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BCM56970B0KFSBG
+StücklisteB0 REVISION OF TOMAHAWK2
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HerstellerBroadcom Limited
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Herstellerteil #BCM56970B0KFSBG
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Auf Lager6356
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Part Status | Active |
Übersicht
Description
The BCM56970B0KFSBG provides robust scalability and integration options, with support for large routing tables and sophisticated quality of service (QoS) mechanisms. Its efficiency in power consumption and thermal management is tailored for large-scale deployments, providing cost and energy savings. Additionally, it supports advanced telemetry and analytics features, enabling real-time monitoring and diagnostics to ensure optimal network performance and reliability.
Overall, the BCM56970B0KFSBG serves as a critical component for organizations looking to enhance their network infrastructure to support growing data and connectivity requirements.
Equivalent
Features
1. High Port Density: It supports up to 128 ports of 25 GbE or 32 ports of 100 GbE, providing flexible port configurations for a variety of network topologies.
2. Advanced Packet Processing: Offers deep packet buffers and advanced traffic management capabilities, which are essential for managing large volumes of data efficiently.
3. Programmability: The chip supports Broadcom’s Network Programming Language (NPL), enabling customizable and dynamic packet processing for different network protocols.
4. Scalability and Flexibility: Designed to support a wide range of applications from enterprise data centers to cloud-based infrastructure, offering high scalability.
5. Energy Efficiency: Incorporates innovative power management features to reduce energy consumption, aligning with green data center initiatives.
6. Security Features: Includes comprehensive security features such as secure boot and runtime integrity verification for enhanced network protection.
These features make it suitable for modern network environments that demand high performance, flexibility, and security.
Pinout
Regarding the pin count, this specific model typically comes in a BGA (Ball Grid Array) package, and while the exact pin count for this variant isn't always publicly specified in generic sources, chips in this family commonly have a BGA pin count in the range of several hundred, often exceeding 1000 pins. These pins facilitate complex I/O functions and high-speed data transfer.
As for its functions, the BCM56970B0KFSBG is designed to handle high-speed Ethernet switching tasks, supporting multiple 10/25/40/50/100GbE interfaces. It is equipped with advanced features like deep packet buffers, large forwarding tables, and comprehensive quality of service (QoS) capabilities. The chip supports Layer 2 and Layer 3 switching, virtualization, and is optimized for software-defined networking (SDN) environments.