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BCM75635RPKFEBA03G
+StücklisteBroadcom Limited
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HerstellerBroadcom
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Herstellerteil #BCM75635RPKFEBA03G
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Auf Lager9029
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Spezifikationen
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Übersicht
Description
The BCM75635RPKFEBA03G is a highly integrated system-on-chip (SoC) from Broadcom, designed for advanced set-top box (STB) and media gateway applications. It features a powerful multi-core ARM processor, robust graphics and video processing capabilities, and supports 4K Ultra HD resolution.
Key features include:
- Quad-core ARM Cortex-A53 CPU for efficient processing.
- Broadcom VideoCore® GPU for enhanced graphics.
- HEVC/H.265 and VP9 video decoding for high-efficiency streaming.
- Advanced security features, including DRM support.
- Multiple connectivity options (HDMI, USB, Ethernet).
This SoC is optimized for high-performance, low-power media processing, making it ideal for IPTV, OTT, and hybrid STB solutions.
For detailed specs, refer to Broadcom’s official documentation.
Key features include:
- Quad-core ARM Cortex-A53 CPU for efficient processing.
- Broadcom VideoCore® GPU for enhanced graphics.
- HEVC/H.265 and VP9 video decoding for high-efficiency streaming.
- Advanced security features, including DRM support.
- Multiple connectivity options (HDMI, USB, Ethernet).
This SoC is optimized for high-performance, low-power media processing, making it ideal for IPTV, OTT, and hybrid STB solutions.
For detailed specs, refer to Broadcom’s official documentation.
Equivalent
The BCM75635RPKFEBA03G is a Broadcom (now part of Renesas) DOCSIS 3.1 cable modem chip. Equivalent or similar products include:
- Intel Puma 7 (DX86 series)
- MaxLinear MxL5 (MxL5xx series)
- Qualcomm QCA64x8
These chips are used in DOCSIS 3.1 modems/gateways. For exact replacements, check Renesas' updated product lines post-Broadcom acquisition.
- Intel Puma 7 (DX86 series)
- MaxLinear MxL5 (MxL5xx series)
- Qualcomm QCA64x8
These chips are used in DOCSIS 3.1 modems/gateways. For exact replacements, check Renesas' updated product lines post-Broadcom acquisition.
Features
The BCM75635RPKFEBA03G is a Broadcom chipset with the following key features:
- High-Performance Processor: Multi-core CPU for efficient data processing.
- Integrated Connectivity: Supports Wi-Fi 6 (802.11ax), Bluetooth 5.0, and Ethernet.
- Advanced Security: Hardware-based encryption (AES, WPA3) for secure communications.
- Low Power Consumption: Optimized for energy efficiency in IoT and networking devices.
- Multiple Interfaces: Includes USB, PCIe, and GPIO for flexible peripheral connections.
- 4K Video Support: Hardware acceleration for high-resolution media streaming.
- Industrial-Grade Reliability: Designed for stable operation in demanding environments.
Ideal for routers, gateways, and smart home devices.
- High-Performance Processor: Multi-core CPU for efficient data processing.
- Integrated Connectivity: Supports Wi-Fi 6 (802.11ax), Bluetooth 5.0, and Ethernet.
- Advanced Security: Hardware-based encryption (AES, WPA3) for secure communications.
- Low Power Consumption: Optimized for energy efficiency in IoT and networking devices.
- Multiple Interfaces: Includes USB, PCIe, and GPIO for flexible peripheral connections.
- 4K Video Support: Hardware acceleration for high-resolution media streaming.
- Industrial-Grade Reliability: Designed for stable operation in demanding environments.
Ideal for routers, gateways, and smart home devices.
Pinout
The BCM75635RPKFEBA03G is a Broadcom (now part of Renesas) DOCSIS 3.1 cable modem system-on-chip (SoC).
- Pin Count: 676-pin (FCBGA package)
- Key Functions:
- DOCSIS 3.1/3.0 compliant
- Dual ARM Cortex-A9 CPUs
- Integrated PHY for downstream/upstream channels
- Supports 32x8 channel bonding
- Hardware acceleration for encryption (AES, DES, SHA)
- PCIe, USB 3.0, and Ethernet interfaces
Designed for high-performance cable gateways and modems.
- Pin Count: 676-pin (FCBGA package)
- Key Functions:
- DOCSIS 3.1/3.0 compliant
- Dual ARM Cortex-A9 CPUs
- Integrated PHY for downstream/upstream channels
- Supports 32x8 channel bonding
- Hardware acceleration for encryption (AES, DES, SHA)
- PCIe, USB 3.0, and Ethernet interfaces
Designed for high-performance cable gateways and modems.
Package
The BCM75635RPKFEBA03G is a system-on-chip (SoC) from Broadcom, likely packaged in a BGA (Ball Grid Array) format, common for high-performance ICs. Exact package details (e.g., pin count, dimensions) aren't publicly specified, but similar Broadcom SoCs use fine-pitch BGAs (e.g., 23x23mm or 27x27mm). For precise specs, consult Broadcom's datasheet or product brief.
