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EP3C40F324I7N
+StücklisteIC FPGA 195 I/O 324FBGA
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HerstellerIntel
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Herstellerteil #EP3C40F324I7N
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Paket FBGA-324
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Auf Lager5632
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Cyclone® III |
| ProductStatus | Active |
| NumberofLABs/CLBs | 2475 |
| NumberofLogicElements/Cells | 39600 |
| TotalRAMBits | 1161216 |
| NumberofI/O | 195 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 324-BGA |
Übersicht
Description
Key characteristics include:
1. Architecture: It's based on a 65nm process technology, which provides a balance between power consumption and performance.
2. Logic Elements: It has 39,600 logic elements and 1,152 embedded memory (RAM) blocks for efficient data handling.
3. I/O Pins: The device includes 292 user I/O pins, offering versatile connectivity for various peripherals.
4. Power Efficiency: The Cyclone III series, including this model, is known for its low static and dynamic power consumption.
5. Package: The EP3C40F324I7N comes in a 324-pin FineLine BGA (Ball Grid Array) package.
This FPGA is ideal for applications requiring a balance of performance and low power, like automotive, communications, and consumer electronics.
Equivalent
1. Xilinx Spartan-6 series (e.g., XC6SLX40)
2. Lattice ECP3 series (e.g., LFE3-35EA)
3. Microsemi (Microchip) SmartFusion2 series (e.g., M2S050)
When choosing an equivalent, consider factors like logic elements, I/O count, power consumption, and package type to ensure compatibility with your application needs.
Features
1. Logic Elements: It contains 39,600 logic elements, enabling complex digital designs.
2. Embedded Memory: The FPGA has 1,161 Kbits of embedded memory for efficient data storage and retrieval.
3. I/O Pins: It provides 294 user I/O pins, offering flexibility for various interfacing needs.
4. PLL: The device includes 4 phase-locked loops (PLLs) for clock management and frequency synthesis.
5. Power: Designed with low power consumption, suitable for applications demanding energy efficiency.
6. Package: Available in a 324-pin FineLine BGA package, which supports high-density designs.
7. Speed Grade: The speed grade is -7, indicating its performance characteristics.
8. Temperature Range: It operates within a commercial temperature range, suitable for numerous environments.
These features make the EP3C40F324I7N suitable for a variety of applications, including consumer electronics, telecommunications, and industrial automation, where cost-effectiveness and performance are crucial.
Pinout
The key functions of the EP3C40F324I7N include:
1. Logic Elements: It contains a substantial number of logic elements (LEs) that can be configured for various digital logic functions.
2. Memory Blocks: Integrated memory blocks for data storage and processing.
3. Embedded Multipliers: Useful for DSP (Digital Signal Processing) applications.
4. Phase-Locked Loops (PLLs): For clock management and signal synchronization.
5. I/O Capabilities: Supports various I/O standards for interfacing with other components or systems.
6. Low Power Consumption: Designed for energy-efficient operation.
Overall, the EP3C40F324I7N is suitable for designs requiring moderate complexity, offering a good mix of performance, cost, and power efficiency.
Manufacturer
Intel's Programmable Solutions Group focuses on the development and production of field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and related products. These products are used in a wide range of applications, including communications, automotive, industrial, and consumer electronics, where customizable and reconfigurable hardware solutions are required. The EP3C40F324I7N is part of the Cyclone III series, which is known for its low power consumption and cost-effectiveness, making it suitable for various embedded systems and applications.
Application
1. Embedded Systems: Offers custom logic for embedded processors.
2. Digital Signal Processing: Efficient for operations requiring parallel processing.
3. Industrial Automation: Used for machine control and data acquisition.
4. Communications: Supports protocol implementation and data routing.
5. Consumer Electronics: Enables custom features in devices.
6. Automotive Systems: Used for infotainment and advanced driver-assistance systems (ADAS).
7. Medical Devices: Supports signal processing and control functions.
These areas benefit from its low power consumption, high performance, and versatility.