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EP4CGX75DF27C8N
+StücklisteIC FPGA 310 I/O 672FBGA
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HerstellerIntel
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Herstellerteil #EP4CGX75DF27C8N
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Paket FBGA-672
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Auf Lager2584
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Cyclone® IV GX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 4620 |
| NumberofLogicElements/Cells | 73920 |
| TotalRAMBits | 4257792 |
| NumberofI/O | 310 |
| Voltage-Supply | 1.16V ~ 1.24V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 672-BGA |
Übersicht
Description
Key features of the EP4CGX75DF27C8N include embedded memory blocks, dedicated multipliers for DSP applications, and high-speed differential I/O capabilities. It supports various interface standards and is equipped with PLLs (Phase-Locked Loops) for clock management, allowing for precise control over data timing and synchronization.
This FPGA is packaged in a 484-pin FineLine BGA (Ball Grid Array), supporting efficient heat dissipation and ease of integration into compact designs. It is well-suited for applications in wireless communication, automotive systems, and video processing, among others. The Cyclone IV FPGAs are known for their cost-effectiveness, making them a popular choice for developers needing reliable performance without high power consumption.
Equivalent
1. Xilinx Spartan-6 series, specifically the XC6SLX75.
2. Lattice ECP3 series, such as the LFE3-70E.
3. Microsemi (Microchip) SmartFusion2 series, similar to M2S050.
These alternatives match the FPGA's general performance and application scope, but specific equivalency should consider individual design requirements and feature sets.
Features
1. Logic Elements (LEs): It contains around 75,000 logic elements, providing ample resources for complex designs.
2. Memory: The FPGA includes on-chip memory blocks for data storage and processing, featuring numerous kilobits of embedded memory.
3. Transceivers: It is equipped with multiple high-speed transceivers, supporting data rates up to 3.125 Gbps, ideal for communications and networking applications.
4. I/O Pins: The device offers a variety of user I/O pins, enabling interfacing with external components and systems.
5. Power Efficiency: Designed for low power consumption, making it suitable for portable and energy-sensitive applications.
6. Package: The FPGA is available in a 484-pin FineLine BGA package, ensuring a compact form factor for space-constrained designs.
7. Development Support: Supported by Intel's Quartus Prime software for design, simulation, and programming, facilitating efficient development workflows.
These features make the EP4CGX75DF27C8N suitable for applications in telecommunications, automotive, industrial, and consumer electronics.
Pinout
Manufacturer
Intel's product portfolio includes microprocessors, integrated graphics solutions, FPGAs, memory and storage solutions, and other related hardware. The company is a leader in the semiconductor industry, often recognized for its innovation and contributions to the advancement of computing technology. Intel's products are widely used in various applications, ranging from consumer electronics to data centers, telecommunications, and industrial systems. Through its acquisition of Altera in 2015, Intel expanded its capabilities in the FPGA market, which has become a significant component of its operations.