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EP3C16F256I7N
+StücklisteIC FPGA 168 I/O 256FBGA
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HerstellerIntel
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Herstellerteil #EP3C16F256I7N
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Paket FBGA-256
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Auf Lager1963
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Cyclone® III |
| ProductStatus | Active |
| NumberofLABs/CLBs | 963 |
| NumberofLogicElements/Cells | 15408 |
| TotalRAMBits | 516096 |
| NumberofI/O | 168 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 256-LBGA |
Übersicht
Description
Key specifications:
- Package: 256-pin FineLine BGA (FBGA)
- I/O Pins: 179 user I/Os
- Operating Voltage: 1.15V core, 3.3V/2.5V I/O
- Speed Grade: -7N (moderate performance)
- On-Chip PLLs: 4 for clock management
Applications include embedded systems, industrial control, and communications. It balances cost, power efficiency, and performance, supporting common interfaces like LVDS, DDR, and PCI.
For detailed use, refer to Intel’s Cyclone III Handbook and datasheets.
Equivalent
- Lattice ECP3 series (e.g., LFE3-16EA-8FN256C)
- Xilinx Spartan-6 (e.g., XC6SLX16-2FTG256C)
- Microsemi (Microchip) ProASIC3 (e.g., A3P600-FGG256)
These offer similar logic density (~15K LEs) and package compatibility (256-pin BGA). For exact replacements, verify specs like speed grade, I/O count, and power requirements.
Features
- Logic Elements (LEs): 15,408
- Memory: 504 Kbits embedded RAM
- DSP Blocks: 56 (18x18 multipliers)
- I/O Pins: 179 (supports LVDS, LVCMOS, PCI)
- Package: 256-pin FineLine BGA (FBGA)
- Speed Grade: -7 (moderate performance)
- Operating Voltage: 1.15V core, 1.2V–3.3V I/O
- Max User I/O: 153 (varies by configuration)
- On-Chip PLLs: 4
- Operating Temp: -40°C to 100°C (Industrial grade)
Ideal for cost-sensitive, low-power applications like industrial control and embedded systems.
Pinout
- Pin Count: 256 pins (FBGA package)
- Key Functions:
- Logic Elements (LEs): 15,408
- Memory: 504 Kbits embedded RAM
- PLLs: 4 phase-locked loops
- I/O Standards: Supports LVTTL, LVCMOS, LVDS, and others
- User I/Os: 179 (varies by configuration)
- On-Chip Features: DSP blocks, Nios II soft-core processor support
Designed for low-cost, low-power applications, it is commonly used in industrial, consumer, and automotive systems.
Application
- Embedded Systems: Custom logic and control.
- Industrial Automation: Motor control, PLCs.
- Consumer Electronics: Display controllers, multimedia.
- Communications: Signal processing, protocol bridging.
- Automotive: Infotainment, driver assistance.
- Medical Devices: Portable diagnostics, imaging.
Its low power, moderate logic capacity (~15K LEs), and 256-pin FBGA package make it ideal for cost-sensitive, mid-complexity designs.