EP3SL200F1152C4G

Abbildungen dienen nur als Referenz

EP3SL200F1152C4G

+Stückliste

IC FPGA 744 I/O 1152FBGA

  • HerstellerIntel

  • Herstellerteil #EP3SL200F1152C4G

  • Auf Lager4432

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Supplier Intel
Package Tray
ProductStatus Active

Übersicht

Description

EP3SL200F1152C4G is an Altera/Intel Cyclone III FPGA in the EP3SL family. It’s a mid‑size, low‑cost FPGA intended for power- and area‑sensitive designs. The “200” suggests about 200k logic elements, and the part comes in an FBGA1152 package (1152 balls). Features typically include embedded memory blocks (M9K), DSP blocks, PLLs, and multiple I/O banks for various interfaces. It’s a programmable logic device suitable for implementing custom logic, state machines, memory controllers, and simple DSP pipelines in cost-conscious applications such as consumer electronics, automation, and embedded control. Design and programming are done with Intel Quartus Prime software (and related tooling). For exact resources and IO capabilities, refer to the Cyclone III device handbook and the specific package/pinout for this part.

Features

EP3SL200F1152C4G is an Altera (Intel) Cyclone III FPGA in an FBGA1152 package. Key features include:
- 200K logic elements
- 1152 user I/O pins (FBGA1152)
- On-chip memory via M9K blocks (9K-bit each)
- DSP/multiply-accumulate capability
- Clocking resources with PLLs and multiple clock networks
- 3.3V I/O banks with a lower-voltage core
- In-system configuration options (e.g., EPCS/AS interfaces)
- Power efficiency (suitable for low-power designs)
- Industrial temperature range (-40°C to 85°C)
This device targets mid-density, cost-efficient designs requiring lots of I/O and integrated RAM/DSP functionality. For exact block counts, RAM size, and timing specs, please refer to the official datasheet.

Pinout

Pin count: 1152 pins (FineLine BGA, 1152-ball package).
Function: Lattice ECP3SL FPGA device (EP3SL200) with ~200K logic elements, used as a programmable logic device with I/O, DSP, and transceiver capabilities.

Manufacturer

- Manufacturer: Lattice Semiconductor Corporation (Lattice)
- What kind of company: A fabless semiconductor company that designs and markets programmable logic devices (FPGA and CPLD families) and related software/IP, serving global customers.

Application

EP3SL200F1152C4G is a high-density Stratix III FPGA. Common application areas include:
- High-end networking: switches, routers, line cards, PCIe endpoints
- Data processing and acceleration: DPI/encryption, packet processing, protocol offload
- Video, imaging and DSP: real-time video pipelines, HDTV/4K processing
- Embedded control and instrumentation: industrial automation, automotive, aerospace electronics
- Test, measurement and defense: radar, SIGINT/ELINT, instrumentation front-ends
- Scientific and medical devices requiring parallel processing and high I/O

Package

FBGA (FineLine Ball Grid Array) package – 1152-ball variant (EP3SL200F1152C4G).

Produkte, die mit EP3SL200F1152C4G zusammenhängen