BGA6130,118

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BGA6130,118

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IC AMP ISM 400MHZ-2.7GHZ 8HVSON

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

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Spezifikationen

Attribut Wert
Supplier NXP USA Inc.
Package Tape & Reel (TR),Cut Tape (CT)
ProductStatus Active
Frequency 400MHz ~ 2.7GHz
P1dB 29dBm
Gain 14dB ~ 17dB
NoiseFigure 4dB
RFType ISM
Voltage-Supply 3.6V
Current-Supply 70mA
TestFrequency 915MHz
MountingType Surface Mount
Package/Case 8-VFDFN Exposed Pad

Übersicht

Description

BGA6130,118 appears to be a specific course code, likely from an educational institution. As the details of such courses can vary widely across institutions, a general introduction might not be available without more context. Typically, course codes like this one are used to identify specific courses within a program or department.
To understand what BGA6130,118 entails, you would need to consult the course catalog or syllabus provided by the institution offering it. Generally, the "BGA" prefix might indicate the department or field of study, such as Business, Government, or Analytics. The numbers "6130" and "118" could denote the level of the course, with the first number often suggesting it's a graduate-level class.
For a concise and precise understanding, check the institution's official resources or contact the course instructor or administration directly. They can provide details like course content, objectives, prerequisites, and relevance to your study or career goals.

Equivalent

The BGA6130,118 is a RF amplifier designed by NXP Semiconductors. For equivalent alternatives, consider products like Skyworks SKY65050, Qorvo RFPA3800, or Analog Devices HMC374. These alternatives offer similar functionalities, focusing on gain, linearity, and frequency range. Ensure compatibility with your specific application by reviewing datasheets and technical specifications for each alternative.

Features

The BGA6130 is a highly integrated RF front-end module designed for wireless communication applications, such as Wi-Fi, Bluetooth, and other short-range wireless technologies. It is commonly used in devices where space and power efficiency are crucial. Here are some key features of the BGA6130:
1. Integration: Combines multiple RF components into a single package, reducing the need for additional components on the PCB.

2. Frequency Range: Typically supports a wide frequency range suitable for various wireless standards.
3. Low Noise Amplifier (LNA): Enhances signal reception by amplifying weak signals with minimal added noise.
4. Power Amplifier (PA): Boosts the strength of the outgoing signal to ensure it reaches the desired range.
5. Switching Capabilities: May include RF switches for routing signals between different paths or antennas.
6. Compact Package: Often comes in a small form factor, making it ideal for mobile and space-constrained applications.
7. Efficiency: Designed to provide high performance with low power consumption, extending the battery life of portable devices.
Please refer to the manufacturer's datasheet for precise specifications and applications.

Pinout

The BGA6130,118 is a power amplifier module designed for wireless communication applications. It typically features a compact Ball Grid Array (BGA) package. While specific documentation from NXP Semiconductors provides the detailed pin count and functions, generally, these modules include pins for RF input/output, power supply, biasing, and control interfaces. The exact pin count can vary based on the package and specific model revisions. For precise details, it is best to consult the manufacturer's datasheet or technical manual, which will include pin numbers, names, and their respective functions. This will provide comprehensive information about the module's electrical characteristics and connection requirements.

Manufacturer

The BGA6130,118 is manufactured by NXP Semiconductors. NXP is a global semiconductor company headquartered in Eindhoven, Netherlands. It specializes in designing and producing semiconductors for various applications, including automotive, communication infrastructure, industrial, mobile, and consumer markets. NXP is known for its work in secure connectivity solutions, providing technologies that drive innovations in the Internet of Things (IoT), smart cities, and secure connectivity for embedded applications. The company aims to enable secure connections and infrastructure for a smarter world, focusing on areas such as automotive electronics, secure identification, RF power, digital networking, and more.

Application

The BGA6130 is typically used in radio frequency (RF) applications, such as satellite communication, wireless infrastructure, and radar systems. It is a low-noise amplifier (LNA) that enhances signal reception by amplifying weak signals while minimizing additional noise. This makes it suitable for improving the performance of receivers in communication systems. The BGA6130 is also used in aerospace, defense, and telecommunications industries for applications that require high-frequency signal processing and reliable performance under varying environmental conditions. Its compact design and efficient power consumption make it ideal for portable and space-constrained devices.

Package

The BGA6130,118 is typically associated with a package type known as "SOT-343" or "SC-70." This is a small-outline transistor package commonly used for RF and microwave applications. It is designed for efficient space utilization on printed circuit boards.

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