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EP3SL200F1152C4G
+StücklisteIC FPGA 744 I/O 1152FBGA
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HerstellerIntel
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Herstellerteil #EP3SL200F1152C4G
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Auf Lager4432
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Spezifikationen
| Attribut | Wert |
| Supplier | Intel |
| Package | Tray |
| ProductStatus | Active |
Übersicht
Description
Features
- 200K logic elements
- 1152 user I/O pins (FBGA1152)
- On-chip memory via M9K blocks (9K-bit each)
- DSP/multiply-accumulate capability
- Clocking resources with PLLs and multiple clock networks
- 3.3V I/O banks with a lower-voltage core
- In-system configuration options (e.g., EPCS/AS interfaces)
- Power efficiency (suitable for low-power designs)
- Industrial temperature range (-40°C to 85°C)
This device targets mid-density, cost-efficient designs requiring lots of I/O and integrated RAM/DSP functionality. For exact block counts, RAM size, and timing specs, please refer to the official datasheet.
Pinout
Function: Lattice ECP3SL FPGA device (EP3SL200) with ~200K logic elements, used as a programmable logic device with I/O, DSP, and transceiver capabilities.
Manufacturer
- What kind of company: A fabless semiconductor company that designs and markets programmable logic devices (FPGA and CPLD families) and related software/IP, serving global customers.
Application
- High-end networking: switches, routers, line cards, PCIe endpoints
- Data processing and acceleration: DPI/encryption, packet processing, protocol offload
- Video, imaging and DSP: real-time video pipelines, HDTV/4K processing
- Embedded control and instrumentation: industrial automation, automotive, aerospace electronics
- Test, measurement and defense: radar, SIGINT/ELINT, instrumentation front-ends
- Scientific and medical devices requiring parallel processing and high I/O