BGA7H1N6E6327XTSA1

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BGA7H1N6E6327XTSA1

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IC AMP LTE 2.3-2.69GHZ TSNP6-2

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Supplier Infineon Technologies
Package / Case Tape & Reel (TR),Cut Tape (CT)
Part Status Active
Frequency 2.3GHz ~ 2.69GHz
P1d B -8dBm
Gain 12.5dB
Noise Figure 0.6dB
RF Type LTE
Voltage - Supply 1.5V ~ 3.3V
Supply Current 4.7mA
Mounting Type Surface Mount

Übersicht

Description

"BGA7H1N6E6327XTSA1" appears to be a unique identifier or code, potentially representing a specific product, component, or document. While the exact nature of this identifier is not clear without further context, such codes are often used in industries like electronics, manufacturing, or logistics to track inventory, identify components, or refer to particular documents or data sets.
If BGA7H1N6E6327XTSA1 pertains to a Ball Grid Array (BGA), it might be a part or model number for a semiconductor package used in electronics to mount devices such as microprocessors. BGAs are known for their efficient use of space and enhanced performance due to their array of solder balls on the underside.
For a comprehensive understanding or specific details about BGA7H1N6E6327XTSA1, you would typically refer to product documentation, a manufacturer's database, or an industry-specific catalog. Access to these resources would provide accurate and complete information tailored to the context in which the identifier is used.

Equivalent

Finding an equivalent for the BGA7H1N6E6327XTSA1 chip requires specific knowledge of its specifications and performance. However, it is identified as an RF amplifier from Infineon Technologies. To find an equivalent, look for RF amplifiers from other manufacturers like Analog Devices, Qorvo, or Skyworks with similar frequency range, gain, noise figure, and power output. Always consult datasheets and application notes for compatibility.

Pinout

The BGA7H1N6E6327XTSA1 is a product from Infineon Technologies, specifically designed for RF amplification applications. It features a 6-pin configuration and is housed in a TSNP-6-2 package. This device is typically used in mobile applications due to its compact size and high-efficiency performance. The primary function of this component is to amplify RF signals, making it suitable for use in mobile and wireless communication devices. Its design supports low noise and high linearity, essential for maintaining signal integrity in communication systems.

Manufacturer

The BGA7H1N6E6327XTSA1 is manufactured by Infineon Technologies AG. Infineon is a German semiconductor manufacturer that specializes in a wide range of electronic components and systems. The company is known for its innovation in areas such as automotive, power management, industrial applications, and security solutions. Infineon's products are utilized in various industries, including automotive, industrial electronics, communication, and consumer applications. The company is recognized for its contribution to energy efficiency, mobility, and security, and it plays a significant role in the advancement of technologies like electric vehicles, renewable energy, and IoT (Internet of Things). As a leader in the semiconductor industry, Infineon focuses on providing high-quality and reliable components that meet the demands of modern electronic applications.

Application

The BGA7H1N6E6327XTSA1 is a low-noise amplifier (LNA) designed for RF applications. Its primary application areas include:
1. Wireless Communication: Enhancing signal reception in devices like smartphones, tablets, and wireless LANs.
2. Infrastructure: Used in base stations to improve signal clarity and strength.
3. IoT Devices: Amplifying weak signals in the Internet of Things applications.
4. Satellite Communication: Assisting in signal amplification for better transmission and reception.
5. GNSS and GPS Systems: Improving signal sensitivity for location-based services.
These applications benefit from the amplifier's ability to enhance weak input signals while maintaining low noise levels.

Package

The package type for the component with the part number BGA7H1N6E6327XTSA1 is a Ball Grid Array (BGA). BGA packages are used for mounting integrated circuits and feature an array of solder balls on the underside for electrical connections.

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