BK3266

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BK3266

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  • HerstellerJLCPCB-Baugruppe

  • Herstellerteil #BK3266

  • Auf Lager8251

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Spezifikationen

Attribut Wert
Manufacturer JLCPCB Assembly
Package QFN32

Übersicht

Description

BK3266 is a Bluetooth Low Energy (BLE) system-on-chip (SoC) developed by Beken Corporation, designed for wireless connectivity in IoT and smart devices. It supports Bluetooth 5.0 and features low power consumption, making it ideal for wearables, smart home products, and wireless peripherals.
Key features include:
- Bluetooth 5.0 compliance (2Mbps data rate, extended range).
- Low power operation for battery-efficient applications.
- Integrated MCU (32-bit RISC core) for embedded processing.
- Rich peripherals (UART, SPI, I2C, PWM, ADC).
- Compact footprint for space-constrained designs.
Applications include wireless audio, beacons, sensors, and remote controls. The BK3266 is known for its cost-effectiveness and ease of integration, supported by Beken’s SDK and development tools.
For detailed specs, refer to Beken’s official documentation.

Equivalent

The BK3266 is a Bluetooth audio SoC. Equivalent alternatives include:
- JL AC6926A
- ATS2825
- BK3254
- AB1562 (Airoha)
- RTL8763B (Realtek)
These chips offer similar Bluetooth audio functionality, supporting features like hands-free calling, stereo audio, and low-power operation. Check datasheets for exact compatibility.

Features

The BK3266 is a low-power Bluetooth audio SoC (System-on-Chip) designed for wireless audio applications. Key features include:
- Bluetooth 5.0 support for stable connectivity.
- Low power consumption for extended battery life.
- Integrated DSP for audio processing (EQ, noise reduction).
- Supports SBC, AAC, and aptX audio codecs.
- Built-in microphone amplifier for voice calls.
- Multi-function GPIOs for flexible peripheral control.
- Compact QFN package for space-saving designs.
- Wide operating voltage (2.5V–5.5V) for compatibility.
Ideal for TWS earbuds, headsets, and portable audio devices.

Pinout

The BK3266 is a Bluetooth system-on-chip (SoC) designed for wireless audio applications. It typically comes in a 32-pin QFN package.
Key Functions:
- Bluetooth Connectivity: Supports Bluetooth 5.0 (or earlier versions, depending on the variant).
- Audio Processing: Integrated DSP for noise reduction, echo cancellation, and audio codecs (e.g., SBC).
- Low Power: Optimized for battery-operated devices like TWS earbuds and headsets.
- Peripheral Support: Interfaces with flash memory, buttons, LEDs, and analog/digital audio inputs/outputs.
- Wireless Features: Supports pairing, A2DP, HFP, and AVRCP profiles.
The exact pin functions (e.g., GPIO, power, audio I/O) vary by application but align with standard Bluetooth audio SoC configurations. For specifics, refer to the datasheet.

Application

The BK3266 is a Bluetooth audio SoC (System-on-Chip) commonly used in:
1. Wireless Earbuds & Headphones – Supports Bluetooth 5.0 for stable audio streaming.
2. Bluetooth Speakers – Enables high-quality audio playback with low power consumption.
3. Hands-Free Devices – Used in car kits and Bluetooth-enabled microphones.
4. Wearable Devices – Integrates with smartwatches and fitness trackers for audio functions.
5. IoT Accessories – Powers wireless audio in smart home gadgets.
Its low power, compact design, and support for HSP/HFP/A2DP/AVRCP profiles make it versatile for consumer electronics.

Package

The BK3266 is typically available in a QFN (Quad Flat No-leads) package, commonly a 4mm x 4mm size with 32 pins. This compact, surface-mount package is suitable for Bluetooth audio applications, offering efficient thermal performance and space-saving design. Exact variants may differ by manufacturer, so verify datasheets for specifics.

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