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CY7C1356C-166AXI
+StücklisteIC SRAM 9MBIT PARALLEL 100TQFP
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HerstellerInfineon-Technologien
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Herstellerteil #CY7C1356C-166AXI
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Auf Lager9494
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
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Spezifikationen
| Attribut | Wert |
| Series | NoBL™ |
| Part Status | Last Time Buy |
| Digi Key Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | SRAM |
| Technology | SRAM - Synchronous, SDR |
| Memory Size | 9Mbit |
| Memory Organization | 512K x 18 |
| Memory Interface | Parallel |
| Voltage - Supply | 3.135V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 100-LQFP |
| Supplier Device Package | 100-TQFP (14x20) |
| Base Product Number | CY7C1356 |
| Clock Frequency | 166 MHz |
| Access Time | 3.5 ns |
Übersicht
Description
The device supports standard synchronous burst operation, which allows for efficient data handling and throughput. It operates on a 3.3V power supply and provides an industrial temperature range, making it versatile for various applications, including telecommunications, networking, and data acquisition systems.
The CY7C1356C-166AXI includes advanced features like late write and address pipelines, facilitating streamlined operations. It uses a flow-through output register for increased data output rates and features a programmable burst sequence for flexibility in data management.
Overall, the CY7C1356C-166AXI is designed for reliability and performance, catering to applications that require robust memory solutions in demanding environments.
Equivalent
1. IDT71V416S (Integrated Device Technology)
2. IS61/64WV25636 (ISSI)
3. AS7C34098A (Alliance Memory)
These are alternatives with similar configurations, although specifications like speed, power consumption, and package type should be checked for exact compatibility.
Features
1. Speed & Performance: It operates at a frequency of up to 166 MHz, providing fast access times. The pipelined architecture ensures high-speed data transfer.
2. Burst Operation: Supports burst operation for efficient data access, reducing the need for external address control.
3. Flow-Through or Pipelined Read: Offers selectable read modes to enhance system performance.
4. Dual Cycle Deselect: Allows for quick switching between read and write cycles, enhancing throughput.
5. Power Management: Features low power standby modes to conserve energy.
6. Interface & Compatibility: Compatible with standard 3.3V power supply and interfaces easily with various microprocessors and digital signal processors.
7. Packaging: Available in a 100-pin TQFP (Thin Quad Flat Pack), optimizing space for high-density applications.
These features make the CY7C1356C-166AXI suitable for high-speed computing and communication applications, including networking and data acquisition systems.
Pinout
The key functionalities of this SRAM include:
1. Synchronous Operation: All inputs and outputs are synchronized with the clock, ensuring high-speed and reliable data transfers.
2. Burst Operation: Supports standard burst sequences for efficient data access.
3. Single Read/Write Control: Simplifies the interface by using a common control for read and write operations.
4. Low Power Consumption: Incorporates power-saving features without sacrificing performance.
5. Variable Drive Strength: Configurable output drive strength for optimized signal integrity.
This memory chip is ideal for applications that require fast access to data, such as routers, switches, and other networking equipment. Its synchronous design and support for burst operations make it suitable for high-performance computing environments.
Manufacturer
Cypress Semiconductor was known for its innovation in the semiconductor industry, focusing on providing high-performance and reliable solutions. In 2020, Cypress Semiconductor was acquired by Infineon Technologies AG, a German semiconductor manufacturer, which integrated Cypress's products and technologies into its portfolio. Infineon is recognized for its focus on developing technology solutions for energy efficiency, mobility, and security.