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BGM113A256V2R
+StücklisteRX TXRX MOD BLUETOOTH CHIP SMD
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HerstellerSilicon Labs
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Herstellerteil #BGM113A256V2R
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Paket 36-SMDModule
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Auf Lager2210
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | Blue Gecko |
| ProductStatus | Active |
| RFFamily/Standard | Bluetooth |
| Protocol | Bluetooth v4.1 |
| Frequency | 2.4GHz |
| DataRate | 1Mbps |
| Power-Output | 3dBm |
| Sensitivity | -93dBm |
| SerialInterfaces | SPI, UART |
| AntennaType | Integrated, Chip |
| UtilizedIC/Part | EFR32BG |
| MemorySize | 256kB Flash, 32kB RAM |
| Voltage-Supply | 3.8V |
| Current-Receiving | 8.7mA |
| Current-Transmitting | 8.8mA |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 85°C |
Übersicht
Description
The BGM113A256V2R supports Bluetooth 4.2 and offers various interfaces such as UART, SPI, and I2C, facilitating communication with other devices and sensors. It is engineered for low power consumption, making it suitable for battery-operated devices and Internet of Things (IoT) applications. The module is pre-certified, simplifying regulatory compliance for developers. Additionally, its small form factor makes it ideal for compact device designs.
Silicon Labs provides development tools and software, including the BGScript scripting language, to enable rapid development and deployment of Bluetooth applications. Overall, the BGM113A256V2R is a versatile module for developers looking to incorporate BLE functionality into their products.
Equivalent
Features
1. Bluetooth 4.2 Compliance: Supports BLE 4.2, ensuring compatibility with a wide range of Bluetooth devices.
2. Low Power Consumption: Optimized for energy-efficient operation, ideal for battery-powered devices.
3. Integrated Antenna: Built-in antenna simplifies design and reduces the need for external components.
4. 32-bit ARM Cortex-M4 Processor: Provides robust processing power for complex applications.
5. Up to 256 KB Flash Memory: Allows for ample storage of application code and data.
6. Peripheral Interfaces: Includes UART, SPI, I2C, and GPIOs for flexible connectivity.
7. Compact Size: Small form factor (12.9 mm x 15.0 mm x 2.2 mm), making it suitable for space-constrained applications.
8. Security Features: Offers secure connections with AES encryption.
9. Development Tools: Supported by Silicon Labs' software and tools for simplified development and deployment.
10. Wide Operating Temperature Range: Suitable for diverse environments (-40°C to +85°C).
These features make the BGM113A256V2R an excellent choice for IoT, wearable, and smart device applications.
Pinout
The module typically has 32 pins, though the specific pin count and configuration can vary depending on the application and package type. Its key functions include providing Bluetooth connectivity with low energy consumption, making it suitable for applications like IoT devices, health and fitness products, and smart home applications. The BGM113 module supports both central and peripheral roles, and it offers features such as hardware cryptography, a hardware random number generator, and various GPIOs for peripheral connections. Additionally, it has integrated antenna and RF matching components for simplified design. For detailed pin configuration and functions, consulting the manufacturer's datasheet is recommended.
Manufacturer
Application
1. Wearable Devices: For fitness trackers and health monitoring devices, enabling Bluetooth connectivity.
2. IoT Devices: Facilitates wireless communication in smart home devices like sensors and controllers.
3. Remote Controls: Used in Bluetooth-enabled remote control applications for consumer electronics.
4. Beacons: Ideal for location-based services and indoor navigation systems.
5. Automotive: Provides connectivity for in-car systems and diagnostics.
6. Healthcare: Used in medical devices for wireless data transfer and monitoring.
7. Industrial Automation: Enables machine-to-machine communication in industrial settings.
Its compact form and low power consumption make it versatile for embedded applications.