BCM56643XB0KFSBLG

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BCM56643XB0KFSBLG

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IC TELECOM INTERFACE MULTI LAYER

  • HerstellerBroadcom Limited

  • Herstellerteil #BCM56643XB0KFSBLG

  • Auf Lager2100

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Part Status Obsolete
Base Product Number BCM56643

Übersicht

Description

The BCM56643XB0KFSBLG is a highly integrated Ethernet switch chip from Broadcom's StrataXGS family. Designed for enterprise and data center applications, it supports a range of Ethernet standards, including 10/25/40/100 Gigabit Ethernet, making it suitable for high-performance networking environments. The chip features advanced Layer 2 and Layer 3 capabilities, enabling efficient traffic management and low-latency performance.
Key features include support for various protocols, such as VLANs and multicast, and robust security features for network protection. Additionally, it offers power management solutions to optimize energy consumption. The BCM56643XB0KFSBLG is often utilized in switches, routers, and other networking equipment, providing scalability and flexibility for evolving network demands.
Overall, this device is engineered to enhance network performance while ensuring reliability and efficiency, catering to the needs of modern enterprise networks.

Equivalent

The BCM56643XB0KFSBLG chip is a Broadcom Ethernet switch typically used in networking applications. Equivalent products include the Marvell 88E6390X series, the Intel I210 series, and the Microchip KSZ9563 series. These alternatives provide similar features like multi-port switching and support for various Ethernet standards, but specific functionalities may vary. Always check detailed specifications for compatibility with your project requirements.

Features

The BCM56643XB0KFSBLG is a high-performance Ethernet switch chip designed for enterprise and data center applications. Key features include:
1. Ports: It supports up to 48 10GbE ports and 6 additional 100GbE ports, providing flexible connectivity.
2. Performance: Offers advanced Layer 2/3 switching capabilities with high throughput and low latency.
3. Scalability: Designed for high scalability, enabling support for large network configurations.
4. Power Efficiency: Incorporates energy-efficient technologies to reduce power consumption.
5. Management: Features comprehensive network management capabilities, including support for various management protocols.
6. Security: Implements robust security features to protect against network threats.
7. Quality of Service (QoS): Supports sophisticated QoS mechanisms to prioritize critical traffic.
8. Flexibility: Compatible with a range of networking architectures for versatile deployment options.
This chip is ideal for building high-capacity, reliable, and efficient network infrastructures in demanding environments.

Manufacturer

The BCM56643XB0KFSBLG is manufactured by Broadcom Inc., a global technology company that specializes in semiconductor and infrastructure software solutions. Founded in 1991, Broadcom is known for its wide range of products, including those used in networking, broadband, enterprise storage, and wireless communications. The BCM56643 is part of their family of Ethernet switch chips, specifically designed for high-performance data centers and enterprise networking applications. Broadcom operates in various sectors, providing critical components that enable connectivity and data transfer in various electronic devices and systems. The company emphasizes innovation and technological advancements in its product offerings, catering to the needs of a diverse customer base across multiple industries.

Application

The BCM56643XB0KFSBLG is a high-performance Ethernet switch designed for various application areas, including data centers, enterprise networking, and service provider networks. It supports Layer 2 and Layer 3 switching, making it suitable for routing and switching in cloud computing environments, IP video surveillance, and industrial automation. Additionally, it is used in edge networking devices, providing scalability and flexibility for managing high-bandwidth applications. Its advanced features enable efficient traffic management and enhanced network reliability.

Package

The BCM56643XB0KFSBLG is packaged in a 16mm x 16mm FCLGA (Flip-Chip Land Grid Array) package. This type of package is designed for high-performance applications, providing efficient thermal management and electrical connectivity.

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