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CSD87331Q3D
+StücklisteMOSFET 2N-CH 30V 15A 8LSON
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HerstellerTexas Instruments
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Herstellerteil #CSD87331Q3D
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Paket LDFN-8
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Auf Lager6404
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tape & Reel (TR),Cut Tape (CT),Bulk |
| Series | NexFET™ |
| Part Status | Active |
| FET Type | 2 N-Channel (Half Bridge) |
| FET Feature | Standard |
| Drain to Source Voltage (Vdss) | 30V |
| Current - Continuous Drain(Id) @ 25°C | 15A |
| Vgs(th)(Max) @ Id | 2.1V, 1.2V @ 250µA |
| Gate Charge(Qg)(Max) @ Vgs | 3.2nC @ 4.5V |
| Input Capacitance(Ciss)(Max) @ Vds | 518pF @ 15V |
| Power - Max | 6W |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
Übersicht
Description
This module might include features such as integrated MOSFETs, gate drivers, and protection mechanisms to ensure safe and efficient operation. It may be used in applications like DC-DC converters, motor drives, servers, or telecommunications equipment, where high efficiency and compact design are critical.
For precise specifications, applications, and datasheets, it's best to refer directly to the manufacturer's documentation or product page. This will provide detailed technical information, including electrical characteristics, thermal performance, and recommended usage guidelines.
Equivalent
1. Infineon’s Power Block series
2. ON Semiconductor’s FDMFxxxx series
3. Vishay’s SiCxxxx series
It's important to compare electrical specifications and features to ensure compatibility. Always verify with the manufacturer or datasheets for precise equivalency.
Features
1. Integration: Combines high-side and low-side MOSFETs with optimized gate drive circuitry and fast switching capabilities.
2. Efficiency: Offers high efficiency over a wide load range, making it ideal for applications that require low power loss and thermal performance.
3. Compact Package: Comes in a compact, space-saving, dual-sided cooling package, enhancing thermal performance and simplifying PCB layout.
4. High Frequency: Supports high-frequency operation, which allows for smaller external components and more compact power-supply designs.
5. Current Rating: Designed to handle high current, supporting up to 40A continuous current.
6. Low Switching Loss: Features low switching losses due to optimized MOSFETs, reducing overall power consumption.
7. Protection Features: Includes various protection features, such as over-current and over-temperature protection, ensuring robustness and reliability.
These features make the CSD87331Q3D suitable for use in high-performance computing, telecommunications, and other applications requiring efficient power management.
Pinout
Although specific pin counts and functions can vary slightly depending on the manufacturer’s exact design, for the CSD87331Q3D, typical key pins include:
1. SW (Switch Node): Connects to the inductor in the buck converter circuit.
2. VIN/VIN(PH): Input voltage pin for the high-side MOSFET.
3. BOOT: Bootstrap capacitor connection for the high-side MOSFET gate drive.
4. GND: Common ground connection.
5. VOUT: Output voltage pin.
For precise pin count and detailed pin function, refer to the device’s datasheet provided by Texas Instruments, as it contains the full pin diagram and description necessary for proper integration into your circuit.