EP3C120F780C7N

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EP3C120F780C7N

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IC FPGA 531 I/O 780FBGA

  • HerstellerAltera

  • Herstellerteil #EP3C120F780C7N

  • Auf Lager3036

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Spezifikationen

Attribut Wert
Series Cyclone® III
PartStatus Active
BaseProductNumber EP3C120
DigiKeyProgrammable Not Verified
NumberofLABs/CLBs 7443
NumberofLogicElements/Cells 119088
TotalRAMBits 3981312
NumberofI/O 531
Voltage-Supply 1.15V ~ 1.25V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package 780-BGA
SupplierDevicePackage 780-FBGA (29x29)
Packaging Tray

Übersicht

Description

The EP3C120F780C7N is a member of Intel’s (formerly Altera) Cyclone III FPGA family. It features 119,088 logic elements (LEs), 3,888 Kbits of embedded memory (M9K blocks), and 398 user I/O pins. Built on a 65nm process, it balances performance and power efficiency, making it suitable for cost-sensitive, mid-range applications like industrial control, communications, and consumer electronics.
Key specs:
- Core voltage: 1.2V
- Package: 780-pin FineLine BGA (FBGA)
- Max internal clock: ~260 MHz
- DSP blocks: 288 (18x18 multipliers)
- On-chip PLLs: 4
The FPGA supports common interfaces (LVDS, DDR2) and is programmed via Altera’s Quartus II software. Its moderate logic density and low static power make it a practical choice for legacy designs or projects requiring a balance of resources and affordability.

Equivalent

The EP3C120F780C7N is a Cyclone III FPGA from Intel (formerly Altera). Equivalent alternatives include:
- Lattice ECP5 (e.g., LFE5UM-85F)
- Xilinx Spartan-6 (e.g., XC6SLX150T)
- Intel Cyclone IV (e.g., EP4CE115F29C7N)
These offer similar logic capacity and features. For exact replacements, check pin compatibility and specifications.

Features

The EP3C120F780C7N is an Altera Cyclone III FPGA with these key features:
- Logic Elements (LEs): 119,088
- Memory: 3,888 Kbits embedded RAM
- DSP Blocks: 288 (18x18 multipliers)
- Max User I/Os: 531 (supports LVDS, PCI, DDR interfaces)
- Clock Management: 4 PLLs for precise timing control
- Process Technology: 65nm low-power CMOS
- Package: 780-pin FineLine BGA (FBGA)
- Operating Voltage: 1.15V core, 3.3V/2.5V I/O
- Max Frequency: ~260 MHz (performance varies by design)
Ideal for embedded, industrial, and communications applications due to its balance of logic density, power efficiency, and cost.

Pinout

The EP3C120F780C7N is a Cyclone III FPGA from Intel (formerly Altera).
- Pin Count: 780 pins (F780 package)
- Key Functions:
- I/O Pins: 535 general-purpose I/O pins (supports LVDS, LVCMOS, and other standards).
- Power Pins: Multiple VCCINT (core), VCCIO (I/O bank), and GND pins.
- Configuration Pins: Dedicated pins for JTAG, AS, PS, and other configuration modes.
- Clock Pins: 8 dedicated global clock inputs.
- High-Speed Interfaces: Supports DDR2/DDR3 memory interfaces.
This FPGA features 119,088 logic elements (LEs), 3.9 Mb embedded RAM, and 288 DSP blocks, making it suitable for mid-range applications.

Manufacturer

The EP3C120F780C7N is a Cyclone III FPGA manufactured by Intel (formerly Altera).
Intel is a global leader in semiconductor technology, known for producing processors, FPGAs, and other integrated circuits. Altera, acquired by Intel in 2015, specialized in programmable logic devices like FPGAs and CPLDs.
The Cyclone III series is a cost-optimized FPGA family designed for low-power, high-performance applications in industrial, automotive, and consumer electronics.

Application

The EP3C120F780C7N, a Cyclone III FPGA by Intel (formerly Altera), is used in:
- Embedded Systems: For control and interfacing.
- Communications: In networking and signal processing.
- Industrial Automation: For motor control and monitoring.
- Consumer Electronics: In displays and multimedia.
- Military/Aerospace: For rugged, low-power applications.
- Medical Devices: In imaging and diagnostics.
Its low power, moderate logic density (~120K LEs), and cost-effectiveness make it suitable for mid-range applications.

Package

The EP3C120F780C7N is an FPGA from Intel's Cyclone III family. It comes in a 780-pin FineLine BGA (FBGA) package. This surface-mount package is designed for high-density applications, offering robust thermal and electrical performance. The "F780" in the part number indicates the 780-pin FBGA package type.

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