU WIFI 802.11

  • HerstellerBroadcom Limited

  • Herstellerteil #BCM43362KUBG

  • Auf Lager23676

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Part Status Active
Type TxRx + MCU
RF Family/Standard WiFi
Protocol 802.11b/g/n
Modulation 16QAM, 64QAM, BPSK, CCK, DSSS, QPSK, OFDM
Frequency 2.4GHz
Data Rate (Max) 72Mbps
Power - Output 18.5dBm
Sensitivity -97dBm
Memory Size 448kB ROM, 240kB RAM
Serial Interfaces JTAG, SPI, UART
Voltage - Supply 1.2V ~ 3.3V
Current - Receiving 52mA ~ 59mA
Current - Transmitting 260mA ~ 320mA
Operating Temperature -30°C ~ 85°C
DigiKey Programmable Not Verified
GPIO 5

Übersicht

Description

The BCM43362KUBG is a highly integrated Wi-Fi system-on-chip (SoC) designed by Broadcom for embedded applications. It supports the IEEE 802.11b/g/n Wi-Fi standards, enabling wireless connectivity for various devices, such as IoT gadgets, home automation systems, and smart appliances. The chip is known for its low power consumption, making it suitable for battery-operated devices.
The BCM43362KUBG integrates a 2.4 GHz RF transceiver, power amplifier, low-noise amplifier, and other necessary components to offer robust wireless performance. It supports Wi-Fi Direct and other advanced features like WPA/WPA2 security, ensuring secure and reliable communication.
Typically, the BCM43362KUBG is used alongside microcontrollers in embedded systems to facilitate wireless communication. It is commonly found in modules that simplify the integration of Wi-Fi into products, leveraging its compact design and efficient operation. The chip is favored by developers for its ease of use, comprehensive documentation, and support for various application environments.

Equivalent

The BCM43362KUBG is a Wi-Fi chip often used in IoT applications. Equivalent products include:
1. ESP8266 by Espressif Systems: A popular Wi-Fi module for IoT projects.
2. ESP32 by Espressif Systems: An advanced version with dual-core and Bluetooth capabilities.
3. ATWINC1500 by Microchip Technology: A low-power Wi-Fi module.
4. RTL8720DN by Realtek: Offers both Wi-Fi and Bluetooth connectivity.
5. SPWF04SA by STMicroelectronics: A standalone Wi-Fi module aimed at IoT applications.
These alternatives vary based on features, power consumption, and connectivity options.

Features

The BCM43362KUBG is a Wi-Fi module designed by Broadcom, offering a range of features suitable for embedded applications. Key features include:
1. Wi-Fi Connectivity: Supports IEEE 802.11b/g/n standards, providing reliable wireless network connectivity.
2. Integrated ARM Cortex-M3: Includes an ARM Cortex-M3 processor, allowing for efficient processing and reduced need for external microcontrollers.
3. Low Power Consumption: Designed for low-power operation, making it ideal for battery-powered and IoT devices.
4. Security: Offers robust security features, including WPA/WPA2 Personal and Enterprise encryption standards.
5. High Data Rates: Capable of data rates up to 72 Mbps, supporting efficient data transmission.
6. Compact Package: Comes in a small form factor, facilitating easy integration into various designs.
7. Embedded TCP/IP Stack: Includes a complete TCP/IP stack, simplifying network communications.
8. Flexible Interfaces: Provides multiple interface options such as SDIO and SPI for easy connection with host processors.
These features make the BCM43362KUBG suitable for a wide range of wireless applications, including smart home devices, industrial automation, and portable electronics.

Pinout

The BCM43362KUBG is a Wi-Fi module designed by Broadcom. It is primarily used for wireless connectivity in IoT and embedded applications. The module typically comes in a compact form factor, but specific pin count details can vary based on the implementation by different manufacturers in their respective products. Generally, the module includes the following functional pins:
1. Power Supply Pins: For powering the module.
2. Ground Pins: For electrical grounding.
3. RF Pins: For antenna connections.
4. UART/SPI/SDIO Pins: For interface communication.
5. GPIO Pins: For general-purpose input/output.
6. Control Pins: For controlling the module’s functions like reset and wake.
The exact pin count and detailed pin functions should be verified from the specific datasheet or reference manual provided by the manufacturer that integrates the BCM43362KUBG into their product.

Manufacturer

The BCM43362KUBG is manufactured by Broadcom Inc., a global technology company. Broadcom specializes in designing, developing, and supplying semiconductor and infrastructure software solutions. They provide a wide array of products for various markets, including data center, networking, software, broadband, wireless, and storage. The BCM43362KUBG, specifically, is a Wi-Fi module that supports wireless connectivity, often used in embedded systems and Internet of Things (IoT) applications. Broadcom is known for its innovation in the semiconductor industry, and its technologies are widely used in consumer electronics, enterprise systems, and telecommunications.

Application

The BCM43362KUBG is a Wi-Fi module commonly used in a variety of applications that require wireless connectivity. Key application areas include:
1. Internet of Things (IoT): It is used in smart home devices, industrial IoT solutions, and other connected applications.

2. Consumer Electronics: Utilized in smartphones, tablets, and wearables for reliable Wi-Fi connectivity.
3. Home Automation: Powers smart appliances and home automation systems.
4. Healthcare Devices: Enables wireless communication in medical equipment and health monitoring devices.
5. Automotive: Integrated into infotainment systems and telematics for in-car connectivity.
Its compact size and integrated design make it ideal for space-constrained applications that require consistent and robust wireless performance.

Package

The BCM43362KUBG is a Wi-Fi module typically packaged in a compact BGA (Ball Grid Array) form factor. This allows for efficient board space utilization and is suitable for embedded applications.

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