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DA14695-00000HQ2
+StücklisteIC RF TXRX+MCU BLE 86VFBGA
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HerstellerRenesas Electronics Corporation
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Herstellerteil #DA14695-00000HQ2
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Auf Lager21085
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Spezifikationen
| Attribut | Wert |
| Series | SmartBond™ |
| Part Status | Active |
| Type | TxRx + MCU |
| RF Family/Standard | Bluetooth |
| Protocol | Bluetooth v5.2 |
| Frequency | 2.4GHz |
| Power - Output | 6dBm |
| Sensitivity | -97dBm |
| Serial Interfaces | GPIO, I2C, I2S, SPI, UART |
| Voltage - Supply | 2.4V ~ 4.75V |
| Mounting Type | Surface Mount |
| Package / Case | 86-VFBGA |
| Supplier Device Package | 86-VFBGA (6x6) |
| Base Product Number | DA14695 |
| DigiKey Programmable | Not Verified |
| GPIO | 20 |
Übersicht
Description
Key features of the DA14695 include advanced power management options, allowing for extended battery life, and a flexible memory architecture, supporting up to 512 kB of RAM. It is equipped with a Bluetooth 5.1 radio, providing robust wireless connectivity with features like long-range and high-throughput modes.
The chip also includes numerous interfaces such as I2C, SPI, UART, and PDM, making it suitable for a broad range of applications, including smart home devices, wearables, and healthcare products. It supports various development tools and platforms, facilitating easy integration and rapid prototyping.
Overall, the DA14695-00000HQ2 offers a highly integrated solution with a balance of performance, connectivity, and energy efficiency, ideal for next-generation IoT products.
Equivalent
Features
1. Bluetooth 5.1 Support: Offers improved range, speed, and broadcast capacity compared to previous versions.
2. Multi-Core Architecture: Equipped with an Arm Cortex-M33 processor for high-performance tasks, alongside a Cortex-M0+ for efficiency.
3. Integrated Power Management: Includes a flexible power management system with multiple power domains and low-power states to optimize energy consumption.
4. Memory: Configured with 512 KB of RAM and 128 KB of ROM, facilitating complex applications and OTA updates.
5. Security: Features hardware-based security, including a True Random Number Generator and Secure Boot.
6. Analog Features: Comes with a 2-channel, 12-bit ADC and a temperature sensor.
7. Connectivity Options: Supports multiple interfaces such as I2C, SPI, UART, and PDM.
8. Development Tools: Compatible with the SmartSnippets™ development environment for efficient product development.
These features make it ideal for applications in wearable devices, smart home products, and other IoT solutions.
Pinout
This particular chip is housed in a 6x6 mm QFN package with a pin count of 72. The DA14695 integrates several functions, including:
1. Bluetooth 5.0 Connectivity: Supports features such as LE 2M PHY, LE Coded PHY (for extended range), and Bluetooth mesh networking.
2. Processing Power: An ARM Cortex-M33 processor for efficient operation and application processing.
3. Memory: Includes both Flash and RAM, specifically 512 KB of Flash and 128 KB of RAM.
4. Security Features: Hardware-based security functions, including a true random number generator and cryptographic accelerators.
5. Peripherals: Supports various interfaces like UART, SPI, I2C, and PWM for connectivity with external devices.
6. Power Management: Advanced power management features for low power consumption, making it ideal for battery-powered devices.
This SoC is typically used in applications such as fitness trackers, smart home devices, and other IoT products requiring efficient BLE connectivity.
Manufacturer
In 2021, Dialog Semiconductor was acquired by Renesas Electronics Corporation, a leading supplier of advanced semiconductor solutions. Renesas is a Japanese company that provides a wide range of microcontrollers, analog, power, and SoC products. The acquisition by Renesas expanded their capabilities in the Internet of Things (IoT), industrial, and automotive sectors, leveraging Dialog’s expertise in mixed-signal and power management technologies.
Through this acquisition, Dialog Semiconductor's products have become part of Renesas’ broader product offerings, further enhancing their market reach and development capabilities in the semiconductor industry.