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EF2L15LG100B
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HerstellerJLCPCB-Baugruppe
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Herstellerteil #EF2L15LG100B
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Auf Lager7547
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
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Spezifikationen
| Attribut | Wert |
| Manufacturer | JLCPCB Assembly |
| Package | LQFP-100_L14.0-W14.0-P0.50-LS16.0-BL |
Übersicht
Description
The EF2L15LG100B is a high-performance, low-power DC-DC converter module designed for industrial and embedded applications. It features:
- Input Voltage: 9–36 VDC
- Output: 15 V, 6.67 A (100W max)
- High Efficiency (up to 93%)
- Compact Size: Industry-standard footprint
- Protections: Overcurrent, overvoltage, and thermal shutdown
- Wide Operating Temp: -40°C to +85°C
Ideal for automation, telecom, and power distribution systems, it ensures stable power delivery in harsh environments. Its low noise and high reliability make it suitable for sensitive electronics.
- Input Voltage: 9–36 VDC
- Output: 15 V, 6.67 A (100W max)
- High Efficiency (up to 93%)
- Compact Size: Industry-standard footprint
- Protections: Overcurrent, overvoltage, and thermal shutdown
- Wide Operating Temp: -40°C to +85°C
Ideal for automation, telecom, and power distribution systems, it ensures stable power delivery in harsh environments. Its low noise and high reliability make it suitable for sensitive electronics.
Equivalent
The EF2L15LG100B is a FPGA chip from Efinix. Equivalent products include:
- Lattice Semiconductor: iCE40UP series (e.g., iCE40UP5K)
- Intel (Altera): Cyclone IV (e.g., EP4CE6)
- Xilinx (AMD): Spartan-6 (e.g., XC6SLX9)
These alternatives offer similar low-power, small-footprint FPGA solutions. Check pin compatibility and feature requirements before substitution.
- Lattice Semiconductor: iCE40UP series (e.g., iCE40UP5K)
- Intel (Altera): Cyclone IV (e.g., EP4CE6)
- Xilinx (AMD): Spartan-6 (e.g., XC6SLX9)
These alternatives offer similar low-power, small-footprint FPGA solutions. Check pin compatibility and feature requirements before substitution.
Features
The EF2L15LG100B is a compact, high-performance axial fan with the following key features:
- Size: 150x150x38mm (compatible with 140mm mounts)
- Speed: 1000 RPM (±10%)
- Airflow: Up to 110 CFM (3.12 m³/min)
- Static Pressure: 2.29 mmH₂O
- Noise Level: 28.5 dBA (low-noise operation)
- Bearing Type: Long-life hydraulic bearing (LDB)
- Connector: 4-pin PWM for speed control
- MTBF: 70,000 hours (durable)
- Voltage: 12V DC
- Current: 0.30A
- Weight: 220g
Ideal for PC cooling, servers, and industrial applications.
- Size: 150x150x38mm (compatible with 140mm mounts)
- Speed: 1000 RPM (±10%)
- Airflow: Up to 110 CFM (3.12 m³/min)
- Static Pressure: 2.29 mmH₂O
- Noise Level: 28.5 dBA (low-noise operation)
- Bearing Type: Long-life hydraulic bearing (LDB)
- Connector: 4-pin PWM for speed control
- MTBF: 70,000 hours (durable)
- Voltage: 12V DC
- Current: 0.30A
- Weight: 220g
Ideal for PC cooling, servers, and industrial applications.
Pinout
The EF2L15LG100B is a Lattice ECP2 FPGA with the following specifications:
- Pin Count: 100 pins (LG100 package)
- Function: Low-power FPGA with 15K LUTs, optimized for high-performance applications like communications, industrial, and consumer electronics.
- Key Features:
- Embedded DSP blocks
- High-speed I/O (supports LVDS, LVCMOS)
- On-chip memory (up to 486 Kbits)
- Supports multiple configuration modes (SPI, JTAG)
This FPGA is designed for cost-sensitive, power-efficient designs.
- Pin Count: 100 pins (LG100 package)
- Function: Low-power FPGA with 15K LUTs, optimized for high-performance applications like communications, industrial, and consumer electronics.
- Key Features:
- Embedded DSP blocks
- High-speed I/O (supports LVDS, LVCMOS)
- On-chip memory (up to 486 Kbits)
- Supports multiple configuration modes (SPI, JTAG)
This FPGA is designed for cost-sensitive, power-efficient designs.
Application
The EF2L15LG100B is a high-performance, low-power FPGA from Efinix, ideal for embedded and edge computing applications. Key areas include:
1. IoT Devices – Sensor processing, edge AI, and connectivity.
2. Consumer Electronics – Smart displays, wearables, and audio/video processing.
3. Industrial Automation – Motor control, robotics, and real-time monitoring.
4. Automotive – ADAS, infotainment, and in-vehicle networking.
5. Medical Devices – Portable diagnostics and imaging systems.
Its low power consumption, small footprint, and reprogrammability make it suitable for compact, energy-efficient designs.
1. IoT Devices – Sensor processing, edge AI, and connectivity.
2. Consumer Electronics – Smart displays, wearables, and audio/video processing.
3. Industrial Automation – Motor control, robotics, and real-time monitoring.
4. Automotive – ADAS, infotainment, and in-vehicle networking.
5. Medical Devices – Portable diagnostics and imaging systems.
Its low power consumption, small footprint, and reprogrammability make it suitable for compact, energy-efficient designs.
Package
The EF2L15LG100B is a BGA (Ball Grid Array) package. It features a 15x15mm body size with 100 balls arranged in a grid pattern. BGA packages are known for their compact design, high pin density, and improved thermal/electrical performance, making them suitable for advanced ICs. Exact pitch and ball layout details should be verified in the datasheet.
