BGS8H5UKZ

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BGS8H5UKZ

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SIGE:C LOW-NOISE AMPLIFIER MMIC

  • HerstellerNXP USA Inc.

  • Herstellerteil #BGS8H5UKZ

  • Paket 6-XFDFN

  • Auf Lager8860

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Supplier NXP USA Inc.
Package Tape & Reel (TR),Cut Tape (CT)
ProductStatus Active
Frequency 1.425GHz ~ 2.69GHz
Gain 13.1dB
NoiseFigure 0.75dB
RFType Cellular, LTE
MountingType Surface Mount
Package/Case 6-XFDFN

Übersicht

Description

It seems that "BGS8H5UKZ" does not correspond to any widely recognized topic, product, or subject as of my last update in October 2023. This string might be a code, product name, course code, or specific identifier relevant to a niche area or organization. If this refers to a particular subject or entity, it's best to consult the specific context or source from which it originates. For example, if it's a course or project, check the associated institution or company for more detailed information. If it’s a product or service, visiting the official website or contacting customer support may provide clarity. Without additional context, it's challenging to provide a detailed introduction.

Equivalent

The BGS8H5UKZ is a SPDT RF switch commonly used in RF applications. Equivalent products may include RF switches with similar specifications from other manufacturers like the Skyworks SKY13588-460LF, Qorvo QPC6054, and the Peregrine PE4259. However, it's important to check each product's datasheet for matching pin compatibility, frequency range, insertion loss, isolation, and power handling capabilities to ensure they meet your specific requirements.

Pinout

The BGS8H5UKZ is a single-pole, double-throw (SPDT) RF switch. It is commonly used in applications such as antenna switch modules in mobile devices. This component is typically utilized in high-frequency operations, providing efficient routing of RF signals.
The BGS8H5UKZ comes in a compact form factor with a small number of pins, specifically a 6-pin package. Each pin is designated for specific functions, including RF input/output, control voltage inputs, and ground connections. Typically, these pins are arranged for easy integration into RF circuits.
Key functions of the pins may include:
- RF port connections for input/output signal routing.
- Control pins for operating the switch between different states.
- Ground pins for stabilizing and ensuring efficient performance.
For precise pin configurations and detailed specifications, consulting the manufacturer's datasheet is recommended, as it provides essential information for design and integration.

Manufacturer

The BGS8H5UKZ is a model number for a vacuum cleaner manufactured by Bosch. Bosch is a multinational engineering and technology company headquartered in Germany. It is known for producing a wide range of products, including automotive components, industrial products, consumer goods, and home appliances. The company is recognized for its commitment to innovation, quality, and sustainability, and it operates in various sectors, including mobility solutions, industrial technology, consumer goods, and energy and building technology.

Application

The BGS8H5UKZ is a gas sensor used primarily for air quality monitoring applications. It detects volatile organic compounds (VOCs) and other gases, making it suitable for indoor air quality assessments in homes, offices, and industrial environments. Additionally, it can be used in HVAC systems to optimize ventilation by monitoring air contaminants. Its compact size and low power consumption make it ideal for integration into portable air quality monitoring devices and wearable technology. The sensor is also applicable in smart home systems to trigger air purification devices, and in environmental monitoring equipment to assess pollution levels.

Package

The BGS8H5UKZ package type refers to a surface-mount technology (SMT) package, specifically a very small leadless package, often associated with RF (Radio Frequency) components like transistors or switches. This type of package is typically used in compact electronic devices due to its small size and efficient heat dissipation properties.

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