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BCM88470CB0KFSBG
+Stückliste300 GBE CENTRALIZED SWITH
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HerstellerBroadcom Limited
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Herstellerteil #BCM88470CB0KFSBG
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Paket BGA-1365
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Auf Lager5118
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Part Status | Active |
| Protocol | Ethernet |
| Function | Switch |
| Interface | Ethernet |
Übersicht
Description
The BCM88470CB0KFSBG incorporates advanced hardware-based forwarding and packet processing abilities, supporting a wide range of networking protocols and standards. It is designed to deliver high throughput and scalability, addressing the growing demand for bandwidth and network complexity. With enhanced programmability, this switch IC can be adapted to various network configurations and requirements, ensuring future-proof network deployments. Its compact design and integration of multiple functions into a single chip help reduce the overall cost and power consumption of network equipment.
Equivalent
Features
1. High Port Density: Supports multiple 10G, 25G, 40G, 50G, and 100G Ethernet ports, making it suitable for data center and enterprise networking applications.
2. Advanced Switching Capabilities: Offers high-throughput switching with deep buffering capabilities for optimal performance in high-traffic environments.
3. Scalability: Designed to support large-scale network deployments with flexible port configurations and advanced load balancing.
4. Programmability: Supports programmable forwarding pipelines, enabling customization and optimization for specific network requirements.
5. Low Latency: Provides low-latency packet processing, essential for high-speed data center applications.
6. Enhanced Security: Includes features for enhanced security, such as support for advanced encryption standards and secure boot mechanisms.
7. Energy Efficient: Designed with power-saving technologies to reduce operational costs while maintaining high performance.
These features make the BCM88470CB0KFSBG a versatile and powerful choice for modern networking solutions.
Pinout
For precise information regarding pin count and specific functions, access to Broadcom's technical documents, such as a detailed datasheet or a product brief, would be necessary. These documents are typically available to Broadcom's customers or partners under a non-disclosure agreement (NDA) due to the proprietary nature of the technology. For general inquiries, visiting Broadcom's official website or contacting their support team might provide further assistance.
Manufacturer
Application
1. Data Center Networks: Facilitates high-speed data transfer and efficient network management.
2. Enterprise Networking: Provides robust connectivity solutions for large organizations.
3. Telecommunications Infrastructure: Supports high-capacity and reliable telecom networks.
4. Cloud Computing Environments: Enhances connectivity and data processing for cloud services.
5. Network Security Appliances: Ensures secure data transmission and network protection.
These applications leverage the chip’s advanced switching capabilities, scalability, and support for high-bandwidth operations.