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EP2AGX190FF35C4N
+StücklisteIC FPGA 612 I/O 1152FBGA
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HerstellerIntel
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Herstellerteil #EP2AGX190FF35C4N
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Paket FBGA-1152
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Auf Lager3833
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Arria II GX |
| ProductStatus | Obsolete |
| NumberofLABs/CLBs | 7612 |
| NumberofLogicElements/Cells | 181165 |
| TotalRAMBits | 10177536 |
| NumberofI/O | 612 |
| Voltage-Supply | 0.87V ~ 0.93V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 1152-BBGA, FCBGA |
Übersicht
Description
Key features of the EP2AGX190FF35C4N include:
1. Logic Elements: It contains approximately 190,000 logic elements, providing substantial computational capabilities for complex designs.
2. Transceivers: The device features multiple high-speed transceivers that enable efficient data transfer and communication.
3. I/O Pins: It supports numerous I/O pins, enhancing connectivity with other components and systems.
4. Memory Blocks: The FPGA includes embedded RAM blocks for efficient data storage and retrieval.
5. Low Power: Designed to reduce power consumption while maintaining high performance, making it suitable for power-sensitive applications.
The EP2AGX190FF35C4N is packaged in a 1152-pin FineLine BGA package, which supports high-density designs, offering a compact solution for demanding applications.
Equivalent
Features
1. Logic Elements: It contains approximately 190,000 logic elements, providing substantial capacity for complex designs.
2. Transceivers: Equipped with high-speed transceivers that support data rates up to 6.375 Gbps, ideal for high-bandwidth applications.
3. I/O Pins: It has numerous I/O pins, offering flexibility for various interfacing requirements.
4. Embedded Memory: The FPGA includes significant embedded memory resources, enhancing its capacity for data-intensive applications.
5. Digital Signal Processing (DSP): It has dedicated DSP blocks to efficiently handle signal processing tasks, making it suitable for applications like video and communication systems.
6. Power Efficiency: Built on a 40nm process technology, it offers improved power efficiency.
7. Package: Available in a 1152-pin FineLine BGA package, the FPGA is suitable for high-density applications.
This combination of features makes the EP2AGX190FF35C4N suitable for high-performance computing, signal processing, and communication applications.
Pinout
Key functions of the EP2AGX190FF35C4N include:
1. Transceivers: It supports multiple high-speed transceivers for high-bandwidth data transfer, suitable for applications like telecommunications and data centers.
2. Logic Elements: Contains a large number of logic elements that allow complex digital circuits and systems to be implemented.
3. DSP Capabilities: Integrated digital signal processing blocks for efficient handling of signal processing tasks.
4. Memory: Embedded memory blocks for data storage and management.
5. I/O Resources: Provides a variety of input/output options to interface with other components and systems.
These features make it suitable for high-performance applications requiring efficient processing and high data throughput.
Manufacturer
Intel is one of the largest and most influential tech companies globally, traditionally recognized for its dominance in the personal computer CPU market. Over the years, Intel has expanded its focus to include data centers, artificial intelligence, autonomous driving, and the Internet of Things (IoT), among other areas. The acquisition of Altera and its FPGA technology was part of Intel’s strategic move to diversify its product offerings and strengthen its position in these emerging markets. FPGAs like the EP2AGX190FF35C4N are used in various applications requiring customizable hardware logic, including telecommunications, automotive, industrial, and consumer electronics.
Application
1. Telecommunications: Used in signal processing, data transmission, and network infrastructure.
2. Data Centers: Optimizes data processing and manages high-speed data transfer.
3. Broadcast and Video Processing: Enhances video encoding, decoding, and streaming capabilities.
4. Industrial Automation: Supports advanced control systems and real-time data processing.
5. Military and Aerospace: Facilitates secure communications and complex computations.
6. Medical Imaging: Powers high-resolution imaging and diagnostic equipment.
Its versatility and programmable nature make it suitable for diverse, performance-intensive environments.